SS2200B

SS22B THRU SS2200B Reverse Voltage - 20 to 200 Volts Forward Current - 2.0 Ampere SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER DO-214AA/SMB Features  The plastic package carries Underwriters Laboratory Flammability Classification 94V-0  For surface mounted applications  Metal silicon junction,majority carrier conduction  Low power loss,high efficiency 0.155(3.94) 0.130(3.30) 0.086 (2.20) 0.071 (1.80)  Built-in strain relief,ideal for automated placement 0.185(4.70) 0.160(4.06)  High forward surge current capability  High temperature soldering guaranteed: 0.012(0.305) 0.006(0.152) 250 °C/10 seconds at terminals 0.096(2.44) 0.084(2.13) 0.060(1.52) 0.030(0.76) 0.008(0.203)MAX. Mechanical Data 0.220(5.59) 0.200(5.08) Case: JEDEC DO-214AA/SMB molded plastic body Terminals: Solderable per MIL-STD-750,Method 2026 Polarity: Color band denotes cathode end Mounting Position: Any Weight : 0.003 ounce, 0.093 grams Dimensions in inches and (millimeters) Maximum Ratings And Electrical Characteristics Ratings at 25 C ambient temperature unless otherwise specified. Single phase half-wave 60Hz,resistive or inductive load,for capacitive load current derate by 20%. Parameter SYMBOLS Marking Code Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage VRRM VRMS VDC SS22B SS23B SS24B SS25B SS26B SS28B SS210B SS2150B SS2200B MDD SS22B MDD SS23B MDD SS24B MDD SS25B MDD SS26B MDD SS28B MDD SS210B MDD SS2150B MDD SS2200B 20 14 20 30 21 30 40 28 40 50 35 50 60 42 60 80 56 80 100 70 100 150 105 150 200 140 200 UNITS V V V Maximum average forward rectified current at TL(see fig.1) I(AV) 2.0 A Peak forward surge current 8.3ms single half sine-wave superimposed onrated load (JEDEC Method) IFSM 55 A Maximum instantaneous forward voltage at 2.0A VF Maximum DC reverse current at rated DCblocking voltage TA=25℃ TA=125℃ Typical junction capacitance (NOTE 1) CJ Typical thermal resistance (NOTE 2) RJA TJ TSTG 0.70 0.85 0.5 10.0 IR Operating junction temperature range Storage temperature range 0.55 0.95 0.2 5.0 180 220 mA 2.0 pF 75.0 -50 to +125 ℃/W ℃ -50 to +150 ℃ -50 to +150 Note:1.Measured at 1MHz and applied reverse voltage of 4.0V D.C. 2.P.C.B. mounted with 0.2x0.2”(5.0x5.0mm) copper pad areas DN:T20824A0 http://www.microdiode.com Rev:2020A1 V Page :1 SS22B THRU SS2200B Reverse Voltage - 20 to 200 Volts Forward Current - 2.0 Ampere Typical Characterisitics Fig.2 Typical Reverse Characteristics Average Forward Current (A) 3.0 2.5 2.0 1.5 1.0 0.5 Single phase half-wave 60 Hz resistive or inductive load 0.0 25 50 75 100 125 150 Instaneous Reverse Current ( μA) Fig.1 F Fo or w a r d C Cu ur r e n t D De er a t i n g C Cu ur v e 10 4 T J =75°C 10 2 SS22B/SS26B 10 T J =25°C 10 0 0 40 20 60 Fig.4 Typical Junction Capacitance T J =25°C Junction Capacitance (pF) T J =25°C 10 1.0 SS22B/SS24B SS26B/SS28B SS210B/SS212B SS2150B/SS2200B 0.1 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 500 200 100 20 SS22B~SS26B SS28B~SS2200B 10 1 0.1 100 10 Instaneous Forward Voltage (V) Reverse Voltage (V) Fig.5 Maximum Non-Repetitive Peak Forward Surge Current Fig.6- Typical Transient Thermal Impedance 60 SS22B-SS28B SS210B-SS2200B 50 40 30 20 10 1000 1.8 8.3 ms Single Half Sine Wave (JEDEC Method) 00 10 1 Number of Cycles at 60Hz 100 Transient Thermal Impedance（ °C /W） 20 100 80 Percent of Rated Peak Reverse Voltage（%） Fig.3 Typical Forward Characteristic Instaneous Forward Current (A) SS28B-SS2200B 1 Case Temperature (°C) Peak Forward Surge Current (A) T J =100°C 10 3 100 10 1 0.01 0.1 1 10 100 t, Pulse Duration（sec） The curve above is for reference only. http://www.microdiode.com Rev:2020A1 Page :2 SS22B THRU SS2200B Reverse Voltage - 20 to 200 Volts Forward Current - 2.0 Ampere Packing information unit:mm P0 P1 Item Symbol Tolerance SMB Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 13" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Overall tape thickness Tape width A B C d D D1 D2 E F P P0 P1 T W Reel width W1 0.1 0.1 0.1 0.05 2.0 min 0.5 0.1 0.1 0.1 0.1 0.1 0.1 0.3 1.0 3.81 5.41 2.42 1 50 . 330.00 50.00 13.00 1.75 5.55 8.00 4.00 2.00 0.30 12.00 12.30 d E F B A W P D2 T D1 C W1 D Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. Reel packing PACKAGE REEL SIZE REEL (pcs) COMPONENT SPACING (mm) BOX (pcs) INNER BOX (mm) REEL DIA, (mm) SMB 13" 3,000 4.0 6,000 190*190*41 330 CARTON SIZE (mm) 365*365*360 CARTON (pcs) 48,000 APPROX. GROSS WEIGHT (kg) 14.0 Suggested Pad Layout Unit (inch) Symbol Unit (mm) A 2.8 0.110 B 0.094 C 2.4 4.6 0.181 D 2.2 0.086 E 7.0 0.276 Important Notice and Disclaimer Microdiode Electronics (Jiangsu) reserves the right to make changes to this document and its products and specifications at any time without notice. Customers should obtain and confirm the latest product information and specifications before final design,purchase or use. Microdiode Electronics (Jiangsu) makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, not does Microdiode Electronics (Jiangsu) assume any liability for application assistance or customer product design. Microdiode Electronics (Jiangsu) does not warrant or accept any liability with products which are purchased or used for any unintended or unauthorized application. No license is granted by implication or otherwise under any intellectual property rights of Microdiode Electronics (Jiangsu). Microdiode Electronics (Jiangsu) products are not authorized for use as critical components in life support devices or systems without express written approval of Microdiode Electronics (Jiangsu). http://www.microdiode.com Rev:2020A1 Page :3