831502B03900

Board Level Heat Sinks P/N: 831502B03900 • No Hardware Device Attachment • Constant Spring Force Tension • Vertical Mounting via Solderable Tab • RoHS Compliant CUSTOMIZED HEATSINKS • Specialized Tabs, Plating • Specialized Body Configurations • Contact Applications Engineering 200 400 600 800 1000 100 10 80 8 60 6 40 4 20 2 0 0 0 1 2 3 Heat Dissapated - Watts COMAIR ROTRON, INC 8929 Terman Court, San Diego, CA 92121 Ph (858) 348-6200 Fax (858) 566-4577 E-mail: sales@comairrotron.com, Web: www.comairrotron.com 4 5 Thermal Resistance -0C / Watt (Mounting Surface to Ambient) FEATURES & BENEFITS Air Velocity - LFM 0 Temp Rise Above Ambient - 0C (Mounting Surface) • Devices: TO-220 & TO-262 • Size: 19.0 x 12.8 x 12.7 mm • Material: Aluminum, 1.2 mm Thick • Type: Stamped • IC Mounting: Integrated Spring • PCB Mounting: Solderable Tab • Finish: Black Anodized • Package: Bulk TO-220, TO-262 PRODUCT SPECIFICATIONS