E6Q0603QBAC1UDA

1.6*0.8*0.95mm Dome Lens SMD CHIP LED E6Q0603QBAC1UDA Features: ●Long operating life ●Low Power Consumption ●Low voltage DC operated ●RoHS Compliant Application: ●Status indicator ●Industrial control panel ●Sensor status indication ●Wearable and portable devices Part Number E6Q0603QBAC1UDA Dice Material InGaN Emitted Color Blue Lens Color Water Clear Electro-Optical Characteristics(Ta=25℃, @20mA) Parameter Luminous Intensity Radiation Bandwidth Forward Voltage Luminous Flux Dominant Wavelength CIE Coordinates CIE Color Temperature Viewing Angle Reverse Current Symbol IV △λ VF Φ λd x,y Tc 2θ1/2 IR Min. 200 2.90 460 - Typ. 25 3.00 465 30 - Max. 400 3.40 472 10 Unit mcd nm v Lm nm k deg uA Absolute Maximum Ratings(Ta=25℃) Parameter Peak Forward Current(1/10 Duty Cycle, 0.1ms Pulse Width) Forward Current Reverse Voltage Electrostatic Discharge Operating Temperature Range Storage Temperature Range Reflow Soldering www.ekingluxs.com Symbol IPF IF VR ESD Topr Tstg Tsld Max. Unit 100 mA 30 mA 5 v 2000 v o -40to+90 C o -40to+90 C 260℃for 10secs Sales@ekingluxs.com 1 1.6*0.8*0.95mm Dome Lens SMD CHIP LED E6Q0603QBAC1UDA Optical & Electrical Characteristics Spectrum Distribution Relative Luminous lntensity(%) 100 75 50 25 0 400 450 500 550 Wavelength (nm) 50 50 40 40 30 20 10 0 1.6 2.0 2.4 2.8 3.2 650 700 Forward Current vs.Ambient Temperature Forward Current (mA) Forward Current (mA) Forward Current vs.Forward Voltage 600 30 20 10 0 0 3.6 20 40 60 80 100 Ambient Temperature Forward Voltage (V )-volts Relative Luminous lntensity vs.Forward Currenr 20° 10° 0° Relative Luminous lntensity 2.5 30° 2.0 40° 1.5 1.0 0.9 0.8 50° 1.0 60° 70° 80° 90° 0.6 0.4 0.2 0.5 0 0 10 20 30 40 Forward Currenr(mA) 50 0.7 0 0.1 0.3 0.5 Radiation Diagram www.ekingluxs.com Sales@ekingluxs.com 2 1.6*0.8*0.95mm Dome Lens SMD CHIP LED E6Q0603QBAC1UDA Bin Limits Bin Range Of Luminous Intensity (Unit:mcd) Bin Code L1 L2 L3 Min 200 - Max 400 - Condition IF=20mA Bin Range Of Forward Voltage (Unit:V) Bin Code V1 V2 V3 V4 V5 Min 2.9 3.0 3.1 3.2 3.3 Max 3.0 3.1 3.2 3.3 3.4 Condition IF=20mA Bin Range Of Wavelength (Unit:nm) Bin Code B1 B2 B3 B4 B5 B6 Min 460 462 464 466 468 470 Max 462 464 466 468 470 472 Condition IF=20mA Notes: 1.Tolerance of Luminous Intensity ±10% 2.Tolerance of Forward Voltage ±0.1V www.ekingluxs.com Sales@ekingluxs.com 3 1.6*0.8*0.95mm Dome Lens SMD CHIP LED E6Q0603QBAC1UDA Reliability Test Items And Conditions Test Items Reference Thermal Shock Test Conditions Time -40℃（30min） 100 -100℃（30min） Cycles -10℃~65℃； 10cycles 0%~90%RH MIL-STD-202G Temperature And Humidity Cyclic High Temperature Storage Low Temperature Storage High Temperature High Humidity Storage High Temperature Life Test JEITA ED-4701 200 203 JEITA ED -4071 200 201 JEITA ED -4071 200 202 JEITA ED -4071 100 103 JESD22-A108D Life Test Resistance to Sodering Heat GB/T 4937,Ⅱ， 2.2&2.3 Criterion 22 0/22 22 0/22 Ta=100℃ 1000H 22 0/22 Ta=-40℃ 1000H 22 0/22 1000H 22 0/22 1000H 22 0/22 1000H 22 0/22 2 times 22 0/22 Ta=60℃； RH=90% Ta=80℃ Ta=25℃ IF=20mA Tsol*=(240±5) ℃10secs JESD22-A108D Quantity Criteria For Judging Damage Test Items Forward Voltage Recerse Current Symbol VF IR Test Conditions IF=IFT VR=5V Luminous Intensity IV IF=IFT Resistance to Soldering Heat - - Criteria For Judging Damage Initial Data±10% IR≤10uA Average IV degradation≤30%；Single LED IV degradation≤50% Meterial without internal cracks,no meterial between stripped,no deaded light www.ekingluxs.com Sales@ekingluxs.com 4 1.6*0.8*0.95mm Dome Lens SMD CHIP LED E6Q0603QBAC1UDA Product size (Unit:mm) NOTES： 1. All dimensions are in millimeters (inches) 2. Tolerances are 0.2mm (0.008inch) unless otherwise noted Recommended Soldering Pad Design (Unit:mm) Taping and package Spec ●Tape Specification:4,000pcs Per Reel www.ekingluxs.com Sales@ekingluxs.com 5 1.6*0.8*0.95mm Dome Lens SMD CHIP LED E6Q0603QBAC1UDA Packaging LabelStyle www.ekingluxs.com Sales@ekingluxs.com 6 1.6*0.8*0.95mm Dome Lens SMD CHIP LED E6Q0603QBAC1UDA Useful hint Reflow Soldering Instructions 1. Don't cause stress to the LEDs while it is exposed to high temperature. 2. The maximum number of reflow soldering passes is 2 times. 3. Reflow soldering is recommended. Other soldering methods are not recommended as they might cause damage to the product. www.ekingluxs.com Sales@ekingluxs.com 7 1.6*0.8*0.95mm Dome Lens SMD CHIP LED E6Q0603QBAC1UDA Precautions 1. Storage： ●Moisture proof and anti-electrostatic package with moisture absorbent material is used, to keep moisture to aminimum. ●Before opening the package, the product should be kept at 30℃ or less and humidity less than 60% RH, and beused within a year. ●After opening the package, the product should be stored at 30℃ or less and humidity less than 10%RH, and besoldered within 24 hours (1day). It is recommended that the product be operated at the workshop condition of 30℃ or less and humidity less than 60%RH. ●If the moisture absorbent material has fade away or the LEDs have exceeded the storage time, baking treatment should be performed based on the following condition: (70±5)℃ for 24 hours. 2. Static Electricity： Static electricity or surge voltage damages the LEDs. Damaged LEDs will show some unusual characteristic such as the forward voltage becomes lower, or the LEDs do not light at the low current. even not light. All devices, equipment and machinery must be properly grounded. At the same time, it is recommended that wrist bands or anti-electrostatic gloves, anti-electrostatic containers be used when dealing with the LEDs. 3. Vulcanization： LED curing is due to sulfur being in bracket and the +1 price of silver in the chemical reaction generated Ag2S in the process. It will lead to the capacity of reflecting of silver layer reducing, light color temperature drift and serious decline ,seriously affecting the performance of the product.So we should take corresponding measures to avioding vulcanization, such as to avoid using sulphur volatile substances and keeping away from high sulphur content of the material. www.ekingluxs.com Sales@ekingluxs.com 8