ISP3010-UX-ST

ISP3010 Data Sheet Built-in Antennas Smart Module Ultra-Wide Band and Bluetooth Low Energy This highly miniaturized LGA module, 14 x 14 x 1.5 mm, is based on the DW1000 UWB transceiver and nRF52832 BLE chip. Using a simple user interface via the SPI connection and integrating a Cortex™ M4 CPU, flash and RAM memory combined with optimized antennas, ISP3010 offers the perfect stand-alone ranging module solution for security bubble applications. For longer range applications, ISP3010 can be used in conjunction with an external UWB antenna. Key Features ▪ IEEE802.15.4-2011 UWB compliant ▪ Single Mode BLE 5 Ready ▪ NFC-A Tag for OOB pairing ▪ Spatial resolution better than 10 cm ▪ Fully integrated UWB & BLE matching and Antennas ▪ Integrated UWB 38.4 MHz and BLE 32 MHz & 32.768 kHz Clocks Applications ▪ DC/DC converters ▪ Precision Real Time Location Systems (RTLS) for Healthcare, Sport and Wellness, Consumer, Industrial … ▪ UWB section based on DecaWave DW1000 ▪ Security bubble ▪ BLE section based on Nordic Semi nRF52 ▪ UWB application controlled by the embedded 32-bit ARM Cortex M4F CPU ▪ Access control ▪ 512 kB Flash and 64 kB SRAM Pending Certifications ▪ Analog and Digital peripherals ▪ Indoor positioning ▪ SPI interface ▪ Fully FCC certified module ▪ Supply Voltage 3.2 V to 6.0 V ▪ Fully CE certified module ▪ Very small size 14.0 x 14.0 x 1.5 mm ▪ Fully IC certified module ▪ Temperature -40 to +85 °C ▪ Bluetooth SIG certified QDL listing ▪ RoHS compliant www.insightsip.com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission. Specification subject to change without notice. Document reference isp_uwb_DS3010_R4.docx Page 1/26 ISP3010 Data Sheet Contents 1. Block Diagram ............................................................................................................................................................ 3 2. 2.1. 2.2. 2.3. 2.4. 2.5. 2.6. 2.7. Specifications ............................................................................................................................................................. 4 General Notice ................................................................................................................................................. 4 Absolute Maximum Ratings .............................................................................................................................. 4 Operating Conditions........................................................................................................................................ 4 Current Consumption ....................................................................................................................................... 5 Clock Sources .................................................................................................................................................. 5 Radio Specifications ......................................................................................................................................... 6 Electrical Schematic ......................................................................................................................................... 8 3. Pin Description ......................................................................................................................................................... 10 4. 4.1. 4.2. 4.3. Mechanical Outlines................................................................................................................................................. 12 Mechanical Dimensions ................................................................................................................................. 12 SMT Assembly Guidelines ............................................................................................................................. 14 Antenna Keep-Out Zone ................................................................................................................................ 14 5. 5.1. 5.2. 5.3. Product Development Tools ................................................................................................................................... 15 Hardware........................................................................................................................................................ 15 Firmware ........................................................................................................................................................ 15 Development Tools ........................................................................................................................................ 16 6. 6.1. 6.2. Reference Design ..................................................................................................................................................... 17 Anchor Board Design ..................................................................................................................................... 17 Tag Board Design .......................................................................................................................................... 19 7. 7.1. 7.2. 7.3. 7.4. Packaging & Ordering information ........................................................................................................................ 20 Marking .......................................................................................................................................................... 20 Prototype Packaging ...................................................................................................................................... 20 Jedec Trays .................................................................................................................................................... 20 Ordering Information ...................................................................................................................................... 21 8. 8.1. 8.2. 8.3. Storage & Soldering information ........................................................................................................................... 22 Storage and Handling..................................................................................................................................... 22 Moisture Sensitivity ........................................................................................................................................ 22 Soldering information ..................................................................................................................................... 23 9. 9.1. 9.2. 9.3. 9.4. 9.5. 9.6. 9.7. Quality & User information...................................................................................................................................... 24 Pending Certifications .................................................................................................................................... 24 USA – User information .................................................................................................................................. 24 Canada – User information ............................................................................................................................ 24 RF Exposure Information ............................................................................................................................... 25 Informations concernant l'exposition aux fréquences radio (RF) .................................................................... 25 Discontinuity ................................................................................................................................................... 25 Disclaimer....................................................................................................................................................... 26 www.insightsip.com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission. Specification subject to change without notice. Document reference isp_uwb_DS3010_R4.docx Page 2/26 ISP3010 Data Sheet 1. Block Diagram This module is based on DecaWave DW1000 single-chip UWB transceiver and nRF52832 Nordic Semiconductor 2.4GHz wireless System on Chip (SoC). It integrates a 32-bit ARM Cortex™ M4 CPU, 512 kB flash memory, 64 kB RAM as well as analog and digital peripherals. Despite the small size of 14.0 x 14.0 x 1.5 mm, the module integrates decoupling capacitors, 38.4 MHz crystal for UWB, 32 MHz and 32.768 kHz crystals for BLE, DC-DC converters, DC pulse power adapter for UWB, RF matching circuits and two antennas in addition to the wireless SoCs. UWB communication is compliant to IEEE802.15.4. Using a simple user interface controlled over the air by Bluetooth, ISP3010 offers the perfect stand-alone ranging module solution for security bubble applications and up to 50 meters ranging applications. For longer range applications with typically few hundred meters distance, ISP3010 can be used in conjunction with an external UWB antenna. BLE connectivity compliant with Bluetooth 5 Ready. ISP3010 BLE section can be used either in Peripheral or Central roles for BLE. Fully qualified BLE stacks for nRF52832 are implemented in the S132 SoftDevice which can be downloaded at no cost. www.insightsip.com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission. Specification subject to change without notice. Document reference isp_uwb_DS3010_R4.docx Page 3/26 ISP3010 Data Sheet 2. Specifications 2.1. General Notice The electrical specifications of the module are directly related to the Nordic Semiconductor specifications for nRF52 chipset series and the Decawave specifications for DW1000 chipset. Bellow information is only a summary of the main parameters. For more detailed information, especially about current consumption, please refer to the up-to-date specification of the chipset available on Nordic Semi and Decawave websites. 2.2. Absolute Maximum Ratings Parameter Min Supply Voltage VIN Supply Voltage VDDIO IO Pins P0.xx, GPIOx, SPICLK, SPIMISO, SPIMOSI, SPICS, SRESET, WAKEUP UWB RF Input Level BLE RF Input Level NFC Antenna pin current Storage Temperature Moisture Sensitivity Level Flash Endurance Typ Max Unit -0.3 -0.3 3.9 4.0 V V -0.3 3.6 V 0 10 80 +85 5 10000 dBm dBm mA °C cycles -40 ATTENTION CONSERVE PRECAUTION FOR HANDLING ELECTROSTATIC SENSITIVE DEVICES Human Body Model Class 3A 2.3. Operating Conditions Parameter Min Typ Max Unit Operating Supply Voltage VIN Operating Supply Voltage VDDIO (used during programming of calibration settings in DW1000 OTP) Operating Input Voltage IO Pins P0.xx Operating Input Voltage IO Pins GPIOx Operating Temperature Range 3.2 3.3 6.0 V 3.7 3.8 3.9 V +25 3.3 3.3 +85 V V °C www.insightsip.com -0.3 -0.3 -30 The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission. Specification subject to change without notice. Document reference isp_uwb_DS3010_R4.docx Page 4/26 ISP3010 Data Sheet 2.4. Current Consumption Parameter Min Typ Max Unit UWB receiver 180 mA UWB transmitter 140 mA UWB idle mode 18 mA UWB sleep mode 1 µA 100 nA UWB deep sleep mode BLE Peak current, Receiver active (1) 6.1 mA (2) 7.9 mA BLE Peak current, Transmitter active 0 dBm Output Power (2) 5.4 mA CPU System OFF current, no RAM retention 0.7 µA CPU System ON base current, full RAM retention 1.5 µA CPU Additional RAM retention current per 4 KB block 40 N nA Typ Max Unit Internal High Frequency Clock for RF Stability: 38.4 MHz Crystal Frequency Tolerance (1) ± 30 ppm Internal High Frequency Clock for RF Stability: 32 MHz Crystal Frequency Tolerance (1) ± 40 ppm Internal Low Frequency Clock for BLE Synchronization: 32.768 kHz Crystal Frequency Tolerance (1) ± 40 ppm Internal Low Frequency Clock for BLE Synchronization: RC Oscillator (2) ± 250 ppm RF Frequency tolerance: For UWB operation Channel 5 ± 30 ppm RF Frequency tolerance: For BLE operation Channels 0 to 39 ± 40 ppm BLE Peak current, Transmitter active +4 dBm Output Power (1) (2) DC-DC enabled, Power supply 3V, 1 Msps DC-DC enabled, Power supply 3V 2.5. Clock Sources Parameter (1) (2) Min Including initial tolerance, drift, aging, and frequency pulling Frequency tolerance after calibration www.insightsip.com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission. Specification subject to change without notice. Document reference isp_uwb_DS3010_R4.docx Page 5/26 ISP3010 Data Sheet 2.6. Radio Specifications This ISP3010 module is designed to operate within the UWB Channel 5. Specifications and certifications are related to this operating mode only. When using with other Channels, the internal antenna cannot operate properly anymore, and an external antenna will be required. In such a case, specifications described hereafter and module certifications are not valid anymore. Parameter Min Typ Max Unit UWB channel 5 center frequency 6489.6 MHz UWB channel bandwidth 499.2 MHz UWB Input at 1dB compression point -39 dBm UWB Rx sensitivity Level for BER