NJL5909RL-4

NJL5909RL-4 COBP PHOTO REFLECTOR with LENS    GENERAL DESCRIPTION The NJL5909RL-4 is a surface mount type COBP photo reflector that is 4mm focal length. The NJL5909RL-4 has achieved the small, thin package by combination of our COBP (Chip On Board Package) and Lens molding technology.  FEATURES  Focal length : 4mm  Miniature, thin package : 1.9mm  2.6mm  1.6mm  Low operating dark current (Iceod)  Pb free solder re-flowing permitted : 255°C, 2 times  Built-in visible ligh t cut-o ff filter  APPLICATIONS  Detecting the rotation of various motors  Paper detection of Printer, copy machine etc  Detecting the Card Reader etc  Detecting the CD/DVD Media  ABSOLUTE MAXIMUM RATINGS (Ta=25°C) PARAMETER Emitter Forward Current (Continuous) Reverse Voltage (Continuous) Power Dissipation Detecto Collector-Emitter Voltage Emitter-Co llector Voltage Collector Current Collector Power Dissipation SYMBOL Coupled Total Power Dissipation Operating Temperature Storage Temperature Reflow Soldering Temperature RATINGS UNIT IF VR PD 30 6 45 mA V mW VCEO VECO IC PC 16 6 10 25 V V mA mW 60 -20 to +80 -30 to +90 255 mW °C °C °C Ptot Topr Tstg Tsol  ELECTRO-OPTICAL CHARACTERISTICS (Ta=25°C) PARAMETER Emitter Forward Voltage Reverse Current Capacitance SYMBOL TEST CONDITION MIN TYP MAX UNIT — — 1.3 10 25 — V A pF — — 0.2 — — 175 0.2 30 30 — — VF IR Ct IF=4mA VR=6V VR=0V,f =1MHz 0.9 Detector Dark Current Collector-Emitter Voltage ICEO VCEO VCE=10V IC=100A — Coupled Output Current *1 Operating Dark Current *2 Rise Time Fall Time IO ICEOD tr tf IF=4mA,VCE=2V,d=4.0mm IF=4mA,VCE=2V IO=100A,VCE=2V,RL=1K,d=4.0mm IO=100A,VCE=2V,RL=1K,d=4.0mm 35 — — 16 — — — — A V A A s s *1 Refer to OUTPUT CURRENT TEST CONDITION *2 Iceod may increase according to the periphery situation of the surface mounted product. Ver.2014-10-17 -1- NJL5909RL-4  OUTLINE (typ.) Unit : mm E K C A A :anode C :collector E :emitter K :cathode  OUTPUT CURRENT TEST CONDITION  DARK CURRENT TEST CONDITION The infrared signal from LED is reflected at the aluminum surface Light Sealed Dark Box 4.0mm Aluminum Evaporation Surface IF Iceod Io IF VCE VCE -2- Ver.2014-10-17 NJL5909RL-4  RESPONSE TIME TEST CONDITION Al evaporation surface Vcc INPUT 50% RD INPUT OUTPUT 90% OUTPUT RL 10% td ts tr tf  EDGE RESPONSE TEST CONDITION l=0mm Aluminum Evaporation Surface 4.0mm Direction X Ver.2014-10-17 l=0mm Aluminum Evaporation Surface 4.0mm Direction Y -3- NJL5909RL-4 Forward Current vs. Temperature 100 50 90 45 80 40 Forward Current IF(mA) Power Dissipation P(mW) Power Dissipation vs. Temperature 70 60 50 Total Power Dissipation 40 30 35 30 25 20 15 10 20 Collector Power Dissipation 10 5 0 0 0 50 0 100 50 100 Ambient Temperature Ta(°C) Ambient Temperature Ta(°C)  TYPICAL CHARACTERISTCS Forward Voltage vs. Temperature Forward Voltage vs. Forward Current 1.6 1.4 Forward Voltage VF(V) Forward Current IF(mA) 100 10 IF=30mA 1.2 IF=4mA 1 1 0.8 0 1 -40 2 20 40 60 80 100 Forward Voltage VF(V) Dark Current vs. Temperature Operating Dark Current vs. Temperature 10 Operating Dark Current Iceod(A) 100 Dark Current Iceo(nA) 0 Ambient Temperature Ta(C) 1000 10 1 VCE=10V 0.1 0.01 1 IF=4mA , VCE=2V 0.1 0.01 0.001 -40 -20 0 20 40 60 Ambient Temperature Ta(°C) -4- -20 80 100 -40 -20 0 20 40 60 80 100 Ambient Temperature Ta(°C) Ver.2014-10-17 NJL5909RL-4 Output Current vs. Forward Current (Ta=25 C) Output Current vs. Temperature 120 Relative Output Current Io/Io(25C)(%) 400 Output Current Io(A) 350 300 250 200 150 100 VCE=2V , d=4mm 50 100 80 60 40 IF=4mA , VCE=2V 20 0 0 0 2 4 6 8 -40 10 R e la tive Outpu t C urren t Io/Io (m ax.)(% ) Relative Output Current Io/Io(max.)(%) 120 100 IF=4mA , VCE=2V 80 60 40 20 0 10 20 40 60 80 100 Output Current vs. Edge Distance (Ta=25°C) Output Current vs. Distance (Ta=25°C) 5 0 Ambient Temperature Ta(C) Forward Current IF(mA) 0 -20 120 IF=4mA , VCE=2V , d=4mm 100 80 Direction X 60 Direction Y 40 20 0 0 15 0.4 0.8 1.2 1.6 2 2.4 Edge Distance l(mm) Reflector Distance d(mm) Switching Time vs. Load Resistance (Ta=25 C) 1000 Output Characteristics (Ta=25°C) 350 IF=10mA 250 IF=8mA Switching Time t(s) Output Current Io(A) 300 200 IF=6mA 150 IF=4mA 100 IF=2mA 50 tr tf td 100 10 0 0 1 2 3 4 Collector-Emitter Voltage Vce(V) 5 1 0.1 1 10 Load Resistance RL(k  ) Ver.2014-10-17 -5- NJL5909RL-4 Spectral Response (Ta=25 C) Detector 120 120 100 100 Relative Response (%) Relative Response (%) Spectral Response (Ta=25 C) Emitter 80 60 40 20 0 700 800 900 1000 Wavelength (nm) -6- 1100 80 60 40 20 0 500 600 700 800 900 1000 Wavelength (nm) Ver.2014-10-17 NJL5909RL-4  MOUNTING METHOD NOTE Mounting was evaluated with the following profiles in our company, so there was no problem. However, confirm mounting by the condition of your company beforehand. The exposure of device under higher temperature may affect to the reliability of the products, it is recommended to complete soldering in the shortest time possible. Mounting: Twice soldering is allowed.  INFRARED REFLOW SOLDERING METHOD Recommended reflow soldering procedure e 255°C 230°C 180°C 150°C a : Temperature ramping rate b : Pre-heating temperature time c : Temperature ramping rate d : 230°C or higher time e : Peak temperature : 1 to 4°C/s : 150 to 180°C : 60 to 120s : 1 to 4°C /s : 20 to 40s : Lower than 255°C f : Temperature ramping rate : 1 to 6°C /s The temperature of the surface of mold package Room Temp. a b c d f (NOTE1) Using reflow furnace with short wave infrared radiation heater such as halogen lamp Regarding temperature profile, please refer to those of reflow furnace. In this case the resin surface temperature may become higher than lead terminals due to endothermic ally of black colored mold resin. Therefore, please avoid from direct exposure to mold resin. (NOTE2) Other method Such other methods of soldering as dipping the device into melted solder and vapor phase method (VPS) are not appropriate because the body of device will be heated rapidly. Therefore, these are not recommended to apply. (NOTE3) The resin gets softened right after soldering, so, the following care has to be taken Not to contact the lens surface to anything. Not to dip the device into water or any solvents.  FLOW SOLDERING METHOD Flow soldering is not possible.  IRON SOLDERING METHOD Iron soldering is not possible. Ver.2014-10-17 -7- NJL5909RL-4  CLEANING Avid washing the device after soldering by reflow method.  IC STORAGE CONDITIONS AND ITS DURATION (1) Temperature and humidity ranges Pack Sealing Temperature: 5 to 40 [°C] Humidity: 40 to 80 [] Pack Opening Temperature: 5 to 30 [°C] Humidity: 40 to 70 [] After opening the bag, solder products within 48h. Avoid a dry environment below 40% because the products are is easily damageable by the electrical discharge. Store the products in the place where it does not create dew with the products due to a sudden change in temperature. (2) When baking, place the reel vertically to avoid load to the side. (3) Do not store the devices in corrosive-gas atmosphere. (4) Do not store the devices in a dusty place. (5) Do not expose the devices to direct rays of the sun. (6) Do not allow external forces or loads to be applied to IC’s. (7) BE careful because affixed label on the reel might be peeled off when baking. (8) The product is recommended to do the baking before using for the stability of the quality.  BAKING In case of keeping expect above condition be sure to apply baking. (Heat-resistant tape) Baking method: Ta=60°C, 48 to 72h, Three times baking is allowed  STORAGE DURATION Within a year after delivering this device. For the products stored longer than a year, confirm their terminals and solder ability before they are used.  APPLICATION NOTES (1) Attention in handling Treat not to touch the light receiving and light emitting part. Avoid to adhering the dust and any other foreign materials on the light receiving and light emitting part when using. Never apply reverse voltage (VEC) of over 6V to the photo transistor when measuring the characteristics or adjusting the system. If applied, it causes to lower the sensitivity. When LED has operated by voltage, it should be connected the resistor of current adjustment. Avoid to applying direct voltage to LED, because there is possibility that LED is destroyed. When mounting, special care has to be taken on the mounting position and tilting of the device because it is very important to place the device to the optimum position to the object. (2) Attention in designing Avoid the entering ambient light into light receiving part for avoid the malfunction by ambient light. Furthermore, there is possibility of malfunction when there are the other mounted parts by near this product peripheral. There will be changing characteristics by detection object. Refer to this datasheet and evaluate by actual detection object. When LED has been applied continuous power on long period of time, the output current is dropped. If it uses by always applying power to LED, have to consider the circuit designing of including output current decrease. . -8- Ver.2014-10-17 NJL5909RL-4  PACKING SPECIFICATION PACKING DIMENTIONS UNIT : mm Drawing direction Insert direction φD0 P0 A B D0 D1 E F P0 P1 P2 T0 T1 W0 W1 T0 B W1 W0 F E P2 SYMBOL (TE1) A φ D1 P1 T1 DIMENSION 2.15 2.85 1.5 1.0 1.75 3.5 4.0 4.0 2.0 0.23 1.8 8.0 5.4 ±0.10 ±0.10 REMARKS BOTTOM DIMENSION BOTTOM DIMENSION +0.1 -0 ±0.10 ±0.10 ±0.05 ±0.10 ±0.10 ±0.05 ±0.05 ±0.10 ±0.20 ±0.10 THICKNESS 0.1MAX * Carrier tape material : Polycarbonate(antistatic) Cover tape material : Polyethylene(antistatic)  Taping Strength Pull up the cover tape from the carrier tape, and when the opening angle comes around 10 to 15 , and the peeling-off strength is to be within the power of 20 to 70g.  Packaging 1) The taped products are to be rolled up on the taping reel as on the drawing. 2) Rolling up specification 2-1) Start rolling : Carrier tape open space more than 20 Pieces. 2-2) End of rolling : Carrier tape open space more than 20 Pieces, and 2 round of reel space at the cover tape only. 3) Taping quantity : 1,500 Pieces 4) Seal off after putting each reels in a damp proof bag with silica gel. SYMBOL E A B D C A B C D E W0 W1 DIMENSION 180 ±1.0 60 ±0.5 13 ±0.2 21 ±0.8 2 ±0.5 9.0 ±0.5 12.6 ±1.0 * Reel material : PPE(antistatic) W0 W1 [CAUTION] The specifications on this databook are only given for information , without any guarantee as regards either mistakes or omissions. The application circuits in this databook are described only to show representative usages of the product and not intended for the guarantee or permission of any right including the industrial rights. Ver.2014-10-17 -9-