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ESD5Z12V-MS

ESD5Z12V-MS

  • 厂商:

    MSKSEMI(美森科)

  • 封装:

    SOD-523

  • 描述:

    ESD5Z12V-MS

  • 数据手册
  • 价格&库存
ESD5Z12V-MS 数据手册
www.msksemi.com ESD5ZXXX-MS Semiconductor Compiance Applications Cellular phones Portable devices Digital cameras Power supplies     SOD-523 Features       Small Body Outline Dimensions Low Body Height Stand−off Voltage: 2.5 V − 12 V Peak Power up to 200 Watts @ 8 x 20 _s Pulse Low Leakage Response Time is Typically < 1 ns  ESD Rating of Class 3 (> 16 kV) per Human Body Model IEC61000−4−2 Level 4 ESD Protection IEC61000−4−4 Level 4 EFT Protection We declare that the material of product compliance with RoHS requirements. S- Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable.     Absolute Ratings (Tamb=25°C ) Symbol Parameter Value Units PPP Peak Pulse Power (tp = 8/20μs) 200 W TL Maximum lead temperature for soldering during 10s 260 °C Tstg Storage Temperature Range -55 to +150 °C Top Operating Temperature Range -40 to +125 °C Tj Maximum junction temperature 150 °C ±15 ±8 KV IEC61000-4-2 (ESD) air discharge contact discharge IEC61000-4-4 (EFT) ESD Voltage 40 Per Human Body Model 16 A KV www.msksemi.com ESD5ZXXX-MS Semiconductor Electrical Parameter Symbol Parameter IPP Maximum Reverse Peak Pulse Current VC Clamping Voltage @ IPP VRWM Working Peak Reverse Voltage IR Maximum Reverse Leakage Current @ VRWM IT Test Current VBR Breakdown Voltage @ IT IF Forward Current VF Forward Voltage @ IF Electrical Characteristics Ratings at 25°C ambient temperature unless otherwise specified.VF = 0.9V at IF = 10mA Device Device Marking VRWM (V) IR(uA) VBR (V)@ IT @ VRWM (Note 1) Max Max Min mA Typ Max IT VC (V) VC (V) PPK C (W)* (pF) Max Max Typ IPP @ IPP=5 A* @ Max IPP* (A)* ESD5Z2V5-MS ZD 2.5 6.0 4.0 1.0 6.5 10.9 11.0 120 145 ESD5Z3V3-MS ZE 3.3 1.0 5.0 1.0 8.4 14.1 11.2 158 105 ESD5Z5V0-MS ZF 5.0 1.0 6.2 1.0 11.6 18.6 9.4 174 80 ESD5Z6V0-MS ZG 6.0 1.0 6.8 1.0 12.4 20.5 8.8 181 70 ESD5Z7V0-MS ZH 7.0 1.0 7.5 1.0 13.5 22.7 8.8 200 65 ESD5Z12V-MS ZM 12 1.0 13.5 1.0 17 25 9.6 240 55 *Surge current waveform per Figure 1. 1. VBR is measured with a pluse test current IT at an ambient temperature of 25℃. www.msksemi.com ESD5ZXXX-MS Semiconductor PACKAGE MECHANICAL DATA Symbol A A1 b c D E E1 E2 L 0 Dimensions In Millimeters Min Max 0.510 0.770 0.500 0.700 0.250 0.350 0.080 0.150 0.750 0.850 1.100 1.300 1.500 1.700 0.200 REF 0.010 0.070 7° REF Dimensions In Inches Min Max 0.020 0.031 0.020 0.028 0.010 0.014 0.003 0.006 0.030 0.033 0.043 0.051 0.059 0.067 0.008 REF 0.001 0.003 7° REF REEL SPECIFICATION P/N ESD5ZXXX-MS PKG SOD-523 QTY 3000 Compiance ESD5ZXXX-MS Semiconductor Compiance Attention ■ Any and all MSKSEMI Semiconductor products described or contained herein do not have specifications that can handle applications that require extremely high levels of reliability, such as life-support systems, aircraft's control systems, or other applications whose failure can be reasonably expected to result in serious physical and/or material damage. Consult with your MSKSEMI Semiconductor representative nearest you before using any MSKSEMI Semiconductor products described or contained herein in such applications. ■ MSKSEMI Semiconductor assumes no responsibility for equipment failures that result from using products at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or other parameters) listed in products specificationsof any andall MSKSEMI Semiconductor products described orcontained herein. ■ Specifications of any and all MSKSEMI Semiconductor products described or contained herein stipulate the performance, characteristics, and functions of the described products in the independent state, and are not guarantees of the performance, characteristics, and functions of the described products as mounted in the customer’s products or equipment. To verify symptoms and states that cannot be evaluated in an independent device, the customer should always evaluate and test devices mounted in the customer’sproducts orequipment. ■ MSKSEMI Semiconductor. strives to supply high-quality high-reliability products. However, any and all semiconductor products fail with someprobability. It is possiblethat these probabilistic failures could give rise to accidents or events that could endanger human lives, that could give rise to smoke or fire, or that could cause damage to other property. When designing equipment, adopt safety measures so that these kinds of accidents or events cannot occur. Such measures include but are not limited to protective circuits anderror prevention circuitsfor safedesign, redundant design, and structural design. ■ In the event that any or all MSKSEMI Semiconductor products(including technical data, services) described or contained herein are controlled under any of applicable local export control laws and regulations, such products must not be exported without obtaining the export license from theauthorities concerned in accordance with the above law. ■ No part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopying and recording, or any information storage or retrieval system, or otherwise, without the prior written permission of MSKSEMI Semiconductor. ■ Information (including circuit diagrams and circuit parameters) herein is for example only ; it is not guaranteed for volume production. MSKSEMI Semiconductor believes information herein is accurate and reliable, but no guarantees are made or implied regarding its use or any infringementsof intellectual property rights or other rightsof third parties. ■ Any and all information described or contained herein are subject to change without notice due to product/technology improvement, etc. Whendesigning equipment, referto the "Delivery Specification" for the MSKSEMI Semiconductor productthat you intend to use. www.msksemi.com
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