833802T00000

Board Level Heat Sinks P/N: 833802T00000 CUSTOMIZED HEAT SINKS ———— 400 600 800 1000 20 80 16 60 12 40 8 20 4 0 0 0 1 2 3 Heat Dissipated - Watts • Specialized Tabs, Plating • Specialized Body Configurations • Contact Applications Engineering COMAIR ROTRON, INC 8929 Terman Court, San Diego, CA 92121 Ph (858) 348-6200 Fax (858) 566-4577 E-mail: sales@comairrotron.com, Web: www.comairrotron.com 4 5 (Mounting Surface to Ambient) 200 100 Thermal Resistance - oC/ Watt • No Hardware Device Attachment • Constant Spring Force Tension • RoHS Compliant 0 (Mounting Surface) FEATURES & BENEFITS ————— Air Velocity - LFM Temp Rise Above Ambient -oC • Devices: TO-220 • Size: 13.1 x 13.2 x 24.0MM • Material: Copper, 0.6MM Thick • Type: Stamped • Finish: Tin Plate • IC Mounting: Integrated Spring • PCB Mounting: Solderable Device Leads • Package: Bulk TO-220 PRODUCT SPECIFICATIONS ———