Revision of March 2018
TF-FUSE® Thin Film Surface Mount Fuses
FF Series (Very Fast Acting), 0603 Size
Features:
•
•
•
•
•
•
Applications:
• Notebook computers and tablets
• Digital cameras
• Memory cards
• Toys
• Bluetooth earphones
• Portable electronic devices
Very fast acting at 200% overload current levels
Low DCR
High inrush current withstanding capability
Fiberglass enforced epoxy fuse body
Copper termination with nickel and tin plating
Halogen free, RoHS compliance and lead-free
Shape and Dimensions:
Unit
Length (L)
Width (W)
Thickness (T)
Termination bandwidth (b)
Inch
0.063 ± 0.004
0.032 ± 0.004
0.012 ± 0.004
0.014 ± 0.004
mm
1.60 ± 0.10
0.81 ± 0.10
0.30 ± 0.10
0.36 ± 0.10
Clearing Time Characteristics:
Opening Time at 25oC
4 hours min.
5 seconds max.
0.2 second max.
% of Current Rating
100%
200%
300%
Agency Approval:
Recognized Under the Components Program of UL.
File Number: E232989.
Typical Ratings and Characteristics:
Operating temperature: -55 to +90°C
T0603FF0150TM
T0603FF0200TM
T0603FF0250TM
T0603FF0375TM
T0603FF0500TM
T0603FF0750TM
T0603FF1000TM
T0603FF1250TM
T0603FF1500TM
T0603FF1750TM
T0603FF2000TM
T0603FF2500TM
T0603FF3000TM
T0603FF3500TM
T0603FF4000TM
Current
Rating (A)
0.15
0.2
0.25
0.375
0.5
0.75
1
1.25
1.5
1.75
2
2.5
3
3.5
4
Voltage
Rating (VDC)
65
65
65
65
65
65
65
65
65
35
35
35
35
35
35
T0603FF5000TM
5
35
Part Number
1
Measured at ≤ 10% of rated current and 25˚C ambient .
2
Interrupting Rating
50A@35V DC/AC
13A@65V DC
35A@35V DC/AC
13A@65V DC
35A@35V DC/AC
50A@24V DC/AC
Nominal
Cold DCR (Ω)1
2.2
1.3
1.1
0.48
0.185
0.112
0.069
0.048
0.037
0.031
0.026
0.021
0.0176
0.0148
0.0125
Nominal I2t
(A2s)2
0.0006
0.0014
0.0016
0.004
0.012
0.021
0.042
0.052
0.071
0.1
0.14
0.24
0.33
0.49
0.63
0.0095
1.1
2
Melting I t at 0.001 sec.
Website: www.aemchina.com & www.aemcomponents.com
Marking
Revision of March 2018
TF-FUSE® Thin Film Surface Mount Fuses
FF Series (Very Fast Acting), 0603 Size
5.00 A
4.00 A
3.50 A
3.00 A
2.50 A
2.00 A
1.75 A
1.50 A
1.25 A
1.00 A
0.75 A
0.50 A
0.375 A
0.250 A
0.200 A
0.150 A
Average Pre-arcing Time Curves:
Website: www.aemchina.com & www.aemcomponents.com
Revision of March 2018
TF-FUSE® Thin Film Surface Mount Fuses
FF Series (Very Fast Acting), 0603 Size
Average I2t vs. t Curves:
5.00 A
4.00 A
3.50 A
3.00 A
2.50 A
2.00 A
1.75 A
1.50 A
1.25 A
1.00 A
0.75 A
0.50 A
0.375 A
0.250 A
0.200 A
0.150 A
Website: www.aemchina.com & www.aemcomponents.com
Revision of March 2018
TF-FUSE® Thin Film Surface Mount Fuses
Product Identification:
T 0603 FF 1000 T M
(1) (2)
(3)
(4) (5) (6)
(1) Product Code: T-Thin Film
(2) Size Code: Standard EIA chip sizes
(3) Series Code: FF—Very Fast Acting, HI—High Inrush
(4) Current Rating Code: 0500—0.5A, 1000—1.0A
(5) Package Code: T—Tape & Reel; B—Bulk
Environmental Tests:
No.
Test item
Requirement
Test condition
Reference
1
Bending
≤1A: 10% DCR change max.
>1A: 20% DCR change max.
2mm
Refer to AEM QIQ034
2
Solderability
95% coverage min.
One dip at 255℃ for 5 seconds
MIL-STD-202
Method 208
3
Thermal shock
DCR change within ±10%
No mechanical damage
100 cycles between -55°C and +125°C
MIL-STD-202
Method 107
4
Moisture
resistance
DCR change within ±10%
No excessive corrosion
10 cycles
MIL-STD-202
Method 106
5
Salt spray
DCR change within ≤ ±10%
No excessive corrosion
5% salt solution, 48 hour exposure
MIL-STD-202
Method 101
6
Mechanical
vibration
DCR change within ≤ ±10%
No mechanical damage
0.4” D.A. or 30G between 5 and 3000 Hz
MIL-STD-202
Method 204
7
Mechanical shock
DCR change within ≤ ±10%
No mechanical damage
1500G, 0.5 ms, half sine shocks
MIL-STD-202
Method 213
8
Life
Change of voltage drop
within ±10%, no open circuit
75% rated current, 2000 hours, ambient
temperature +20°C to 30°C
Refer to AEM QIQ106
Packaging:
Chip Size
Parts on 7 inch (178mm) Reel
0603(1608)
8,000
0402(1005)
20,000
Website: www.aemchina.com & www.aemcomponents.com
Revision of March 2018
TF-FUSE® Thin Film Surface Mount Fuses
Temperature Effect on Current Rating:
Recommended Reflow Soldering Profile:
Pb-Free
Assembly
Profile Feature
Preheat/Soak
Temperature Min (Tsmin)
Temperature Max(Tsmax)
Time(ts) from (Tsmin to Tsmax)
Liquidous temperature(TL)
Time(tL) maintained above TL
150°C
200°C
60~120 seconds
3°C/second
max.
217°C
60~150 seconds
Peak package body temperature (Tp)
260°C
Time (tp)*within 5°C of the specified
classification temperature (Tc)
30 seconds *
Ramp-uprate (TL to Tp)
Ramp-down rate (Tp to TL)
Time 25°C to peak temperature
6°C/second
max.
8 minutes max.
* Tolerance for peak profile temperature (Tp) is defined as
a supplier minimum and a user maximum
Thermal Shock When Making Correction with a Soldering Iron:
The temperature of solder iron tip should be controlled under 350°C and soldering time should be less than 3 sec.
The soldering iron tip should not directly touch the top side termination of the component.
Fig 3 Correct handling method of soldering iron
Website: www.aemchina.com & www.aemcomponents.com
Revision of March 2018
Disclaimer
Specifications are subject to change without notice. AEM products are designed for specific applications and should not
be used for any purpose (including, without limitation, automotive, aerospace, medical, life-saving applications, or any
other application which requires especially high reliability for the prevention of such defect as may directly cause damage
to the third party’s life, body or property) not expressly set forth in applicable AEM product documentation. It is the
customer’s responsibility to validate that a particular product with the properties described in the product specification is
suitable for use in a particular application. Warranties granted by AEM shall be deemed void for products used for any
purpose not expressly set forth in applicable AEM product documentation. AEM shall not be liable for any claims or
damages arising out of products used in applications not expressly intended by AEM as set forth in applicable AEM
product documentation. The sale and use of AEM products is subject to AEM terms and conditions of sale. Please refer
Website: www.aemchina.com & www.aemcomponents.com
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