BZT52C2V4 THRU BZT52C43 SOD-123
Zener Diodes
■ Simplified outline(SOD-123)
■ Features
Top View
● Planar Die Construction
● 500mW Power Dissipation on Ceramic PCB
● General Purpose, Medium Current
● Ideally Suited for Automated Assembly Processes
● Available in Lead Free Version
■ Absolute Maximum Ratings Ta = 25℃
Characteristic
Forward Voltage (Note 2)
@ IF = 10mA
Symbol
Value
VF
Unit
PD
0.9
500
Thermal Resistance from Junction to Ambient
RθJA
357
Junction Temperature
TJ
150
℃ /W
℃
Storage Temperature
TSTG
-55~+150
℃
Power Dissipation(Note 1)
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V
mW
Dongguan YFW Electronics Co, Ltd.
BZT52C2V4 THRU BZT52C43 SOD-123
■ Electrical Characteristics Ta = 25℃
Type
Type
Number
Code
Zener Voltage Range (Note 2)
Maximum
Typical
Maximum Zener Impedance
Reverse
Temperature
(Note 3)
Current
Coefficent
@IZTC
(Note 2)
VZ@IZT
IZT
Nom(V)
Min(V)
Max(V)
mA
ZZT@IZT
ZZK@IZK
Ω
Test
Current
IZTC
IZK
IR
VR
mV/°C
mA
uA
V
Min
Max
mA
BZT52C2V4
WX
2.4
2.20
2.60
5
100
600
1.0
50
1.0
-3.5
0
5
BZT52C2V7
W1
2.7
2.5
2.9
5
100
600
1.0
20
1.0
-3.5
0
5
BZT52C3V0
W2
3.0
2.8
3.2
5
95
600
1.0
10
1.0
-3.5
0
5
BZT52C3V3
W3
3.3
3.1
3.5
5
95
600
1.0
5
1.0
-3.5
0
5
BZT52C3V6
W4
3.6
3.4
3.8
5
90
600
1.0
5
1.0
-3.5
0
5
BZT52C3V9
W5
3.9
3.7
4.1
5
90
600
1.0
3
1.0
-3.5
0
5
BZT52C4V3
W6
4.3
4.0
4.6
5
90
600
1.0
3
1.0
-3.5
0
5
BZT52C4V7
W7
4.7
4.4
5.0
5
80
500
1.0
3
2.0
-3.5
0.2
5
BZT52C5V1
W8
5.1
4.8
5.4
5
60
480
1.0
2
2.0
-2.7
1.2
5
BZT52C5V6
W9
5.6
5.2
6.0
5
40
400
1.0
1
2.0
-2.0
2.5
5
BZT52C6V2
WA
6.2
5.8
6.6
5
10
150
1.0
3
4.0
0.4
3.7
5
BZT52C6V8
WB
6.8
6.4
7.2
5
15
80
1.0
2
4.0
1.2
4.5
5
BZT52C7V5
WC
7.5
7.0
7.9
5
15
80
1.0
1
5.0
2.5
5.3
5
BZT52C8V2
WD
8.2
7.7
8.7
5
15
80
1.0
0.7
5.0
3.2
6.2
5
BZT52C9V1
WE
9.1
8.5
9.6
5
15
100
1.0
0.5
6.0
3.8
7.0
5
BZT52C10
WF
10
9.4
10.6
5
20
150
1.0
0.2
7.0
4.5
8.0
5
BZT52C11
WG
11
10.4
11.6
5
20
150
1.0
0.1
8.0
5.4
9.0
5
BZT52C12
WH
12
11.4
12.7
5
25
150
1.0
0.1
8.0
6.0
10.0
5
BZT52C13
WI
13
12.4
14.1
5
30
170
1.0
0.1
8.0
7.0
11.0
5
BZT52C15
WJ
15
13.8
15.6
5
30
200
1.0
0.1
10.5
9.2
13.0
5
BZT52C16
WK
16
15.3
17.1
5
40
200
1.0
0.1
11.2
10.4
14.0
5
BZT52C18
WL
18
16.8
19.1
5
45
225
1.0
0.1
12.6
12.4
16.0
5
BZT52C20
WM
20
18.8
21.2
5
55
225
1.0
0.1
14.0
14.4
18.0
5
BZT52C22
WN
22
20.8
23.3
5
55
250
1.0
0.1
15.4
16.4
20.0
5
BZT52C24
WO
24
22.8
25.6
5
70
250
1.0
0.1
16.8
18.4
22.0
5
BZT52C27
WP
27
25.1
28.9
2
80
300
0.5
0.1
18.9
21.4
25.3
2
BZT52C30
WQ
30
28.0
32.0
2
80
300
0.5
0.1
21.0
24.4
29.4
2
BZT52C33
WR
33
31.0
35.0
2
80
325
0.5
0.1
23.1
27.4
33.4
2
BZT52C36
WS
36
34.0
38.0
2
90
350
0.5
0.1
25.2
30.4
37.4
2
BZT52C39
WT
39
37.0
41.0
2
130
350
0.5
0.1
27.3
33.4
41.2
2
BZT52C43
WU
43
40.0
46.0
5
100
700
1.0
0.1
32
10.0
12.0
5
Notes: 1. Device mounted on ceramic PCB: 7.6mm x 9.4mm x 0.87mm with pad areas 25mm
2
2. Short duration test pulse used to minimize self-heating effect
3. f=1kHZ
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Dongguan YFW Electronics Co, Ltd.
BZT52C2V4 THRU BZT52C43 SOD-123
Ƶ Typical Characterisitics
100
Ta =25℃
PD =350mW
Pulsed
1
43
39
36
33
27
30
22
24
15
20
10
18
10
15
10
9.1
8.2
7.5
6.2
6.8
5.6
4.7
2.4
5.1
10
PD =350mW
11
12
13
IZ, ZENER CURRENT (mA)
Pulsed
16
Ta =25℃
IZ, ZENER CURRENT (mA)
Zener Characteristics(11 V to 43 V)
Zener Characteristics(VZ Up to 10 V)
100
1
0.5
1
2
3
4
5
6
7
8
9
10
11
20
VZ, ZENER VOLTAGE (V)
Temperature Coefficients
30
35
40
50
Pulsed
TYPICAL Ta VALUES
35
45
Typical Leakage Current
100
FOR BZT52CXXX SERIES
10
30
IR, LEAKAGE CURRENT (uA)
θVZ, TEMPERATURE COEFFICIENT (mV/℃)
40
25
VZ, ZENER VOLTAGE (V)
25
20
VZ @ IZT
15
10
5
1
0.1
0.01
Ta=100℃
1E-3
0
Ta=25℃
-5
1E-4
0
4
8
12
16
20
24
28
32
36
40
44
0
5
VZ, NOMINAL ZENER VOLTAGE (V)
10
15
20
25
35
40
45
Effect of Zener Voltage on Zener Impedance
Typical Capacitance
1000
1000
Ta=25℃
Ta=25℃
f=1MHz
ZZT, DYNAMIC IMPEDANCE(Ω)
100
1V BIAS
BIAS AT
50% OF VZ NOM
10
IZ(AC)=0.1IZ(DC)
IZ=1mA
0V BIAS
C, CAPACITANCE (pF)
30
VZ, NOMINAL ZENER VOLTAGE (V)
1
f=1kHz
100
IZ=5mA
10
1
1
10
1
100
VZ, NOMINAL ZENER VOLTAGE (V)
10
100
VZ, NOMINAL ZENER VOLTAGE (V)
Power Derating Curve
400
POWER DISSIPATION
PD
(mW)
350
300
250
200
150
100
50
0
0
25
50
75
AMBIENT TEMPERATURE
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100
T
125
150
(℃ )
3/4
Dongguan YFW Electronics Co, Ltd.
BZT52C2V4 THRU BZT52C43 SOD-123
SOD-123
Package Outline
Plastic surface mounted package; 2 leads
A
D
b
E
A1
C
∠ALL ROUND
L1
E1
A
C
D
E
E1
L1
b
A1
max
1.3
0.22
1.8
2.8
3.9
0.45
0.7
0.2
min
0.9
0.09
1.5
2.5
3.6
0.25
0.5
max
51
8.7
71
110
154
18
28
min
35
3.5
59
98
142
10
20
UNIT
∠
mm
9°
8
mil
The recommended mounting pad size
2.0
(79)
1.2
(47)
1.2
(47)
1.2
(47)
Unit: mm
(mil)
Summary of Packing Options
Package
SOD-123
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Packing Description
Packing Quantity
Industry Standard
Tape/Reel,7”reel
3000
EIA-481-1
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Dongguan YFW Electronics Co, Ltd.
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