411616B02500

Board Level Heat Sinks P/N: 411616B02500 • Hole for Device Attachment • Dual Device Cooling Heat Sink • Vertical Mounting via Solderable Pins • RoHS Compliant CUSTOMIZED HEATSINKS • Specialized Plating • Specialized Body Configurations • Contact Applications Engineering 0 200 400 600 800 1000 5 80 4 60 3 40 2 20 1 o C 100 0 0 0 4 8 12 Heat Dissipated - Watts COMAIR ROTRON, INC 8929 Terman Court, San Diego, CA 92121 Ph (858) 348-6200 Fax (858) 566-4577 E-mail: sales@comairrotron.com, Web: www.comairrotron.com 16 20 Thermal Resistance - oC/ Watt (Mounting Surface to Ambient) FEATURES & BENEFITS Air Velocity - LFM Temp Rise Above Ambient (Mounting Surface) • Devices: TO-218, TO-220 & TO-247 • Size: 25.0 x 41.6 x 38.1MM • Material: Aluminum • Type: Extruded • Finish: Black Anodized • PCB Mounting: Solderable Pins • Package: Bulk • Accessories: Hardware & Thermal Interface Material TO-218, TO-220 & TO-247 PRODUCT SPECIFICATIONS