SCW2012F1R2KST

SCW2012F Series Wire Wound Chip Inductor 1. SHAPES AND DIMENGSIONS L(Max) W(Max) T(Max) E(Typ.) F(Typ.) D(Typ.) 1005(0402) 1.19 0.66 0.64 0.40 0.64 0.64 1608(0603) 1.80 1.25 1.20 0.64 1.02 0.64 2012(0805) 2.29 1.73 1.52 1.02 1.78 0.76 2520(1008) 2.92 2.70 2.23 1.02 2.54 1.27 3225(1210) 3.50 2.90 2.25 1.02 2.54 1.78 4532(1812) 4.80 3.40 3.15 1.14 3.05 3.00 CODE DIMENSION UNIT:mm 2. PART NUMBERING SYSTEM Rev.01 SCW 2012 F R47 J S T HF 1 2 3 4 5 6 7 8 1 PRODUCT SYMBOL（产品代号） 2 DIMENSIONS （规格尺寸） 3 MATERIAL （芯片类型） 4 INDUCTANCE（电感量） 5 TOLERANCE（公差） ：F±1%；G±2%；J±5%；K±10%；M±20% 6 TERMINAL （端电极材料）： G-金端头；S-锡端头；Y-银钯端头 7 PACKAGING （包装方式）：T-编带盘装；B –散装 8 PHOSPHATE FREE（无红磷） P age 1 of 13 www. sunltech.com SCW2012F Series 3. ELECTRICAL CHARACTERISTICS @25 SCW2012FR47*ST SCW2012F1R0*ST SCW2012F1R2*ST SCW2012F1R5*ST SCW2012F2R2*ST SCW2012F3R3*ST SCW2012F4R7*ST SCW2012F6R8*ST SCW2012F8R2*ST SCW2012F100*ST SCW2012F150*ST SCW2012F220*ST SCW2012F330*ST SCW2012F680*ST 4. Recommended Soldering Conditions PRE-HEATING SOLDERING 20~40s TP(260 　C / 10s max.) TEMPERATURE(　 C) Figure 1. Re-flow Soldering (Lead Free) NATURAL COOLING 217 60~150s 200 150 60~180s 480s max. Note： ‧Preheat circuit and products to 150℃ ‧280℃ tip temperature (max) 25 TIME( sec.) Rev.01 P age 2 of 6 www. sunltech.com SCW2012F Series PRE-HEATING SOLDERING NATURAL COOLING 0 TEMPERATURE C 260 Figure 2. Wave Soldering Note： ‧Never contact the ceramic with the iron tip ‧1.0mm tip diameter (max) 245 150 Over 2 min. Gradual Cooling Within 10 sec. PRE-HEATING SOLDERING NATURAL COOLING 3s(max.) 350 10s(max.) 330 Figure 3. Hand Soldering Note： ‧Use a 20 watt soldering iron with tip diameter of 1.0mm ‧Limit soldering time to 3 sec. 150 Gradual Cooling Over 1 min. Rev.01 P age3 of 6 www. sunltech.com SCW2012F Series 5. PACKAGING(unit: mm) Rev.01 P ag4 of 6 www. sunltech.com SCW2012F Series 6. 1 RELIABILITY TEST TEST ITEM SPECIFICATION 0402UC、0603UC、 0805UC、1008UC、 1210UC 0402IF、0805IF 、1210IF、 1812IF Operating Tempetature Range ﹣40 ～ +125℃ ﹣40 ～ +85℃ Storage Tempetature Range ﹣40 ～ +125℃ ﹣40 ～ +85℃ Rating current 150~1360mA(max) 40~1000mA (max) Current sources:33010D 1.0~8600uH Test Frequency:0.252~250MHz Test 1.0~1000uH Equpment:HP4291A、HP4286A、HP4287A、 HP4284A Test Fixture:16193Aor16334A Q 16~65(min) Test Frequency:0.252~1500MHz Test 10~35(min) Equpment:HP4291A、HP4286A、HP4287A、 Test Fixture:16193Aor16334A RDC 0.030~9.00Ω(max) 0.20~21.00Ω (max) Test Equpment:HP4263B SRF 55~12500MHz(min) 1.6~350MHz (min) Test Equpment:HP4291A Test Fixture:16193A Solderability The metalized area must have more then 90%of solder coverage Soldering Temp:230±5℃ Dippng time:5±1S Resistance to soldering heat No eviden ce of mechanical damage The mealized arer must have more then 75%of solder coverage Inductance change,less than±5% Q chanqe less than±10% Soldering Temp:260±5℃ Dippng time:10±1S Tehermal Shock No eviden ce of mechanical damage Inductance change,less than±5% Q chanqe less than±10% A cycle contain:Step1:-40℃，30Min Step2:-85℃，30Min Cycle Times:10 Inductance Rev.01 TEST CONDITION P ag 5 of 6 www. sunltech.com SCW2012F Series 6.2 RELIABILITY TEST No eviden ce of mechanical Test Temperature:125±2℃(Ceramic core)85±2 damage High Temperature Storage ℃(Ferrite core) Inductance change,less than±5% Test Time:96±2Hours Q chanqe less than±10% No eviden ce of mechanical damage Test Temperature:-40±2℃ Low Temperature Storage Inductance change,less than±5% Test Time:96±2Hours Q chanqe less than±10% No eviden ce of mechanical Test Temperature:50±2℃ damage Moisture Resistance Test Time:100Hours Inductance change,less than±5% 相对湿度90~95% Q chanqe less than±10% Amplitude:1.5mm X、Y、Z方向各 No eviden ce of mechanical 1Hours45min damage Vibration Frequency range:10~55~10Hz(min) Inductance change,less than±5% Q chanqe less than±10% No eviden ce of mechanical Force:2Kgf damage Component Adhesion No evidence of peel off or broken Test Time:5±1秒 Keep coutinuity of Winding Camber:20mm Test Board:Glass-Epoxy board Thickness:8mm Rev.01 Resistance to bend No evidence of mechanical damage Life No eviden ce of mechanical damage Inductance change,less than±5% Q chanqe less than±10% P ag 6 of 6 Test Temperature:85±2℃ Test Time:1000Hours with rating current Test Time:96±2Hours www. sunltech.com