S1MD3

S1AD3 THRU S1MD3 1.0A Surface Mount General Purpose Rectifiers - 50V-1000V Package outline Features The plastic package carries Underwriters Laboratory Flammability Classification 94V-0 For surface mounted applications Low reverse leakage Built-in strain relief,ideal for automated placement High forward surge current capability High temperature soldering guaranteed: 260 C/10 seconds at terminals Glass passivated chip junction 0.071(1.80) 0.063(1.40) 0.016(0.40) 0.010(0.25) 0.055(1.40) 0.047(1.20) SOD-323 Mechanical data Case: JEDEC SOD-323 molded plastic body Terminals: Solder plated, solderable per MIL-STD-750, Method 2026 Polarity: Color band denotes cathode end Mounting Position: Any 0.003(0.08) 0.008(0.20) 0.039(1.00) 0.031(0.80) 0.108(2.75) 0.096(2.45) Dimensions in inches and (millimeters) Maximum ratings and Electrical Characteristics (AT T A=25 oC unless otherwise noted) SYMBOLS S1AD3 S1BD3 S1DD3 S1GD3 S1JD3 S1KD3 S1MD3 Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward rectified current at TL =110C Peak forward surge current 8.3ms single half sine-wave superimposed on rated load Maximum instantaneous forward voltage at 1.0A Maximum DC reverse current TA=25 C at rated DC blocking voltage TA=100 C Typical junction capacitance (NOTE 1) Typical thermal resistance (NOTE 2) Operating junction and storage temperature range 50 35 50 VRRM VRMS VDC 100 70 100 200 140 200 400 280 400 600 420 600 800 560 800 1000 700 1000 UNITS V V V I(AV) 1.0 A IFSM 15.0 A VF 1.1 V IR 5.0 50.0 µA CJ RθJA TJ,TSTG 5.0 55.0 -55 to +150 pF C/W C Note:1.Measured at 1MHz and applied reverse voltage of 4.0V D.C. 2.P.C.B. mounted with 0.2x0.2”(5.0x5.0mm) copper pad areas www.fuxinsemi.com Page 1 Ver2.1 S1AD3 THRU S1MD3 1.0A Surface Mount General Purpose Rectifiers - 50V-1000V Rating and characteristic curves FIG.1-TYPICAL FORWARD FIG.2-TYPICAL FORWARD CURRENT DERATING CURVE AVERAGE FORWARD CURRENT,(A) CHARACTERISTICS 10 3.0 1.0 1.2 1.0 0.8 0.6 P.C.B. Mounted on 0.2" x 0.2" (5 mm x 5 mm) Copper Pad Areas 0.4 0.2 0 0 20 40 TJ=25 C 60 80 100 120 140 160 180 200 LEAD TEMPERATURE ( C) Pulse Width 300us 1% Duty Cycle 0.1 FIG.4-MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT .01 .6 .7 .8 .9 1.0 1.1 1.2 1.3 FORWARD VOLTAGE,(V) FIG.3 - TYPICAL REVERSE CHARACTERISTICS PEAK FORWAARD SURGE CURRENT,(A) INSTANTANEOUS FORWARD CURRENT,(A) 50 50 40 30 8.3ms Single Half TJ=25 C Sine Wave 20 JEDEC method 10 0 100 1 5 50 10 100 FIG.5-TYPICAL JUNCTION CAPACITANCE 10 35 TJ=125 C JUNCTION CAPACITANCE,(pF) REVERSE LEAKAGE CURRENT, (m A) NUMBER OF CYCLES AT 60Hz 1.0 .1 TJ=25 C 30 25 20 15 10 5 .01 0 0 20 40 60 80 .01 .1 .5 1 5 10 50 100 REVERSE VOLTAGE,(V) PERCENTAGE RATED PEAK REVERSE VOLTAGE,(%) www.fuxinsemi.com .05 100 120 140 Page 2 Ver2.1 S1AD3 THRU S1MD3 1.0A Surface Mount General Purpose Rectifiers - 50V-1000V Pinning information Pin Pin1 Pin2 Simplified outline cathode anode 1 Symbol 2 1 2 Marking Type number Marking code S1AD3 S1BD3 S1DD3 S1GD3 S1JD3 S1KD3 S1MD3 1A 2A 3A 4A 5A 6A 7A Suggested solder pad layout C A B Dimensions in inches and (millimeters) PACKAGE A B C SOD-323 0.047 (1.20) 0.047 (1.20) 0.055 (1.40) Reel packing PACKAGE SOD-323 REEL SIZE 7" www.fuxinsemi.com REEL (pcs) COMPONENT SPACING (m/m) BOX (pcs) INNER BOX (m/m) REEL DIA, (m/m) 3,000 4.0 30,000 183*183*123 178 Page 3 CARTON SIZE (m/m) 382*262*387 CARTON (pcs) 240,000 Ver2.1 S1AD3 THRU S1MD3 1.0A Surface Mount General Purpose Rectifiers - 50V-1000V Suggested thermal profiles for soldering processes 1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%±25% 2.Reflow soldering of surface-mount devices Critical Zone TL to TP Tp TP Ramp-up TL TL Tsmax Temperature Tsmin tS Preheat Ramp-down 25 o t25 C to Peak Time 3.Reflow soldering Profile Feature Soldering Condition Average ramp-up rate(T L to T P ) o