KH-3216-H0209

深圳市金航标电子有限公司 承 認 書 SPECIFICATION FOR APPROVAL 客戶名稱 CUSTOMER ： 客戶料號 CUSTOMER’S P/N ： 料號 PART NUMBER ： KH-3216-H0209 規格 DESCRIPTION ： Chip Antenna 3216 L Ant 2.45G Type H02 版本 VERSION ： V1.0 日期 ISSUE DATE ： 2020/08/21 客 戶 承 認 CUSTOMER APPROVED 工 程 部 R&D CENTER 承 認 APPROVAL 严专专 1/11 確 認 CHECKED 製 作 DRAWN 赖积任 张松强 WWW.BDS666.COM 0755-83044319 3216 Chip antenna For Bluetooth / WLAN Applications P/N: KH3216E245H0209 Dimension (mm) L 3.23 ± 0.20 W 1.66 ± 0.20 T 0.45 ± 0.20 2/11 WWW.BDS666.COM 0755-83044319 Part Number Information KH 3216 A A B C D E F G E B 245 C D Product Series Dimension L x W Material Working Frequency Feeding mode Antenna type Mark type H 02 09 E F G Antenna 3.2 x 1.6mm (±0.2mm) High K material 2.4 ~ 2.5GHz PIFA & Single Feeding Type = 02 Type = 09 1. Electrical Specification Specification Part Number KH3216E245H0209 Central Frequency 2450 MHz Bandwidth 120 (Min.) MHz Return Loss -6.5 (Max) dB Peak Gain 1.71 dBi Impedance 50 Ohm Operating Temperature -40～+110 ℃ Maximum Power 4 W Resistance to Soldering Heats 10 ( @ 260℃) sec. Polarization Linear Azimuth Beamwidth Omni-directional Termination Ni / Au (Leadless) Remark : Bandwidth & Peak Gain was measured under evaluation board of next page 3/11 WWW.BDS666.COM 0755-83044319 2. Recommended PCB Pattern Evaluation Board Dimension 2nd Evaluation Board Dimension Suggested Matching Circuit 重要資訊 : 匹配元件建議使用精準度高的電感±0.1~0.3nH、電容±0.1pF 4/11 WWW.BDS666.COM 0755-83044319 Layout Dimensions in Clearance area( Size=5.9*5.0mm) 50 ohm transmission Line Matching Circuit FootPrint ◆ (Unit : mm) 2nd Layout Dimensions in Clearance area( Size=8.0*3.0mm) 5/11 WWW.BDS666.COM 0755-83044319 3. Measurement Results Return Loss 6/11 WWW.BDS666.COM 0755-83044319 Radiation Pattern Z X Y Efficiency Peak Gain Directivity 2400MHz 77.26 % 1.63 dBi 2.75 dBi 2450MHz 79.88 % 1.71 dBi 2.68 dBi 2500MHz 77.98 % 1.67 dBi 2.75 dBi Chamber Coordinate System 7/11 WWW.BDS666.COM 0755-83044319 4.Reliability and Test Condictions ITEM REQUIREMENTS TEST CONDITION Solderability 1. Wetting shall exceed 90% coverage 2. No visible mechanical damage Pre-heating temperature:150℃/60sec. Solder temperature:230±5℃ Duration:4±1sec. Solder:Sn-Ag3.0-Cu0.5 Flux for lead free: rosin TEMP (℃) 4±1 sec. 230℃ 150℃ 60sec Solder heat Resistance 1. No visible mechanical damage 2. Central Freq. change :within ± 6% TEMP (℃) 10±0.5 sec. 260℃ Pre-heating temperature:150℃/60sec. Solder temperature:260±5℃ Duration:10±0.5sec. Solder:Sn-Ag3.0-Cu0.5 Flux for lead free: rosin 150℃ 60sec .. Component Adhesion (Push test) 1. No visible mechanical damage Component Adhesion (Pull test) 1. No visible mechanical damage Thermal shock 1. No visible mechanical damage 2. Central Freq. change :within ±6% Phase Temperature(℃) Time(min) 1 +110±5℃ Room Temperature -40±2℃ Room Temperature 30±3 Within 3sec 2 3 4 The device should be reflow soldered(230±5℃ for 10sec.) to a tinned copper substrate A dynometer force gauge should be applied the side of the component. The device must with-ST-F 0.5 Kg without failure of the termination attached to component. Insert 10cm wire into the remaining open eye bend ,the ends of even wire lengths upward and wind together. Terminal shall not be remarkably damaged. +110℃=>30±3min -40℃=>30±3min Test cycle:10 cycles The chip shall be stabilized at normal condition for 2~3 hours before measuring. 30±3 Within 3sec Resistance to High Temperature 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Resistance to Low Temperature 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Humidity 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. 8/11 Temperature: +110±5℃ Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. Temperature:-40±5℃ Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. Temperature: 40±2℃ Humidity: 90% to 95% RH Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. WWW.BDS666.COM 0755-83044319 5.Soldering and Mounting Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. Iron Soldering Reflow Soldering PRE-HEATING PRE-HEATING SOLDERING NATURAL COOLING 250~260 230 180 150 60~120 s SOLDERING within 3s TEMPERATURE(°C) TEMPERATURE(°C) 10s max. 30~60s NATURAL COOLING 350 300 150 Gradual cooling Over 60s TIME(sec.) TIME(sec.) Recommended temperature profiles for re-flow soldering in Figure 1. Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. ‧Preheat circuit and products to 150℃ ‧Never contact the ceramic with the iron tip ‧Use a 20 watt soldering iron with tip diameter of 1.0mm ‧280℃ tip temperature (max) ‧1.0mm tip diameter (max) ‧Limit soldering time to 3 sec. 9/11 WWW.BDS666.COM 0755-83044319 6.Packaging Information Tape Specification: Reel Specification: (7’’, Φ180 mm) Tape Width(mm) A(mm) B(mm) 8 9.0±0.5 60±2 10/11 C(mm) 13.5±0.5 D(mm) Chip/Reel(pcs) 178±2 WWW.BDS666.COM 3000 0755-83044319 7.Storage and Transportation Information Storage Conditions To maintain the solderability of terminal electrodes: 1. Temperature and humidity conditions: -10~ 40℃ and 30~70% RH. 2. Recommended products should be used within 6 months from the time of delivery. 3. The packaging material should be kept where no chlorine or sulfur exists in the air. Transportation Conditions 1. Products should be handled with care to avoid damage or contamination from perspiration and skin oils. 2. The use of tweezers or vacuum pick up is strongly recommended for individual components. 3. Bulk handling should ensure that abrasion and mechanical shock are minimized. 11/11 WWW.BDS666.COM 0755-83044319