PZ2012D221-2R0TFR01

Sunlord Specifications for Multi-layer Chip Ferrite Bead Page 1 of 10 S P E C I F I C AT I O N S Customer Product Name Multi-layer Chip Ferrite Bead Sunlord Part Number PZ2012D221-2R0TFR01 Customer Part Number [ New Released, Revised] SPEC No.: PZ10190314 【This SPEC is total 10 pages including specifications and appendix.】 【ROHS Compliant Parts】 Approved By Checked By Issued By Shenzhen Sunlord Electronics Co., Ltd. Address: Sunlord Industrial Park, Dafuyuan Industrial Zone, Guanlan, Shenzhen, China 518110 Tel: 0086-755-29832660 Fax: 0086-755-82269029 E-Mail: sunlord@sunlordinc.com 【For Customer approval Only】 Qualification Status: Full Approved By Comments: Verified By Restricted Date: Rejected Re-checked By Checked By Sunlord Specifications for Multi-layer Chip Ferrite Bead Page 2 of 10 【Version change history】 Rev. Effective Date Changed Contents Change Reasons Approved By 01 Oct.29,2019 New release / Hai Guo Sunlord Specifications for Multi-layer Chip Ferrite Bead Page 3 of 10 Caution All products listed in this specification are developed, designed and intended for use in general electronics equipment. The products are not designed or warranted to meet the requirements of the applications listed below, whose performance and/or quality require especially high reliability, or whose failure, malfunction or trouble might directly cause damage to society, person, or property. Please understand that we are not responsible for any damage or liability caused by use of the products in any of the applications below. Please contact us for more details if you intend to use our products in the following applications. 1. Aircraft equipment 2. Aerospace equipment 3. Undersea equipment 4. nuclear control equipment 5. military equipment 6. Power plant equipment 7. Medical equipment 8. Transportation equipment (automobiles, trains, ships,etc.) 9. Traffic signal equipment 10. Disaster prevention / crime prevention equipment 11. Data-processing equipment 12. Applications of similar complexity or with reliability requirements comparable to the applications listed in the above Sunlord Specifications for Multi-layer Chip Ferrite Bead 1. Scope This specification applies to PZ2012D221-2R0TFR01 of multi-layer ferrite chip bead. 2. Product Description and Identification (Part Number) 1) Description: Multi-layer ferrite chip beads. 2) Product Identification (Part Number) PZ 2012 D 221 -2R0 T F ① ② ③ ④ ⑤ ⑥ ⑦ ① R01 ⑧ ② Type PZ For Large current ③ External Dimensions(L X W) [mm] 2012 [0805] ④ Material Code D ⑤ Page 4 of 10 2.0 X 1.25 Nominal Impedance Example Nominal Value 221 220Ω Rate Current 2R0 ⑦ 2.0A HSF Products Hazardous Substance Free Products ⑥ Packing T ⑧ Design Code Tape Carrier Package R01 3. Electrical Characteristics Part Number Impedance (Ω) PZ2012D221-2R0TFR01 220±25% Z Test Freq. (MHz) DCR (Ω) Max. Ir (mA) Max. 100 0.05 2000 Impedance Frequency Characteristics PZ2012D221-2R0TFR01 400 Impedance() 300 Z R 200 100 X 0 1 10 100 1000 Frequency(MHz) 1) 2) Operating and storage temperature range (individual chip without packing): -55℃ ~ +125℃ Storage temperature range (packaging conditions): -10℃~+40℃ and RH 70% (Max.) 3000 Sunlord 4. Specifications for Multi-layer Chip Ferrite Bead Page 5 of 10 Shape and Dimensions 1) Dimensions and recommended PCB pattern for reflow soldering: See Fig.4-1, Fig.4-2 and Table 4-1. 2) Structure: See Fig. 4-3 and Fig. 4-4. Solder-resist Chip Bead C Land pattern B Fig. 4-1 A B Fig. 4-2 [Table 4-1] Unit: mm [inch] Type L W T a A B C 2012 [0805] 2.0 (+0.3, -0.1) [0.079(+0.012,-0.004)] 1.25±0.2 [0.049±0.008] 0.85±0.2 [0.033±0.008] 0.5±0.3 [0.020±0.012] 0.80~1.20 0.80~1.20 0.90~1.60 T Structure of Electro-plating ① Ferrite for Bead Series ② Internal electrode (Ag) L a T a Ferrite Sn ④-1 Terminal electrode: Inside (Ag) Ni W ④-2 ④-2 Outside (Electro-plating Ni-Sn) ④-1 ② ① ③ Ag ④ Fig. 4-4 Fig. 4-3 3) ③ Pull out electrode( Ag) Material Information: See Table 4-2. [Table 4-2] 5. Code Part Name Material Name ① Ferrite Body Ferrite Powder ② Inner Coils Silver Paste ③ Pull-out Electrode (Ag) ④-1 Terminal Electrode: Inside Ag ④-2 Electro-Plating: Ni/Sn plating Silver Paste Termination Silver Composition Plating Chemicals Test and Measurement Procedures 5.1 Test Conditions Unless otherwise specified, the standard atmospheric conditions for measurement/test as: a. Ambient Temperature: 20±15℃ b. Relative Humidity: 65±20% c. Air Pressure: 86kPa to 106kPa If any doubt on the results, measurements/tests should be made within the following limits: a. Ambient Temperature: 20±2℃ b. Relative Humidity: 65±5% c. Air Pressure: 86kPa to 106kPa 5.2 Visual Examination a. Inspection Equipment: 20× magnifier 5.3 Electrical Test 5.3.1 DC Resistance (DCR) a. Refer to Item 3. b. Test equipment (Analyzer): High Accuracy Milliohmmeter-HP4338B or equivalent. 5.3.2 Impedance (Z) a. Refer to Item 3. b. Test equipment: High Accuracy RF Impedance /Material Analyzer-E4991A or equivalent. Test fixture: HP16197A for 0603, HP16192A for 1005/1608/2012/3216/4516. Test signal: -20dBm or 50mV c. Test frequency refers to Item 3. Sunlord Specifications for Multi-layer Chip Ferrite Bead Page 6 of 10 5.3.3 Rated Current a. Refer to Item 3. b. Test equipment (see Fig. 5.3.3-1): Electric Power, Electric current meter, Thermometer. c. Measurement method (see Fig. 5.3.3-1): 1. Set test current to be 0mA. 2. Measure initial temperature of chip surface. 3. Gradually increase voltage and measure chip temperature for corresponding current. d. Definition of Rated Current (Ir): Ir is direct electric current as chip surface temperature rose just 20℃. against chip initial surface temperature(Ta). (see Fig. 5.3.3-2): Temperature (℃) Thermometer Electric Power Electric Current +20 Meter Ta Chip R 0 Rated current Fig. 5.3.3-1 Ir (mA) Fig. 5.3.3-2 e. When operating temperatures exceeding +85℃, derating of current is necessary for chip ferrite beads for which rated current is 1000mA and over. Please apply the derating curve shown in chart Fig. 5.3.3-3 according to the operating temperature. 7 6 Derated Current[A] 5 4 3 2. 2 1.5 5 1 0. 0 8 0 50 85 100 Operating Temperature[℃] Fig. 5.3.3-3 125 150 Sunlord Specifications for Multi-layer Chip Ferrite Bead Page 7 of 10 5.4 Reliability Test Items Requirements 5.4.1 Terminal Strength Test Methods and Remarks No removal or split of the termination or other defects shall occur. ② ③ ④ Chip F Mounting Pad ① Solder the bead to the testing jig (glass epoxy board shown in Fig. 5.4.1-1) using leadfree solder. Then apply a force in the direction of the arrow. 10N force for 2012 series. Keep time: 10±1s. Speed:1.0mm/s. Glass Epoxy Board Fig.5.4.1-1 5.4.2 Resistance Flexure ① No visible mechanical damage. to Type 2012[0805] a b c 1.2 4.0 1.65 ② ③ ④ Solder the bead to the test jig (glass epoxy board shown in Fig. 5.4.2-1) Using a leadfree solder. Then apply a force in the direction shown Fig. 5.4.2-2. Flexure: 2mm. Pressurizing Speed: 0.5mm/sec. Keep time: 30 sec. Unit: mm [inch] 20 10 Φ4.5 b Flexure 40 c a R230 45[1.772] 100 Fig. 5.4.2-1 5.4.3 Vibration ① ② No visible mechanical damage. Impedance change: within ±20%. Cu pad Solder mask 45[1.772] Fig. 5.4.2-2 ① ② ③ Glass Epoxy Board Fig. 5.4.3-1 Solder the bead to the testing jig (glass epoxy board shown in Fig. 5.4.3-1) using leadfree solder. The bead shall be subjected to a simple harmonic motion having total amplitude of 1.5mm, the frequency being varied uniformly between the approximate limits of 10 and 55 Hz. The frequency range from 10 to 55 Hz and return to 10 Hz shall be traversed in approximately 1 minute. This motion shall be applied for a period of 2 hours in each 3mutually perpendicular directions (total of 6 hours). 5.4.4 Dropping ① ② 5.4.5 Temperature Impedance change should be within ±20% of initial value measuring at 20℃. Temperature range: -55℃ ~ +125℃. Reference temperature: +20℃. 5.4.6 Solderability ① ② ① ② ③ ④ No visible mechanical damage. Impedance change: within ±20%. No visible mechanical damage. Wetting shall exceed 75% coverage for 0603 series; exceed 95% for others Drop chip bead 10 times on a concrete floor from a height of 100 cm. Solder temperature: 240±2℃. Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol in weight. Sunlord 5.4.7 Resistance to Soldering Heat 5.4.8 Thermal Shock Specifications for Multi-layer Chip Ferrite Bead ① ② ③ No visible mechanical damage. Wetting shall exceed 75% coverage for 0603 series; exceed 95% for others Impedance change: within ±20%. ① ② ③ ④ ⑤ Solder temperature: 260±3℃ Duration: 5 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol in weight. The chip shall be stabilized at normal condition for 1~2 hours before measuring. ① ② No mechanical damage. Impedance change: Within ±20% ① Temperature, Time: (See Fig. 5.4.8-1) -55℃ for 30±3 min→125℃ for 30±3min Transforming interval: Max. 20 sec. Tested cycle: 100 cycles. The chip shall be stabilized at normal condition for 1~2 hours before measuring. 125℃ 30 min. 30 min. ② ③ ④ Ambient Temperature -55℃ 30 min. Fig.5.4.8-1 6. Page 8 of 10 20sec. (max.) 5.4.9 Resistance to Low Temperature ① ② No mechanical damage. Impedance change: within ±20% ① ② ③ Temperature: -55±2℃ Duration: 1000+24 hours. The chip shall be stabilized at normal condition for 1~2 hours before measuring. 5.4.10 Resistance to High Temperature ① ② No mechanical damage. Impedance change: within ±20% ① ② ③ Temperature: 125±2℃. Duration: 1000+24 hours. The chip shall be stabilized at normal condition for 1~2 hours before measuring. 5.4.11 Damp Heat (Steady States) ① ② No visible mechanical damage. Impedance change: within ±20% ① ② ③ ④ Temperature: 60±2℃. Humidity: 90% to 95% RH. Duration: 1000+24 hours. The chip shall be stabilized at normal condition for 1~2 hours before measuring. 5.4.12 Loading Under Damp Heat ① ② No visible mechanical damage. Impedance change: within ±20% ① ② ③ ④ ⑤ Temperature: 60±2℃. Humidity: 90% to 95% RH. Duration: 1000+24 hours. Applied current: Rated current. The chip shall be stabilized at normal condition for 1~2 hours before measuring. 5.4.13 Loading at High Temperature (Life Test) ① ② No visible mechanical damage. Impedance change: within ±20% ① ② ③ ④ Temperature: 85±2℃ Duration: 1000+24 hours. Applied current: Rated current. The chip shall be stabilized at normal condition for 1~2 hours before measuring. Packaging, Storage 6.1 Packaging Tape Carrier Packaging: Packaging code: T a. Tape carrier packaging are specified in attached figure Fig. 6.1-1~3 b. Tape carrier packaging quantity please see the following table: Type 2012[0805] T(mm) 0.85±0.2 Tape Paper Tape Quantity 4K Sunlord (1) Specifications for Multi-layer Chip Ferrite Bead Page 9 of 10 Taping Drawings (Unit: mm) Paper Tape Top Tape Paper Tape Sprocket Hole Bottom Tape Chip Cavity Fig 6.1-1 Remark: The sprocket holes are to the right as the tape is pulled toward the user. (2) Taping Dimensions (Unit: mm) Sprocket Hole Φ1.5 (+0.1,0) Chip Cavity 1.75±0.1 Paper Tape and Reel Type B P 8.0±0.3 3.5±0.05 A 2012[0805] A B P T max H 1.5±0.2 2.3±0.2 4.0±0.1 1.1 10 T 4.0±0.1 Fig 6.1-2 Direction of Feed (3) Reel Dimensions (Unit: mm) 4.3±0.2mm C 4.0±0.1mm 8.4+1.5/-0.0mm 2.45±0.2mm 5.0±0.1mm 58±2.0mm 13.5±0.2mm 3.0±0.1mm max＜14.4mm 178±2.0mm Fig. 6.1-3 6.2 Storage a. The solderability of the external electrode may be deteriorated if packages are stored where they are exposed to high humidity. Package must be stored at 40℃ or less and 70% RH or less. b. The solderability of the external electrode may be deteriorated if packages are stored where they are exposed to dust of harmful gas (e.g. HCl, sulfurous gas of H2S). c. Packaging material may be deformed if package are stored where they are exposed to heat of direct sunlight. d. Solderability of the product s with external dimensions as 0603[0201] specified in Clause 5.4.6 shall be guaranteed for 6months from the date of delivery on condition that they are stored at the environment specified in Clause 3. For those parts, which passed more than 6 months shall be checked solder-ability before use. e. Solderability of the products, except ones with external dimensions as 0603[0201], specified in Clause 5.4.6 shall be guaranteed for 12 months from the date of delivery on condition that they are stored at the environment specified in Clause 3. For those parts, which passed more than 12 months shall be checked solder-ability before use. Sunlord 7. Specifications for Multi-layer Chip Ferrite Bead Recommended Soldering Technologies 7.1 Reflowing Profile: △ Preheat condition: 150 ~200℃/60~120sec. △ Allowed time above 217℃: 60~90sec. △ Max temp: 260℃ △ Max time at max temp: 10sec. △ Solder paste: Sn/3.0Ag/0.5Cu △ Allowed Reflow time: 2x max Page 10 of 10 Peak 260℃ max 260℃ Max Ramp Up Rate=3℃/sec. 217℃ Max Ramp Down Rate=6℃/sec. 60～90sec. 200℃ 150℃ [Note: The reflow profile in the above table is only for qualification and is not meant to specify board assembly profiles. Actual board assembly profiles must be based on the customer's specific board design, solder paste and process, and should not exceed the parameters as the Reflow profile shows.] 7.2 Iron Soldering Profile. △ Iron soldering power: Max.30W △ Pre-heating: 150 ℃ / 60sec. △ Soldering Tip temperature: 350℃Max. △ Soldering time: 3sec Max. △ Solder paste: Sn/3.0Ag/0.5Cu △ Max.1 times for iron soldering [Note: Take care not to apply the tip of the soldering iron to the terminal electrodes.] 8. 60～120sec. 25℃ Time 25℃ to Peak =8 min max 3sec. Max. 350℃ Soldering Iron Power: max. 30W Diameter of Soldering Iron 1.0mm max. Tc ℃ Supplier Information a) Supplier: Shenzhen Sunlord Electronics Co., Ltd. b) Manufacturer: Shenzhen Sunlord Electronics Co., Ltd. c) Manufacturing Address: Sunlord Industrial Park, Dafuyuan Industrial Zone, Guanlan, Shenzhen, China 518110