HL-509S13RS12GW-C

HL-509S13RS12GW-C Specification 规 格 书 Customer Name： 客户名称： Customer P/N： 客户品号： Factory P/N： 公司品号： HL-509S13RS12GW-C Sending Date： 送样日期： Client approval Goozo approval Approval 客户审核 Audit Confirmation Approval 鸿利国泽审核 Audit Confirmation 核准 确认 制作 核准 确认 制作 □ Qualified □ Disqualified 接受 不接受 DATE: 日期： Address：Dangui Road NO. 1 Dantu Area Zhenjiang City Jiangsu Province 地址：江苏省镇江市丹徒区丹桂路 1 号 Tel/电话：0511-88786599 Fax/传真：0511-88786599 Web/网址：www.goozo.com.cn 注: 1.此规格书以中英文方式书写,若有冲突以中文版本为准文本. 2.此规格书的最终解释权归属江苏鸿利国泽光电科技有限公司 REV NO: A2 DATE:20191228 PAGE:1/6 HL-509S13RS12GW-C ATTENTION 注意 OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC DISCHARGE SENSITIVE DEVICES Features(特征) φ5 Double Color LEDφ5 双色 LED Low Power Consumption.低功耗 Description/描述 This devices are made with AlGaInP/ GaP  Wide Viewing Angle. 大 视 角  LED 晶片组成元素为 AlGaInP/ GaP Package:1000pcs/reel 包装:1000pcs/卷 Package Dimensions 封装尺寸 1.5 max 1.0min Pin1 1 2 Pin2 2.54 typ Pin3 2.54 typ 4.9 3 7.7 5.8 1.0 2.0min 1.GREEN 2.COMMON CATHODE 3.RED Dimension Tolerance (UNIT:mm) 尺寸误差 (单位:mm) ToleranceGrade 公差等级 0.5~3 3~6 6~30 30~120 ±0.1 ±0.2 ±0.3 ±0.5 Chip 晶片 Lens Color 透镜颜色 Material 材料 Emitting Color 发光颜色 AlGaInP Red 红色 GaP Yellow Green 黄绿光 REV NO: A2 DATE:20191228 White Diffused 白色散射 PAGE:2/6 HL-509S13RS12GW-C Optical Characteristics at Ta=25°C 光电参数 Ta=25°C Iv (mcd) @20mA(光强(mcd) @20mA) Red(AlGaInP) Part No Yellow Green (AlGaInP) Viewing Angle 发光角度 Min. Typ. Max. Min. Typ. Max. 2θ1/2 -- 130 -- -- 90 -- 70 HL-509S13RS12GW-C Note 注意: 1.2θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. 2θ1/2 是从光学中心线的发光强度为 1 / 2 的光学中心线价值的角度。 2.Tolerance of measurement of luminous intensity±15%.光强测量误差为±15%. Electrical / Optical Characteristics at Ta=25°C 光电特性 Ta=25°C Symbol Parameter 符号 参数 Red(红色) Yellow Green(黄绿光) Min Typ Max Min Typ Max Dominate Wavelength 主波长 627 630 633 567 570 573 VF Forward Voltage 正向电压 1.8 2.0 IR Reverse Current 反向电流 - Electrostatic Discharge 抗静电能力 - λD ESD Units 单位 Test Conditions 测试条件 nm IF=20mA 2.2 1.8 2.0 2.2 V 10 - 10 uA VR=5V 2000 - 2000 V / Note 注意: 1.Tolerance of measurement of forward voltage±0.1V. 正向电压的测量误差为±0.1V. 2.Tolerance of measurement of Wavelength±2.0nm. 波长的测量误差为±2.0nm. REV NO: A2 DATE:20191228 PAGE:3/6 HL-509S13RS12GW-C Absolute Maximum ratings at Ta=25℃ 绝对最大额定值 Ta=25℃ Parameter 参数 Red 红色 Greenish Yellow 浅绿黄 Units 单位 Power dissipation 消耗功率 50 50 mW DC Forward Current 直流正向电流 25 25 mA Peak Forward Current[1] 峰值正向电流[1] 100 100 mA Operating Temperature 操作温度 -30℃~85℃ Storage Temperature 储存温度 -40℃~100℃ Note 注意: 1.IFP Conditions：Pulse Width≤10msec 条件：脉冲宽度≤10msec 2.Tsol Conditions：1.6mm from the base of the epoxy bulb 条件：焊接位置离胶体底部 1.6 毫米 Reliability Performance Test Items And Result 可靠性测试项目和判定 Test Classification Test Item 测试项目 Test Conditions 测试条件 Room Temperature DC Operating Life Test 寿命测试 Ta=25℃±5℃，IF=20mA AC/RE 接受/拒收 1000 hrs 22 pcs 0/1 100 cycles 22 pcs 0/1 100 cycles 22 pcs 0/1 60℃±5℃/90% RH IF=5mA 1000 hrs 22 pcs 0/1 Ta=100℃±5℃ 1000 hrs 22 pcs 0/1 Ta=-40℃±5℃ 1000 hrs 22 pcs 0/1 Temp=260℃max T=5sec max 1times 22 pcs 0/1 Load 2.5N(0.25kgf) 0° ~ 90° ~0° 3times 22 pcs 0/1 室温直流寿命测试 Thermal Shock Test 冷热冲击 Temperature Cycle Test 高低温循环实验 Environment Test High Temperature ＆ 环境模拟 High Humidity Test 实验 高温高湿实验 High Temperature Storage 高温储存 Low Temperature Storage 低温储存 Resistance to Mechanica Test Soldering Heat 机械测试 Lead Integrity 耐焊接实验 引脚折弯实验 REV NO: A2 测试持续时间 Sample Size 样品数量 测试类别 Life Test Test Duration 100℃±5℃ 5min ↑↓ -40℃±5℃ 5min. 100℃±5℃ 30min ↑↓5min -40℃±5℃ 30min. DATE:20191228 PAGE:4/6 HL-509S13RS12GW-C If(mA) Red Red Yellowish Green 50 2.5 40 2.0 30 1.5 20 1.0 10 0.5 0 2.1 2.7 2.4 3.0 If(mA) 0.0 Vf(V) 1.8 10 0 3.3 20 40 30 50 Relative Luminous Intensity vs. Forward Current Forward Current vs. Forward Voltage Yellowish Green Yellowish Green Red 1.0 2.0 0.8 1.0 0.6 0.5 0.4 0.2 0.2 480 400 560 720 640 Ta( ℃) 0.1 WL(nm) 0.0 -40 800 Relative Luminous Intensity vs. Wavelength -20 -10 0 10 20 40 30 60 80 100 Relative Luminous Intensity vs. Ambient Temperature If(mA) 60 20° 10° 0° 10° 20° 30° 30° 50 40° 40° 40 50° 50° 60° 60° 30 70° 20 70° 80° 80° 10 Ta( ℃) 0 0 20 40 60 80 Maximum Forward Current vs.Ambient Temperature REV NO: A2 100 90° 90° 100% 50% 0% 50% Relative Luminous Intensity vs.Radiation Angle DATE:20191228 PAGE:5/6 100% HL-509S13RS12GW-C ● Dip Soldering TEMPERATURE( °C) 300 Max:260℃,5sec. Suggest:2~3sec. 250 200 150 100 Fluxing 50 30 Preheat 10 20 30 40 50 60 70 80 90 100 110 120 TIME(sec.) 1. Please avoid any external stress applied to the lead-frames and epoxy while the LEDs are at high temperature,especially during soldering 2. DIP soldering and hand soldering should not be done more than one time. 3. After soldering, avoid the epoxy lens from mechanical shock or vibration until the LEDs are back to room temerature. 4. Avoid rapid cooling during temperature ramp-down process 5. Although the soldering condition is recommended above, soldering at the lowest possible temperature is feasible for the LEDs ● IRON Soldering 300℃ Within 3 sec.,One time only. REV NO: A2 DATE:20191228 PAGE:6/6