UMW
R
SI2310A
60V N-Channel MOSFET
■ Features
SOT–23
VDS (V) =60V
ID =3A
RDS(ON)
80m
(VGS = 10V)
RDS(ON)
95m
(V GS = 4.5V)
1. GATE
2. SOURCE
3. DRAIN
D
G
S
■ Absolute Maximum Ratings Ta = 25℃
Parameter
Symbol
Rating
Unit
Drain-Source Voltage
VD S
60
V
Gate-Source Voltage
VG S
±20
V
Continuous Drain Current
TA=25 ℃
ID
TA=70℃
2.3
Pulsed Drain Current *
Power Dissipation
3
TA=25℃
I DM
10
PD
1.38
W
0.01
W/℃
Rt hJa
90
℃/W
TJ , TSTG
-55 to 150
℃
Linear Derating Factor
Thermal R esistance.Junction-to-ambient
Junction and Storage Temperature Range
A
* 2.Pulse width ≤300us , duty cycle≤ 2%.
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1
友台半导体有限公司
UMW
R
SI2310A
60V N-Channel MOSFET
■ Electrical Characteristics Ta = 25℃
Parameter
Symbol
Drain-Source Breakdown Voltage
VDSS
Zero Gate Voltage Drain Current
IDSS
Gate-Body leakage current
Gate Threshold Voltage
Static Drain-Source On-Resistance
Testconditons
ID =250μA, VG S=0V
Typ
60
10
V DS =48, V GS =0V ,TJ=70℃
25
V DS =0V, V G S=±20V
VG S(th)
V DS =V GS ID=-250μA
1
nA
3
V
80
V GS =4.5V, I D=2A
95
mΩ
g FS
Input Capacitance
Ciss
5
Output Capacitance
C oss
Reverse Transfer Capacitance
Crss
40
Total Gate Charge
Qg
6
Gate Source Charge
Q gs
Gate Drain Charge
Q gd
3
Turn-On DelayTime
tD(on)
6
Turn-On Rise Time
tr
Turn-Off DelayTime
tD(off)
490
V GS =0V, VD S=25V, f=1MHz
VDS=48V, ID=3A ,VGS=4.5V
V GS =10V, V DS=30V,ID=1A RD=30
Ω,RG EN=3.3Ω
μA
±100
V GS =10V, ID=3A
V DS =5V, I D=3A
Unit
V
Forward Transconductance
S
780
pF
55
10
1.6
nC
5
ns
16
Turn-Off Fall Time
tf
Body Diode Reverse Recovery Time
t rr
IS =3A,dI/dt=100A/μs
25
Body Diode Reverse Recovery Charge
Q rr
IS =3A, dI /dt=100A/μs
26
Diode Forward Voltage
V SD
IS =1.2A,V GS =0V
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Max
V DS =60V, VG S=0V
IGSS
RDS(ON)
Min
3
2
nC
1.2
V
友台半导体有限公司
UMW
R
SI2310A
60V N-Channel MOSFET
10
10
8
ID , Drain Current (A)
ID , Drain Current (A)
8
10V
7.0V
5.0V
4.5V
o
T A = 150 C
10V
7.0V
5.0V
4.5V
T A =25 o C
6
V G = 3.0 V
4
2
6
V G = 3.0 V
4
2
0
0
0
1
3
2
4
0
5
1
2
3
4
5
V DS , Drain-to-Source Voltage (V)
V DS , Drain-to-Source Voltage (V)
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
105
2.0
ID=2A
99
ID=3A
V G =10V
1.8
o
T A =25 C
Normalized R DS(ON)
RDS(ON) (mΩ )
1.6
93
87
1.4
1.2
1.0
81
0.8
0.6
75
2
6
4
8
-50
10
0
50
100
150
T j , Junction Temperature ( o C)
V GS , Gate-to-Source Voltage (V)
Fig 3. On-Resistance v.s. Gate Voltage
Fig 4. Normalized On-Resistance
v.s. Junction Temperature
1.4
3
Normalized VGS(th) (V)
1.2
IS(A)
2
o
o
T j =150 C
T j =25 C
1
1.0
0.8
0.6
0.4
0
0
0.2
0.4
0.6
0.8
1
-50
1.2
V SD , Source-to-Drain Voltage (V)
50
100
150
o
Fig 5. Forward Characteristic of
Fig 6. Gate Threshold Voltage v.s.
Junction Temperature
Reverse Diode
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0
T j , Junction Temperature ( C)
3
友台半导体有限公司
UMW
R
SI2310A
60V N-Channel MOSFET
f=1.0MHz
1000
ID=3A
12
C iss
V DS = 30 V
V DS =38V
V DS =48V
10
C (pF)
VGS , Gate to Source Voltage (V)
14
8
100
6
C oss
C rss
4
2
10
0
0
3
6
9
12
1
15
5
Q G , Total Gate Charge (nC)
9
13
17
21
25
29
V DS , Drain-to-Source Voltage (V)
Fig 7. Gate Charge Characteristics
Fig 8. Typical Capacitance Characteristics
1
100.000
Normalized Thermal Response (Rthja)
Duty factor=0.5
10.000
100us
1.000
ID (A)
1ms
10ms
0.100
100ms
1s
DC
T A =25 o C
Single Pulse
0.010
0.2
0.1
0.1
0.05
PDM
0.01
t
0.01
T
Single Pulse
Duty factor = t/T
Peak Tj = PDM x Rthja + Ta
Rthja = 270℃
℃ /W
0.001
0.0001
0.001
0.1
1
10
100
0.01
0.1
1
10
100
1000
t , Pulse Width (s)
V DS , Drain-to-Source Voltage (V)
Fig 9. Maximum Safe Operating Area
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0.001
1000
Fig 10. Effective Transient Thermal Impedance
4
友台半导体有限公司
UMW
R
SI2310A
60V N-Channel MOSFET
Symbol
A
A1
A2
b
c
D
E
E1
e
e1
L
L1
θ
Dimensions In Millimeters
Min.
Max.
0.900
1.150
0.000
0.100
0.900
1.050
0.300
0.500
0.080
0.150
2.800
3.000
1.200
1.400
2.250
2.550
0.950 TYP.
1.800
2.000
0.550 REF.
0.300
0.500
0°
8°
Dimensions In Inches
Min.
Max.
0.035
0.045
0.000
0.004
0.035
0.041
0.012
0.020
0.003
0.006
0.110
0.118
0.047
0.055
0.089
0.100
0.037 TYP.
0.071
0.079
0.022 REF.
0.012
0.020
0°
8°
Marking
A10
U
Ordering information
Order code
Package
Baseqty
Deliverymode
UMW SI2310A
SOT-23
3000
Tape and reel
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5
友台半导体有限公司
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