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BTR9S23A10-MS

BTR9S23A10-MS

  • 厂商:

    MSKSEMI(美森科)

  • 封装:

    SOD923

  • 描述:

    BTR9S23A10-MS

  • 数据手册
  • 价格&库存
BTR9S23A10-MS 数据手册
www.msksemi.com BTR9S23A10-MS Semiconductor Compiance SOD-923 ◇ ◇ ◇ ◇ ◇ ◇ ◇ Bi-Directional Transient Voltage Suppressor Low capacitance and Low Leakage ESD Protection, IEC61000-4-2 Level 4 SOD923 SMD RoHS compliant UL-94 V-0 / Green EMC Matte Tin Lead finish (Pb-Free) Ordering Information P/N BTR9S23A10-MS Package Shipping SOD923 Tape & Reel 8000pcs /7” Reel Tape wide Emboss pitch Tape specification 8 mm 2 mm Conductive Notes Absolute Maximum Ratings (Ta = 25 ℃) Symbol IPP *1 Parameter Units 5.0 A ESD Voltage IEC61000-4-2 Air ±15 kV ESD Voltage IEC61000-4-2 Contact ±8 kV Junction Temperature 150 ℃ Storage Temperature -55 to +150 ℃ 150 mW Maximum Reverse Peak Pulse Current VESD-Air VESD-contact TJ TSTG PD *1 t P Value Power Dissipation =8/20μs Electrical Characteristics (Ta = 25 ℃) Symbol Parameter Conditions VRWM Reverse Working Peak Voltage - VBR Reverse Breakdown Voltage Pin 1 to 2 IT = 1mA IR Reverse Current VRWM = ±5V CD Diode Capacitance VR = 0V, f = 1MHz Min Typ 5.6 13 Max Units 5.0 V 8.2 V 1.0 μA pF www.msksemi.com BTR9S23A10-MS Semiconductor Compiance Electrical Parameter Symbol Parameter IPP Maximum Reverse Peak Pulse Current VC Clamping Voltage @ IPP VRWM IR Working Peak Reverse Voltage Maximum Reverse Leakage Current @ VRWM IT Test Current VBR Breakdown Voltage @ IT FIG1: Pulse Waveform FIG2:Power Derating www.msksemi.com BTR9S23A10-MS Semiconductor Compiance PACKAGE MECHANICAL DATA Dim Millimeters Inches Min Nom Max Min Nom Max A 0.36 0.40 0.43 0.014 0.016 0.017 b 0.15 0.20 0.25 0.006 0.008 0.010 c 0.07 0.12 0.17 0.003 0.005 0.007 D 0.75 0.80 0.85 0.030 0.031 0.033 E 0.55 0.60 0.65 0.022 0.024 0.026 HE 0.95 1.00 1.05 0.037 0.039 0.041 L 0.05 0.10 0.15 0.002 0.004 0.006 Dimensions: Millimeters REEL SPECIFICATION P/N BTR9S23A10-MS PKG SOD-923 QTY 8000 www.msksemi.com BTR9S23A10-MS Semiconductor Compiance Attention ■ Any and all MSKSEMI Semiconductor products described or contained herein do not have specifications that can handle applications that require extremely high levels of reliability, such as life-support systems, aircraft's control systems, or other applications whose failure can be reasonably expected to result in serious physical and/or material damage. Consult with your MSKSEMI Semiconductor representative nearest you before using any MSKSEMI Semiconductor products described or contained herein in such applications. ■ MSKSEMI Semiconductor assumes no responsibility for equipment failures that result from using products at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or other parameters) listed in products specificationsof any andall MSKSEMI Semiconductor products described orcontained herein. ■ Specifications of any and all MSKSEMI Semiconductor products described or contained herein stipulate the performance, characteristics, and functions of the described products in the independent state, and are not guarantees of the performance, characteristics, and functions of the described products as mounted in the customer’s products or equipment. To verify symptoms and states that cannot be evaluated in an independent device, the customer should always evaluate and test devices mounted in the customer’sproducts orequipment. ■ MSKSEMI Semiconductor. strives to supply high-quality high-reliability products. However, any and all semiconductor products fail with someprobability. It is possiblethat these probabilistic failures could give rise to accidents or events that could endanger human lives, that could give rise to smoke or fire, or that could cause damage to other property. When designing equipment, adopt safety measures so that these kinds of accidents or events cannot occur. Such measures include but are not limited to protective circuits anderror prevention circuitsfor safedesign, redundant design, and structural design. ■ In the event that any or all MSKSEMI Semiconductor products(including technical data, services) described or contained herein are controlled under any of applicable local export control laws and regulations, such products must not be exported without obtaining the export license from theauthorities concerned in accordance with the above law. ■ No part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopying and recording, or any information storage or retrieval system, or otherwise, without the prior written permission of MSKSEMI Semiconductor. ■ Information (including circuit diagrams and circuit parameters) herein is for example only ; it is not guaranteed for volume production. MSKSEMI Semiconductor believes information herein is accurate and reliable, but no guarantees are made or implied regarding its use or any infringementsof intellectual property rights or other rightsof third parties. ■ Any and all information described or contained herein are subject to change without notice due to product/technology improvement, etc. Whendesigning equipment, referto the "Delivery Specification" for the MSKSEMI Semiconductor productthat you intend to use. www.msksemi.com
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