SILICONCONTENT
TECHNOLOGY
SCT2230
17V Vin, 3A Synchronous Step-down DCDC Converter
FEATURES
•
•
•
•
•
•
•
•
•
•
•
DESCRIPTION
Wide Input Voltage: 4.2-17V
3A Continuous Output Current with Integrated
75mΩ/45mΩFETs
Wide Output Voltage Range:0.8V-7V
Quiescent Current 150uA
Cycle-by-Cycle Current Limiting
Internal 2ms Soft-Start Limits the inrush current
Fixed 750kHz Switching Frequency
Input Under-Voltage Lockout
Power save mode at light load
Over-Temperature Protection
Available in a SOT563 and TSOT23 Package
The SCT2230 is a fully integrated high efficiency
synchronous step-down DCDC converter capable of
delivering 3A current. The devices operate over a
wide input voltage range from 4.2V to 17V and fully
integrate
high-side
power
MOSFETs
and
synchronous MOSFETs with very low Rdson to
minimize the conduction loss.
With 750 kHz switching frequency, low output voltage
ripple, small external inductor and capacitor size are
achieved. SCT2230 adopts adaptive constant ONtime control architecture to achieve fast load transient
responses for step-down applications.
The SCT2230 operates in power saving mode, which
maintains high efficiency during light load operation.
APPLICATIONS
•
•
•
•
•
•
It includes full protection features, such as over
current protection, output under-voltage protection,
input under-voltage lockout, and thermal shutdown.
Flat Panel Digital TV and Monitors
Surveillance
Set Top Boxes
Networking Systems
Consumer Electronics
General Purpose
The SCT2230 requires a minimal number of external
components and is available in a space-saving
SOT563 and TSOT23-6 package.
TYPICAL APPLICATION
Power Efficiency
100
90
L1
3
5
VIN
SW
VOUT
2
C2
EN
S C T 22 30
BST
T S O T 23 -6
6
R1
C1
1
GND
FB
4
R2
C3
80
Efficiency (%)
VIN
70
60
50
40
30
SCT2230, VOUT=5V
20
SCT2230, VOUT=3.3V
10
0
1
10
100
1000
Output Current (mA)
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1
SCT2230
REVISION HISTORY
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Rev 1.0 Released to Market.
DEVICE ORDER INFORMATION
PART NUMBER
PACKAGE MARKING
PACKAGE DISCRIPTION
SCT2230TVA
2230
SOT563-6L
SCT2230TVB
2230
TSOT23-6L
* (1) FOR TAPE & REEL, ADD SUFFIX R (E.G. SCT2230TVAR).
ABSOLUTE MAXIMUM RATING
Over operating free-air temperature unless otherwise noted(1)
SYMBOL
PARAMETER
RATING
UNIT
VIN
Supply Voltage
-0.3 to 20
V
VSW
Switch Node Voltage
-1 to VIN+0.3
V
VBST
Bootstrap
VSW-0.3 to VSW+6
V
VFB
Feedback Voltage
-0.3 to 6.5
V
VEN
Enable/UVLO Voltage
-0.3 to 6.5
V
-40 to 125
C
-65 to 150
C
TJ
TSTG
(1)
(2)
Operating junction
temperature(2)
Storage temperature
Stresses beyond those listed under Absolute Maximum Rating may cause device permanent damage. The device is not guaranteed to
function outside of its Recommended Operation Conditions.
The IC includes over temperature protection to protect the device during overload conditions. Junction temperature will exceed 150°C
when over temperature protection is active. Continuous operation above the specified maximum operating junction temperature will
reduce lifetime
PIN CONFIGURATION
SOT563 Top View
TSOT23-6 Top View
(2.8mm x 2.8mm)
(1.6mm x 1.6mm)
2
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SCT2230
PIN FUNCTIONS
NAME
PIN NUMBER
SOT563 TSOT23-6
PIN FUNCTION
VIN
1
3
Power supply input. VIN supplies the power to the IC, as well as the stepdown converter switches. Drive VIN with a 4.2V to 17V power source.
Bypass VIN to GND with a suitably large capacitor to eliminate noise on the
input to the IC. See Input Capacitor.
SW
2
2
Power Switching Output. SW is the switching node that supplies power to
the output. Connect the output LC filter from SW to the output load. Note
that a capacitor is required from SW to BST to power the high-side switch.
GND
3
1
Power ground. Must be soldered directly to ground plane.
BST
4
6
Power supply for the high-side power MOSFET gate driver. Must connect a
0.1uF or greater ceramic capacitor between BST pin and SW node.
EN
5
5
Enable logic input. Floating the pin enables the device. Connect 100K
resistor to VIN to enable the device. The device has precision enable
thresholds 1.18V rising / 1.1V falling for programmable UVLO threshold and
hysteresis.
FB
6
4
Buck converter output feedback sensing voltage. Connect a resistor divider
from VOUT to FB to set up output voltage. The device regulates FB to the
internal reference of 0.8V typical.
RECOMMENDED OPERATING CONDITIONS
Over operating free-air temperature range unless otherwise noted
PARAMETER
VIN
TJ
DEFINITION
Input voltage range
Operating junction temperature
MIN
MAX
UNIT
4.2
-40
17
125
V
°C
MIN
MAX
UNIT
-2
+2
kV
-0.5
+0.5
kV
ESD RATINGS
PARAMETER
VESD
DEFINITION
Human Body Model(HBM), per ANSI-JEDEC-JS-0012014 specification, all pins(1)
Charged Device Model(CDM), per ANSI-JEDEC-JS-0022014specification, all pins(1)
(1) HBM and CDM stressing are done in accordance with the ANSI/ESDA/JEDEC JS-001-2014 specification
THERMAL INFORMATION
PARAMETER
RθJA
RθJC
THERMAL METRIC
Junction to ambient thermal resistance(1)
Junction to case thermal
resistance(1)
SOT563
TSOT23-6
120
88
8
12
UNIT
°C/W
(1) SCT provides RθJA and RθJC numbers only as reference to estimate junction temperatures of the devices. RθJA and RθJC are not a
characteristic of package itself, but of many other system level characteristics such as the design and layout of the printed circuit
board (PCB) on which the SCT2230 are mounted, and external environmental factors. The PCB board is a heat sink that is soldered
to the leads and thermal pad of the SCT2230. Changing the design or configuration of the PCB board changes the efficiency of the
heat sink and therefore the actual RθJA and RθJC.
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SCT2230
ELECTRICAL CHARACTERISTICS
VIN=12V, TJ=-40°C~125°C, typical values are tested under 25°C.
SYMBOL
PARAMETER
TEST CONDITION
MIN
Power Supply and Output
VIN
Operating input voltage
ISD
Input UVLO
Hysteresis
Shutdown current
IQ
Quiescent current
VIN_UVLO
TYP
MAX
4.0
300
1.5
4.15
4.2
VIN rising
EN=0, No load, VIN=12V
EN=2V, No load, No switching.
VIN=12V. BST-SW=5V
17
155
Enable, Soft Start and Working Modes
VEN_H
Enable high threshold
1.18
VEN_L
Enable low threshold
IEN
Enable pin input current
EN=1V
IEN_HYS
Enable pin hysteresis current
EN=1.5V
5
1.03
1.1
1
1.5
UNIT
V
V
mV
uA
uA
1.25
V
V
2
uA
6.8
uA
Power MOSFETs
RDSON_H
High side FET on-resistance
75
mΩ
RDSON_L
Low side FET on-resistance
45
mΩ
Feedback and Error Amplifier
VFB
Feedback Voltage
0.78
Current Limit
ILIM_LSD
LSD valley current limit
Switching Frequency
FSW
Switching frequency
3.2
VIN=12V, VOUT=5V
0.8
0.82
V
3.7
4.2
A
750
kHz
tON_MIN
Minimum on-time
90
ns
tOFF_MIN
Minimum off-time
220
ns
Soft Start Time
tSS
Internal soft-start time
2.5
ms
160
20
°C
Protection
TSD
4
Thermal shutdown threshold
Hysteresis
TJ rising
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SCT2230
TYPICAL CHARACTERISTICS
5.250
80
5.000
70
4.750
60
4.500
50
4.250
VOUT (V)
5.500
90
Efficiency (%)
100
40
30
SCT2230, VOUT=5V
20
SCT2230, VOUT=3.3V
10
4.000
3.750
IOUT = 0A
IOUT = 1A
3.500
IOUT = 2A
IOUT = 3A
3.250
0
1
10
100
3.000
1000
4
6
8
10
Output Current (mA)
18
125
150
20
5.08
0.808
5.06
0.806
5.04
0.804
5.02
0.802
5.00
0.800
VFB (V)
VOUT (V)
16
Figure 2. VOUT Vs. VIN
Figure 1. SCT2230 Efficiency, Vin=12V
0.798
4.98
0.796
4.96
4.94
0.794
4.92
0.792
4.90
0.790
0.788
4.88
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
-50
4.0
-25
0
Figure 2. Load Regulation
210
4.1
200
VIN Rising POR
3.9
50
75
100
Figure 4. FB Voltage Vs. Temperature
4.2
4.0
25
Temperature (°C)
IOUT (A)
190
VIN Falling UVLO
180
3.8
IQ (μA)
VIN (V)
12
14
VIN (V)
3.7
3.6
170
160
150
3.5
140
3.4
130
3.3
120
3.2
110
-50
-25
0
25
50
75
100
125
150
Temperature (°C)
-50
-25
0
25
50
75
100
125
150
Temperature (°C)
Figure 5. UVLO Vs. Temperature
Figure 6. Quiescent Current Vs. Temperature
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SCT2230
FUNCTIONAL BLOCK DIAGRAM
VIN
EN
Bootstrap
Regulator
VCC
regulator
BST
Bias&
Reference
On
Timer
PWM
comparator
Control logic
and Protection
Driver
SW
FB
Ramp
compesation
Current limitor
GND
6
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SCT2230
OPERATION
Adaptive On-time Control
The SCT2230 device is 4.2-17V input, 3A output, synchronous step-down converters with internal power MOSFETs.
Adaptive constant on-time (ACOT) control is employed to provide fast transient response and easy loop stabilization.
At the beginning of each cycle, the high-side MOSFET is turned on for a fixed one shot time ON-time period. The
one shot time is calculated by the converter’s input voltage (VIN) and the output voltage (VOUT) cycle-by-cycle
based to maintain a pseudo-fixed frequency over the input voltage range, hence it is called adaptive on-time control.
SCT2230 turns off high-side MOSFET after the fixed on time and turns on the low-side MOSFET. SCT2230 turns
off the low-side MOSFET once the output voltage dropped below the output regulation, the one-shot timer then
reset and the high-side MOSFET is turned on again. The on-time is inversely proportional to the input voltage and
proportional to the output voltage. It can be calculated using the following equation (1):
t ON =
VOUT
VIN f S
(1)
Where:
VOUT is the output voltage.
VIN is the input voltage.
fs is the switching frequency.
After an ON-time period, the regulator goes into the OFF-time period. The OFF-time period length depends on VFB
in most cases. It will end when the FB voltage decreases below 0.8V, at which point the ON-time period is triggered.
If the OFF-time period is less than the minimum OFF time, the minimum OFF time will be applied, which is around
200ns typical.
Power Saving Mode (PSM)
The SCT2230 is designed with Power Save Mode (PSM) at light load conditions for high power efficiency. The
regulator automatically reduces the switching frequency and extends Toff while no Ton changing during the light
load condition to get high efficiency and low output ripple. As the output current decreases from heavy load condition,
the inductor current decreases as well, eventually nearing zero current, this is the boundary between CCM and
DCM. The low side MOSFET is turned off when the inductor current reaches zero level. The load is provided only
by output capacitor, when FB voltage is lower than 0.8V, the next ON cycle begins. The on-time is the minimum on
time that benefits for decreasing VOUT ripple at light load condition. When the output current increases from light
to heavy load the switching frequency increases to keep output voltage. The transition point to light load operation
can be calculated using the following equation (2):
V − VOUT
ILOAD = IN
TON
2L
(2)
Where:
TON is on-time
VIN Power
The SCT2230 is designed to operate from an input voltage supply range between 4.2V to 17V, at least 0.1uF
decoupling ceramic cap is recommended to bypass the supply noise. If the input supply locates more than a few
inches from the converter, an additional electrolytic or tantalum bulk capacitor or with recommended 10uF may be
required in addition to the local ceramic bypass capacitors.
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SCT2230
Under Voltage Lockout UVLO
The SCT2230 Under Voltage Lock Out (UVLO) default startup threshold is typical 3.9V with VIN rising and shutdown
threshold is 3.6V with VIN falling. The more accurate UVLO threshold can be programmed through the precision
enable threshold of EN pin.
Enable and Start up
When applying a voltage higher than the EN high threshold (typical 1.18V/rise), the SCT2230 enables all functions
and the device starts soft-start phase. The SCT2230 has the built in 2ms soft-start time to prevent the output
overshoot and inrush current. When EN pin is pulled low, the internal SS net will be discharged to ground. Buck
operation is disabled when EN voltage falls below its lower threshold (typically 1.1V/fall).
An internal 1.5uA pull up current source connected from internal LDO power rail to EN pin guarantees that floating
EN pin automatically enables the device. For the application requiring higher VIN UVLO voltage than the default
setup, there is a 6.8uA hysteresis pull up current source on EN pin which configures the VIN UVLO voltage with an
off-chip resistor divider R3 and R4, shown in Figure 9. The resistor divider R3 and R4 are calculated by equation
(3) and (4).
EN pin is a high voltage pin, and can be directly connected to VIN to automatically start up the device with VIN
rising to its internal UVLO threshold.
VIN
I2
6.8uA
I1
1.5uA
R3
20K
EN
+
EN
1.21V
R4
Figure 7. Adjustable VIN UVLO
𝑅3 =
𝑅4 =
𝑉𝑆𝑡𝑎𝑟𝑡 (
𝑉𝐸𝑁𝐹
) − 𝑉𝑆𝑡𝑜𝑝
𝑉𝐸𝑁𝑅
𝑉𝐸𝑁𝐹
𝐼1 (1 −
𝑉𝐸𝑁𝑅
) + 𝐼2
(3)
𝑅3 × 𝑉𝐸𝑁𝐹
𝑉𝑆𝑡𝑜𝑝 − 𝑉𝐸𝑁𝐹 + 𝑅3 (𝐼1 + 𝐼2 )
(4)
Where:
•
•
8
Vstart: Vin rise threshold to enable the device
Vstop: Vin fall threshold to disable the device
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•
•
•
•
I1=1.5uA
I2=6.8uA
VENR=1.18V
VEMF=1.1V
Over Current Protection (OCP) and Hiccup Mode
In each switching cycle, the inductor current is sensed by monitoring the low-side MOSFET during the OFF period.
When the voltage between GND pin and SW pin is lower than the over current threshold voltage, the OCP will be
triggered and the controller keeps the OFF state. A new switching cycle will begin only when the measured voltage
is higher than limit voltage. If output loading continues to increase, output will dropped below the UVP, and SS pin
is discharged such that output is 0V. Then the device will count for 7 cycles of soft-start time for hiccup waiting time
and restart normally after 7 cycles’ soft-start period.
Bootstrap Voltage Regulator
An external bootstrap capacitor between BST and SW pin powers floating high-side power MOSFET gate driver.
The bootstrap capacitor voltage is charged from an integrated voltage regulator when high-side power MOSFET is
off and low-side power MOSFET is on.
The floating supply (BST to SW) UVLO threshold is 2.2V rising and hysteresis of 200mV. When the converter
operates with high duty cycle or prolongs in sleep mode for certain long time, the required time interval to recharging
bootstrap capacitor is too long to keep the voltage at bootstrap capacitor sufficient. When the voltage across
bootstrap capacitor drops below 2.2V, BST UVLO occurs. The SCT2230 intervenes to turn on low side MOSFET
periodically to refresh the voltage of bootstrap capacitor to guarantee operation over a wide duty range.
Thermal Shutdown
Once the junction temperature in the SCT2230 exceeds 160°C, the thermal sensing circuit stops converter
switching and restarts with the junction temperature falling below 140°C. Thermal shutdown prevents the damage
on device during excessive heat and power dissipation condition.
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SCT2230
APPLICATION INFORMATION
Typical Application
VIN
BST
VIN
L1
3.3μH
VOUT
3.3V
SW
EN
C1
10μF
C3
100nF
SCT2230
C0
0.1μF
R1
31.6kΩ
FB
R2
10kΩ
C2
2x22μF
GND
Figure 8. 12V Input, 3.3V/3A Output
Design Parameters
Design Parameters
Example Value
Input Voltage
12V
Output Voltage
3.3V
Output Current
3A
Switching Frequency
750kHz
Input Capacitor Selection
For good input voltage filtering, choose low-ESR ceramic capacitors. A ceramic capacitor 10μF is recommended
for the decoupling capacitor anda0.1μF ceramic bypass capacitor is recommended to be placed as close as
possible to the VIN pin of the SCT2230.
Use Equation (5) to calculate the input voltage ripple:
∆𝑉𝐼𝑁 =
(5)
𝐼𝑂𝑈𝑇
VOUT
𝑉𝑂𝑈𝑇
×
× (1 −
)
𝐶𝐼𝑁 × 𝑓𝑆𝑊
VIN
𝑉𝐼𝑁
Where:
•
CIN is the input capacitor value
•
fsw is the converter switching frequency
•
IOUT is the maximum load current
Due to the inductor current ripple, the input voltage changes if there is parasitic inductance and resistance between
the power supply and the VIN pin. It is recommended to have enough input capacitance to make the input voltage
10
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ripple less than 100mV. Generally, a 25V/10uF input ceramic capacitor is recommended for most of applications.
Choose the right capacitor value carefully with considering high-capacitance ceramic capacitors DC bias effect,
which has a strong influence on the final effective capacitance.
Inductor Selection
The performance of inductor affects the power supply’s steady state operation, transient behavior, loop stability,
and buck converter efficiency. The inductor value, DC resistance (DCR), and saturation current influences both
efficiency and the magnitude of the output voltage ripple. Larger inductance value reduces inductor current ripple
and therefore leads to lower output voltage ripple. For a fixed DCR, a larger value inductor yields higher efficiency
via reduced RMS and core losses. However, a larger inductor within a given inductor family will generally have a
greater series resistance, thereby counteracting this efficiency advantage.
Inductor values can have ±20% or even ±30% tolerance with no current bias. When the inductor current approaches
saturation level, its inductance can decrease 20% to 35% from the value at 0-A current depending on how the
inductor vendor defines saturation. When selecting an inductor, choose its rated current especially the saturation
current larger than its peak current during the operation.
To calculate the current in the worst case, use the maximum input voltage, minimum output voltage, maxim load
current and minimum switching frequency of the application, while considering the inductance with -30% tolerance
and low-power conversion efficiency.
For a buck converter, calculate the inductor minimum value as shown in equation (6).
𝐿𝐼𝑁𝐷𝑀𝐼𝑁 =
(6)
𝑉𝑂𝑈𝑇 × (𝑉𝐼𝑁𝑀𝐴𝑋 − 𝑉𝑂𝑈𝑇 )
𝑉𝐼𝑁𝑀𝐴𝑋 × 𝐾𝐼𝑁𝐷 × 𝐼𝑂𝑈𝑇 × 𝑓𝑆𝑊
Where:
•
KIND is the coefficient of inductor ripple current relative to the maximum output current.
Therefore, the peak switching current of inductor, ILPEAK, is calculated as in equation (7).
𝐼𝐿𝑃𝐸𝐴𝐾 = 𝐼𝑂𝑈𝑇 + 𝐾𝐼𝑁𝐷 ×
𝐼𝑂𝑈𝑇
2
(7)
Set the current limit of the SCT2230 higher than the peak current ILPEAK and select the inductor with the saturation
current higher than the current limit. The inductor’s DC resistance (DCR) and the core loss significantly affect the
efficiency of power conversion. Core loss is related to the core material and different inductors have different core
loss. For a certain inductor, larger current ripple generates higher DCR and ESR conduction losses and higher core
loss.
Table 1 lists recommended inductors for the SCT2230. Verify whether the recommended inductor can support the
user's target application with the previous calculations and bench evaluation. In this application, the WE's inductor
744325330 is used on SCT2230 evaluation board.
Table 1. Recommended Inductors
Part Number
L
(uH)
DCR Max
(mΩ)
Saturation Current/Heat
Rating Current (A)
Size Max
(LxWxH mm)
Vendor
744325330
3.3
5.9
15
10.5x10.5x4.7
Wurth Electronik
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SCT2230
Output Feedback Resistor Divider Selection
The SCT2230 features external programmable output voltage by using a resistor divider network R1 and R2 as
shown in the typical application circuit Figure 8. Use equation (8) to calculate the resistor divider values.
𝑅1 =
(𝑉𝑂𝑈𝑇 − 𝑉𝑟𝑒𝑓 ) × 𝑅2
𝑉𝑟𝑒𝑓
(8)
Table 2. Recommended Component Selections
Output Voltage (V)
1.2
1.5
1.8
2.5
3.3
5.0
12
SCT2231
R1 (kΩ)
4.99
8.66
12.4
21.5
31.6
52.3
R2 (kΩ)
L (µH)
C1 (µF)
C2 (µF)
C3 (nF)
10
10
10
10
10
10
1.5
1.5
2.2
2.2
3.3
3.3
10
10
10
10
10
10
2 x 22
2 x 22
2 x 22
2 x 22
2 x 22
2 x 22
100
100
100
100
100
100
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Application Waveforms
Figure 9. SW node waveform and Output Ripple
VIN=12V, IOUT=3A
Figure 10. SW node Waveform and Output Ripple
VIN=12V, IOUT=10mA
Figure 11. Power Up
VIN=12V, VOUT=3.3V, IOUT=3A
Figure 12. Power Down
VIN=12V, VOUT=3.3V, IOUT=3A
Figure 13. Load Transient
VOUT=3.3V, IOUT=0.3A to 2.7A, SR=250mA/us
Figure 14. Load Transient
VOUT=3.3V, IOUT=0.75A to 2.25A, SR=250mA/us
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Layout Guideline
The regulator could suffer from instability and noise problems without carefully layout of PCB. Radiation of highfrequency noise induces EMI, so proper layout of the high-frequency switching path is essential. Minimize the length
and area of all traces connected to the SW pin, and always use a ground plane under the switching regulator to
minimize coupling. The input capacitor needs to be very close to the VIN pin and GND pin to reduce the input supply
ripple. Place the capacitor as close to VIN pin as possible to reduce high frequency ringing voltage on SW pin as
well. Figure 15 is the recommended PCB layout of SCT2230.
The layout needs be done with well consideration of the thermal. A large top layer ground plate using multiple
thermal vias is used to improve the thermal dissipation. The bottom layer is a large ground plane connected to the
top layer ground by vias.
VOUT
GND
VIN
GND
BST
SW
EN
VIN
FB
Figure 15. PCB Layout Example
Thermal Considerations
The maximum IC junction temperature should be restricted to 125°C under normal operating conditions. Calculate
the maximum allowable dissipation, PD(max), and keep the actual power dissipation less than or equal to PD(max) . The
maximum-power-dissipation limit is determined using Equation (9).
𝑃𝐷(𝑀𝐴𝑋) =
125 − 𝑇𝐶𝐴
𝑅θJA
(9)
where
• TA is the maximum ambient temperature for the application.
• RθJA is the junction-to-ambient thermal resistance given in the Thermal Information table.
The real junction-to-ambient thermal resistance RθJA of the package greatly depends on the PCB type, layout,
thermal pad connection and environmental factor. Using thick PCB copper and soldering the GND to a large ground
plate enhance the thermal performance. Using more vias connects the ground plate on the top layer and bottom
layer around the IC without solder mask also enhance the thermal capability.
14
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SCT2230
PACKAGE INFORMATION (TSOT23-6)
TSOT23-6 TOP VIEW
TSOT23-6 BOTTOM VIEW
SYMBOL
TSOT23-6 SIDE VIEW
NOTE:
1.
2.
3.
4.
5.
6.
Drawing proposed to be made a JEDEC package outline MO220 variation.
Drawing not to scale.
All linear dimensions are in millimeters.
Thermal pad shall be soldered on the board.
Dimensions of exposed pad on bottom of package do not
include mold flash.
Contact PCB board fabrication for minimum solder mask web
tolerances between the pins.
A
A1
A2
D
E
E1
b
c
e
L
ɵ
Unit: Millimeter
MIN
TYP
MAX
------1.10
0.000
0.10
0.70
1.00
2.85
2.95
2.65
2.95
1.55
1.65
0.30
0.50
0.08
0.20
0.95(BSC)
0.30
0.60
0º
8º
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SCT2230
PACKAGE INFORMATION (SOT563)
SOT563 TOP VIEW
SOT563 BOTTOM VIEW
SYMBOL
SOT563 SIDE VIEW
NOTE:
7.
Drawing proposed to be made a JEDEC package outline MO220 variation.
8. Drawing not to scale.
9. All linear dimensions are in millimeters.
10. Thermal pad shall be soldered on the board.
11. Dimensions of exposed pad on bottom of package do not
include mold flash.
12. Contact PCB board fabrication for minimum solder mask web
tolerances between the pins.
16
A
A1
b
b1
c
c1
D
E
E1
e
L
L1
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Product Folder Links: SCT2230
Unit: Millimeter
MIN
TYP
MAX
0.53
0.6
0.000
0.05
0.19
0.27
0.18
0.2
0.23
0.11
0.16
0.1
0.11
0.12
1.5
1.6
1.7
1.5
1.6
1.7
1.1
1.2
1.3
0.50BSC
0.1
0.2
0.3
0.2
0.5
0.4
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SCT2230
TAPE AND REEL INFORMATION (TSOT23-6)
Feeding Direction
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