MXD8626C

MXD8626C VED APPRO SPDT Switch for 3G/4G Applications Description Features The MXD8626C is a Single-Pole, Double-Throw (SPDT)  Broadband frequency range: 0.4 to 3.0GHz LTE/WCDMA switch. Switching is controlled by a GPIO  Low insertion loss: 0.35dB @2.7GHz interface with a single control pin.  High isolation: 25dB @2.7GHz  High Input 0.1dB compression point: 35dBm  Single GPIO control line with VDD voltage regulator: The MXD8626C is provided in a compact 1.1mm x 0.7mm x 0.45mm 6-lead DFN package, which meets the requirements for board-level assembly. No external DC blocking capacitors are required as long as no DC voltage is applied on any RF path. A functional block diagram and the pin configuration are shown in Figure 1.  VDD= 2.5 to 3.0V  VCTL_H= 1.5 to 3.0V Compact, 6-Lead DFN, 400um pitch (1.1mm x 0.7mm x 0.45mm) package, MSL1 Applications   GSM/WCDMA/LTE B1 VCTL A1 RF1 B2 GND A2 ANT B3 VDD A3 RF2 RF1 ANT RF2 Logic and Supply VDD VCTL Figure 1 Functional Block and Pin Out(Top View) Page 1 / 7 MXD8626C Rev1.1 This document contains information that is confidential and proprietary to Maxscend Microelectronics Company, Ltd. (Maxscend) and may not be reproduced in any form without express written consent of Maxscend. No transfer or licensing of technology is implied by this document. Function Characteristics SPDT Switch for 3G/4G Applications Function Characteristics VCTL 100pF GND VDD 100pF B1 VCTL A1 RF1 RF1 B2 GND A2 ANT ANT B3 VDD A3 RF2 RF2 Figure 2 Application Circuit Table 1 Pin Descriptions NO. Name Description NO. Name Description A1 RF1 RF Port1 B1 VCTL Logic Control Voltage A2 ANT Antenna Port B2 GND Ground A3 RF2 RF Port2 B3 VDD DC Supply Voltage Table 2 VCTL Truth Table for RF Channel Operating Modes VCTL RF Channel Operating Mode Low ANT to RF1 On High ANT to RF2 On Page 2 / 7 MXD8626C: Rev1.1 Copyright @2018 Maxscend Microelectronics Company, Ltd. All rights reserved. Maxscend Confidential Electrical Characteristics SPDT Switch for 3G/4G Applications Electrical Characteristics Table 3 Absolute Maximum Ratings Symbol Min Max DC Supply Voltage Parameter VDD -0.3 3.3 Logic Control Voltage VCTL -0.3 3.3 Max RF Input Power (ANT to RF1/RF2) PIN 36 Device Operating Temperature TOP -40 90 Device Storage Temperature TSTG -55 150 Electrostatic Discharge VESD(HBM) 1000 (All Pins) VESD(CDM) 500 Unit V dBm Condition TA=25℃ TA=25℃ F0=950MHz, 20% DC, VDD=2.8V, VCH=1.8V, ZO=50Ω, TA=25℃ ℃ V Human Body Model Charged Device Model Notice Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other parameters set at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device. Table 4 Recommended Operating Conditions Parameter Symbol MIN TYP MAX Unit Operating Frequency F0 0.4 - 3.0 GHz DC Supply Voltage VDD 2.5 2.8 3.0 V Control Voltage High VCTL_H 1.5 1.8 3.0 V Control Voltage Low VCTL_L 0 0 0.3 V Page 3 / 7 MXD8626C: Rev1.1 Copyright @2018 Maxscend Microelectronics Company, Ltd. All rights reserved. Maxscend Confidential Electrical Characteristics SPDT Switch for 3G/4G Applications Table 5 Nominal Operating Parameters Parameter Symbol Specification MIN Normal Conditions TYP Unit Condition MAX VDD=2.8V, VCTL_H=1.8V, VCTL_L=0V, PIN=0dBm, Z0=50Ω, TA=25℃, Unless Otherwise Stated DC Performances DC Supply Current IDD Current on VCTL ICTL 83 90 5 μA Timing Performances Switching Speed TSW Turn On Time TON 1 2 μs 50% of VCTL to 10%/90% of RF 10 μs 50% of VDD to 90% of RF RF Performances Insertion Loss (ANT to RF1/RF2) Isolation (ANT to RF1/RF2) Voltage Standing Wave Ratio(All Ports) Input 0.1dB Compression Point (ANT to RF1/RF2) 2nd Order Harmonic (ANT to RF1/RF2) 3rd Order Harmonic (ANT to RF1/RF2) IL ISO 0.31 0.35 0.34 0.40 0.35 0.50 35 40 28 30 23 25 VSWR 1.25:1 P0.1dB 35 2F0 -100 F0 =0.4 to 1.0GHz dB F0 =1.7 to 2.1GHz F0 =2.2 to 3.0GHz F0 =0.4 to 1.0GHz dB F0 =1.7 to 2.1GHz F0 =2.2 to 3.0GHz 1.50:1 F0=0.4 to 3.0GHz dBm -94 F0=950MHz, 20% DC dBc F0=0.4 to 3.0GHz @26dBm 3F0 -100 -95 dBc Page 4 / 7 MXD8626C: Rev1.1 Copyright @2018 Maxscend Microelectronics Company, Ltd. All rights reserved. Maxscend Confidential Package Information SPDT Switch for 3G/4G Applications Package Outline Dimensions Figure 3 Package Outline Dimensions Page 5 / 7 MXD8626C: Rev1.1 Copyright @2018 Maxscend Microelectronics Company, Ltd. All rights reserved. Maxscend Confidential Package Information SPDT Switch for 3G/4G Applications Marking Specifications PIN1 First letter (Fixed): Product Code F FA Last letter(Variable): Lot Code From 1~9 and A ~Z excluding letter I and O Figure 4 Marking Specifications (Top View) Tape and Reel Dimensions Figure 5 Tape and Reel Dimensions Page 6 / 7 MXD8626C: Rev1.1 Copyright @2018 Maxscend Microelectronics Company, Ltd. All rights reserved. Maxscend Confidential Package Information SPDT Switch for 3G/4G Applications Reflow Chart tP TP Critical Zone TL to TP Ramp-Up Temperature TL TSMAX tL TSMIN Ramp-Down tS Preheat t25-TP Time Figure 6 Recommended Lead-Free Reflow Profile Table 6 Reflow Chart Parameters Reflow Profile Preheat Temperature(TSMIN to TSMAX) Preheat Time(ts) Parameter 150℃ to 200℃ 60 to 180 Seconds Ramp-Up Rate(TSMAX to TP) 3℃/s MAX Time Above TL 217℃(tL) 60 to 150 Seconds Peak Temperature（TP） 260℃ Time within 5℃ of Peak Temperature(tP) Ramp-Down Rate(TSMAX to TP) Time for 25℃ to Peak Temperature(t25-TP) 20 to 40 Seconds 6℃/s MAX 8 Minutes MAX ESD Sensitivity Integrated circuits are ESD sensitive and can be damaged by static electric charge. Proper ESD protection techniques should be applied when devices are operated. RoHS Compliant This product does not contain lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBB) and polybrominated diphenyl ethers (PBDE), and are considered RoHS compliant. Page 7 / 7 MXD8626C: Rev1.1 Copyright @2018 Maxscend Microelectronics Company, Ltd. All rights reserved. Maxscend Confidential