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Technical Data Sheet LOCTITE MP 218 September-2016 PRODUCT DESCRIPTION LOCTITE MP 218 provides the characteristics: Technology Application following product Solder paste Sn/Pb soldering LOCTITE MP 218 solder paste is a halide-free, no clean, pin testable solder paste, which has excellent humidity resistance and a broad process window, both for reflow and printing. LOCTITE MP 218 has high tack force to resist component movement during high speed placement, long printer abandon times and excellent solderability over a wide range of reflow profiles in air and nitrogen and across a wide range of surface finishes including HASL, Ni/Au, Immersion Sn, Immersion Ag and OSP copper. FEATURES AND BENEFITS ● Outstanding humidity resistance - gives excellent coalescence even after 24 hours exposure to 75% RH, thus reducing process variation due to environmental conditions ● Colorless residues for easy post-reflow inspection ● Soft, non-stick, pin testable residues allow easy in-circuit testing ● Suitable for fine pitch, high speed printing up to 150mm/s (6"/s) ● Extended open time and tack life leading to low wastage. ● Halide free flux classification: ROL0 to ANSI/J-STD-004 (Jan. 1995) TYPICAL PROPERTIES Based on Type 3 powder Solder Paste Typical Properties Alloys Powder Particle Size, µm Powder Size Coding IPC Equivalent Metal Loading (Weight %) Slump J-STD-005, mm RT, 15 minutes 0.33 x 2.03 mm pads 0.63 x 2.03 mm pads 150°C, 15 minutes 0.33 x 2.03 mm pads 0.63 x 2.03 mm pads Sn62, SN63 25-45 AGS Type 3 89.5% and 90% IPC A21 Pattern 0.08 0.33 0.1 0.33 Brookfield Viscosity TF spindle, 25°C, 89.5% metal 5rpm after 2 minutes, mPa∙s 90% metal Thixotropic Index (TI), 25°C 89.5% metal (1.8/18 s-1 ) 90% metal Malcom Rheology, 25°C 89.5% metal Shear rate 6 s-1 90% metal Initial tack force, gF 126 Useful open time, hours >24 850,000 950,000 0.43 0.52 2,140 2,170 Based on Type 4 powder Solder Paste Typical Properties Alloys Powder Particle Size, µm Powder Size Coding IPC Equivalent Metal Loading (Weight %) Brookfield Viscosity @ 25ºC, mPa.s Spindle TF, Speed 5 rpm, 2 minutes Thixotropic Index (Ti) Ti = log (1.8/18 s-1) Malcom Viscosity @ 25ºC, Pa.s @ Shear Rate of 6 s-1 Sn62, Sn63 38-20 DAP Type 4 89.5 840,000 0.54 1,900 63S4 ANTI-TOMBSTONING ALLOY 63S4 alloy offers an instant solution where tombstoning is a particular process problem. 63S4 alloy is a blend of different melting point alloys with a special mix of solder particle sizes. This modification extends the melting range of the alloy reducing the possibility that one solder deposit at a component termination can fully reflow before the other. Solder Paste Typical Properties Alloys 63S4 Powder Size Coding ACP Metal Loading (Weight %) 89.5% metal IPC A21 Pattern Slump, J-STD-005, mm RT, 15 minutes 0.08 0.33 x 2.03 mm pads 0.33 0.63 x 2.03 mm pads 150°C, 15 minutes 0.1 0.33 x 2.03 mm pads 0.33 0.63 x 2.03 mm pads Brookfield Viscosity TF spindle, 25°C, 850,000 5rpm after 2 minutes, mPa∙s Thixotropic Index (Ti) @ 25 °C 0.43 Ti = log (1.8/18 s-1) Malcom Rheology @ 25ºC, Pa.s 2,140 @ Shear Rate of 6 s-1 , Speed 10 rpm Initial tack force, gF 126 Useful open time, hours >24 Solder Powder: Careful control of the atomisation process for production of solder powders for LOCTITE MP 218 solder pastes ensures that the solder powder is produced to a quality level that exceeds IPC/J-STD-006 & EN29453 requirements for sphericity, size distribution, impurities and oxide levels. Minimum order requirements may apply to certain alloys and powder sizes. TDS LOCTITE MP 218, September-2016 DIRECTIONS FOR USE Printing: 1. LOCTITE MP 218 is available for stencil printing down to 0.4mm (0.016") pitch QFP devices, with type 3 (AGS) powder. 2. Printing at speeds between 25 mm/s (1 "/s) and 150 mm/s (6 "/s) can be achieved by using laser cut, electropolished or electroformed stencils and metal squeegees (preferably 60°). 3. Acceptable first prints have been achieved at 0.4 mm (16 mils) pitch after printer down times of 60 minutes without requiring a knead cycle. Reflow: ● Any of the available methods of heating to cause reflow may be used including IR, convection, hot belt, vapor phase and laser soldering. ● LOCTITE MP 218 is not particularly sensitive to reflow profile type. ● There is no single reflow profile which is suitable for all processes and applications, but the following graphs show profile examples that have given good results in practice. ● 63S4 anti-tombstoning is selected when tombstone defects are experienced with standard alloys and when it is not possible to eliminate by design changes. ● Typical reflow profile as follows: 1. Ramp to 130 to 165ºC at no more than 2ºC s-1 . 2. Hold at 130 to 165ºC for 60 to 120 seconds. 3. Ramp to peak reflow temperature at no more than 2ºC s-1 . 4. Recommended peak reflow temperature is 205 to 225ºC. 5. Dwell time above liquidus of 30 to 75 seconds. Test Copper Plate Corrosion Copper Mirror Corrosion Chlorides & Bromides Surface Insulation Resistance (without cleaning) Electromigration (ECM) Flux Activity Classification (without cleaning) Specification ANSI/J-STD-004 ANSI/J-STD-004 ANSI/J-STD-004 ANSI/J-STD-004 Results Pass Pass Pass Pass Pass Telecordia GR-78-Core Pass ANSI/J-STD-004 (Jan. ROL0 1995) STORAGE AND SHELF LIFE Storage: It is recommended to store LOCTITE MP 218 at 0 to 10°C. (NB cartridges should be stored tip down to prevent the formation of air pockets). The paste should be removed from cold storage a minimum of 8 hours before use. Do not use forced heating methods to bring solder paste up to temperature. LOCTITE MP 218 solder paste has been formulated to minimize flux separation on storage but should this occur, gentle stirring for 15 seconds will return the product to the correct rheological performance. To prevent contamination of unused product, do not return any material to its original container. For further specific shelf life information, contact your local Technical Service Center. Shelf Life: Provided Multicore LOCTITE MP 218 is stored tighly sealed in the original container at 0 to 10°C, a minimum shelf life of 183 days can be expected. Air shipment is recommended to minimize the time the containers are exposed to higher temperatures. Short term storage at room temperature during use is acceptable provided the paste is sealed in original containers. Laboratory testing has shown that the paste remains in a useable condition after 2 months of storage at room temperature. DATA RANGES The data contained herein may be reported as a typical value and/or a range. Values are based on actual test data and are verified on a periodic basis. GENERAL INFORMATION For safe handling information on this product, consult the Material Safety Data Sheet (MSDS). Cleaning: 1. LOCTITE MP 218 solder pastes are no-clean and are designed to be left on the PCB in many applications post-assembly since they do not pose a hazard to long-term reliability. 2. Residue removal can be achieved using conventional cleaning processes based on solvents such as LOCTITE MCF 800 or suitable saponifying agents. 3. For stencil cleaning and cleaning board misprints, LOCTITE MSC 01 solvent cleaner is recommended. RELIABILITY PROPERTIES Solder Paste Medium: LOCTITE MP 218 medium contains a stable resin system and slow evaporating solvents. The formulation has been tested to the requirements of ANSI/J-STD-004 for a type ROL0 classification. Not for Product Specifications The technical information contained herein is intended for reference only. Please contact Henkel Technologies Technical Service for assistance and recommendations on specifications for this product. Conversions (°C x 1.8) + 32 = °F kV/mm x 25.4 = V/mil mm / 25.4 = inches µm / 25.4 = mil N x 0.225 = lb N/mm x 5.71 = lb/in N/mm² x 145 = psi MPa x 145 = psi N·m x 8.851 = lb·in N·m x 0.738 = lb·ft N·mm x 0.142 = oz·in mPa·s = cP Disclaimer Note: The information provided in this Technical Data Sheet (TDS) including the recommendations for use and application of the product are based on our knowledge and experience of the product as at the date of this ---------------------------------------------------------------------------------------------------------------------------------------------------Americas Europe Asia +1.888.943.6535 +32.1457.5611 +86.21.3898.4800 For the most direct access to local sales and technical support visit: www.henkel.com/electronics TDS LOCTITE MP 218, September-2016 TDS. The product can have a variety of different applications as well as differing application and working conditions in your environment that are beyond our control. Henkel is, therefore, not liable for the suitability of our product for the production processes and conditions in respect of which you use them, as well as the intended applications and results. We strongly recommend that you carry out your own prior trials to confirm such suitability of our product. Any liability in respect of the information in the Technical Data Sheet or any other written or oral recommendation(s) regarding the concerned product is excluded, except if otherwise explicitly agreed and except in relation to death or personal injury caused by our negligence and any liability under any applicable mandatory product liability law. In case products are delivered by Henkel Belgium NV, Henkel Electronic Materials NV, Henkel Nederland BV, Henkel Technologies France SAS and Henkel France SA please additionally note the following: In case Henkel would be nevertheless held liable, on whatever legal ground, Henkel’s liability will in no event exceed the amount of the concerned delivery. In case products are delivered by Henkel Colombiana, S.A.S. the following disclaimer is applicable: The information provided in this Technical Data Sheet (TDS) including the recommendations for use and application of the product are based on our knowledge and experience of the product as at the date of this TDS. Henkel is, therefore, not liable for the suitability of our product for the production processes and conditions in respect of which you use them, as well as the intended applications and results. We strongly recommend that you carry out your own prior trials to confirm such suitability of our product. Any liability in respect of the information in the Technical Data Sheet or any other written or oral recommendation(s) regarding the concerned product is excluded, except if otherwise explicitly agreed and except in relation to death or personal injury caused by our negligence and any liability under any applicable mandatory product liability law. In case products are delivered by Henkel Corporation, Resin Technology Group, Inc., or Henkel Canada Corporation, the following disclaimer is applicable: The data contained herein are furnished for information only and are believed to be reliable. We cannot assume responsibility for the results obtained by others over whose methods we have no control. It is the user's responsibility to determine suitability for the user's purpose of any production methods mentioned herein and to adopt such precautions as may be advisable for the protection of property and of persons against any hazards that may be involved in the handling and use thereof. In light of the foregoing, Henkel Corporation specifically disclaims all warranties expressed or implied, including warranties of merchantability or fitness for a particular purpose, arising from sale or use of Henkel Corporation’s products. Henkel Corporation specifically disclaims any liability for consequential or incidental damages of any kind, including lost profits. The discussion herein of various processes or compositions is not to be interpreted as representation that they are free from domination of patents owned by others or as a license under any Henkel Corporation patents that may cover such processes or compositions. We recommend that each prospective user test his proposed application before repetitive use, using this data as a guide. This product may be covered by one or more United States or foreign patents or patent applications. Trademark usage Except as otherwise noted, all trademarks in this document are trademarks of Henkel Corporation in the U.S. and elsewhere. ® denotes a trademark registered in the U.S. Patent and Trademark Office. Reference N/A Americas Europe Asia +1.888.943.6535 +32.1457.5611 +86.21.3898.4800 For the most direct access to local sales and technical support visit: www.henkel.com/electronics