Board Level
Heat Sinks
P/N: 821702B00000
TO--220
PRODUCT SPECIFICATIONS
• Multiple Holes for Device Attachment
• Dual Device Cooling Heat Sink
• RoHS Compliant
Customized Heat Sinks
• Specialized Plating
• Specialized Body Configurations
• Contact Applications Engineering
0
200
400
600
800
1000
100
10
80
8
60
6
40
4
20
2
0
0
0
2
4
6
Heat Dissipated - Watts
COMAIR ROTRON, INC
8929 Terman Court, San Diego, CA 92121
Ph (858) 348-6200 Fax (858) 566-4577
E-mail: sales@comairrotron.com,
Web: www.comairrotron.com
8
10
Thermal Resistance - oC/ Watt
(Mounting Surface to Ambient)
FEATURES & BENEFITS
Air Velocity - LFM
Temp Rise Above Ambient -oC
(Mounting Surface)
• Devices: TO-220
• Size: 36.8 x 19.8 x 21.6mm
• Material: Aluminum, 1.0mm Thick
• Type: Stamped
• Finish: Black Anodized
• PCB Mounting: Solderable Device Leads
• Package: Bulk
• Accessories: Hardware & Thermal Interface
Materal
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