Board Level
Heat Sinks
P/N: 832700T00000 & 8327TRT00000
Air Velocity - LFM
• No Hardware Device Attachment
• Direct SMT Contact to PCB
• Solderable Legs
• RoHS Compliant
200
400
600
20
40
16
30
12
20
8
10
4
0
0
0
0.5
1
CUSTOMIZED HEATSINKS
• Specialized Body Configurations
• Contact Applications Engineering
Packaging
832700T00000
Bulk
8327TRT00000
Tape & Reel
1000
50
1.5
Heat Dissipated - Watts
Part Number
800
Notes
Contact Factory for Tape and Reel Specs
COMAIR ROTRON, INC
8929 Terman Court, San Diego, CA 92121
Ph (858) 348-6200 Fax (858) 566-4577
E-mail: sales@comairrotron.com,
Web: www.comairrotron.com
2
2.5
Thermal Resistance - oC/ Watt
(Mounting Surface to Ambient)
FEATURES & BENEFITS
0
Temp Rise Above Ambient -oC
(Mounting Surface)
• Devices: D2 PAK, TO-263
• Size: 26.2 x 12.7 x 9.9 mm
• Copper, 0.6 mm Thick
• Type: Stamped
• PCB Mounting: Surface Mount Technology
• Finish: Tin Plate
• Package: Bulk or Tape & Reel
D2 PAK, TO-263
PRODUCT SPECIFICATIONS
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