BL-HZ235B-LB13-TRB

BRIGHT LED ELECTRONICS CORP. Specification for Approval ● ● SAMPLES  ATTACHED AREA  DEVICE NUMBER: BL-HZ235B-LB13-TRB CUSTOMER: PAGE DATE 2015.03.13 1 2 3 4 5 1.0 1.0 1.0 1.0 1.0 6 7 8 9 10 CONTENTS 1.0 1.0 1.0 1.0 1.0 Initial Released FOR CUSTOMER’S APPROVAL STAMP OR SIGNATURE APPROVED PURCHASE 佰鴻工業股份有限公司 MANUFACTURE ISSUED QUALITY ENGINEERING APPROVED PREPARED BRIGHT LED ELECTRONICS CORP. 新北市板橋區和平路 19 號 3 樓 張 占 任 3F., No.19, He Ping Road, Ban Qiao Dist., New Taipei City, Taiwan 2015.03.13 2015.03.13 2015.03.13 孝 嚴 旭 穎 Tel: +886-2-29591090 BRIGHT LED ELECTRONICS CORP. BL-HZ235B-LB13-TRB ● Features: 1. Emitted Color : White ●Package Dimensions: 2. Mono-color type. 2.0 3. Lens Appearance: Water Clear. 1.25 4. 2.0x1.25x1.0mm(0805) standard package. 5. Suitable for all SMT assembly methods. 6. Compatible with infrared and vapor phase 1.0±0.1 reflow solder process. 7. Compatible with automatic placement equipment. 2.0 1.25 8. This product doesn’t contain restriction Substance, comply ROHS standard. NOTES: 1.All dimensions are in millimeters (inches). 2.Tolerance is ±0.10mm (0.004”) unless otherwise specified. 3.Specifications are subject to change without notice. ● Applications: 1. Automotive : Dashboards, stop lamps, turn signals. 2. Backlighting : LCDs, Key pads advertising. 3. Status indicators : Comsumer & industrial electronics. 4. General use. ● Absolute Maximum Ratings(Ta=25℃) Parameter Symbol Rating Unit Power Dissipation Pd 72 mW Forward Current IF 20 mA Peak Forward Current ＊1 IFP 100 mA Reverse Volage VR 5 V Operating Temperature Topr -40℃~85℃ - Storage Temperature Tstg -40℃~85℃ - Soldering Temperature Tsol See Page7 - ＊ 1 Condition for IFP is pulse of 1/10 duty and 0.1msec width. Ver.1.0 Page 1 of 10 BRIGHT LED ELECTRONICS CORP. BL-HZ235B-LB13-TRB ● Electrical and optical characteristics(Ta=25℃) Parameter Symbol Condition Min. Typ. Max. Unit Forward Voltage Vf IF=2mA - 2.8 3.2 Luminous Intensity Iv IF=2mA 18.5 35 - mcd Reverse Current IR VR=5V - - 1 µA Chromaticity x IF=2mA - 0.28 - - Coordinates y IF=2mA - 0.28 - - Veiwing Angle 2θ1/2 IF=2mA - 120 - deg V ● Typical Electro-Optical Characteristics Curves Fig.2 Forward c urrent derating curve vs . ambient temperature Fig.1 Relat iv e intens it y vs . wavelength 30 25 Forward c urrent (mA) Relativ e radiant intensity 1 .0 0 .5 20 15 10 5 0 350 400 450 500 550 600 650 700 750 800 0 Wav elength (nm) 40 60 80 1 00 Fig.4 Relativ e luminous intensity vs. ambient t emperature Fig.3 Forward c urrent v s. forward voltage 50 3 .0 2 .5 30 20 10 (No rmal iz ed @ 20mA) R el ativ e Lu mi no us i ntensity 40 Forward c urrent (mA) 20 A mb i en t te mp era ture Ta( C) 2 .0 1 .5 1 .0 0 .5 0 -40 0 1 2 3 4 5 -20 Forward v oltage(V) 0 20 40 60 A mbi e n t temp e ra ture Ta( C) Fig.5 Relativ e luminous intensity v s. forward c urrent Fig.6 Radiation diagram 0 2 .0 10 20 1 .5 Relativ e radiant intensity Relativ e luminous int ensity (@20mA) 30 1 .0 0 .5 40 1 .0 0 .9 50 0 .8 60 70 0 .7 80 90 0 10 20 30 40 50 0 .5 0.3 0 .1 0 .2 0 .4 0.6 Forward c urrent (mA) Ver.1.0 Page 2 of 10 BRIGHT LED ELECTRONICS CORP. BL-HZ235B-LB13-TRB ● Tapping and packaging specifications(Units: mm) Quantity:1000-3000PCS CATHODE 8.0 ± 0.3 ANODE USER DIRECTION OF FEED ●Package Method:(unit:mm) Vacuum 12 bag/box 3000 pcs/reel 200 Bar Code Label 245 220 220 Aluminum Foil Bag 187 645 6 box/carton 200 470 Ver.1.0 Page 3 of10 BRIGHT LED ELECTRONICS CORP. BL-HZ235B-LB13-TRB ● Bin Limits I n t e n s i t y B i n L i m i ts ( A t 2 m A ) BIN CODE Min. (mcd) Max. (mcd) L 18.5 28 M 28 42 N 42 63 P 63 94 To l e r a n c e f o r e a c h B i n l i m i t i s ± 1 5 % . V F B i n L i m i ts ( A t 2 m A ) BIN CODE Min.(v) Max.(v) E 2.4 2.6 F 2.6 2.8 G 2.8 3.0 H 3.0 3.2 To l e r a n c e f o r e a c h B i n l i m i t i s ± 0 . 0 5 V ● B IN： x x x VF BIN CODE Color BIN CODE Intensity BIN CODE Ver.1.0 Page 4 of 10 BRIGHT LED ELECTRONICS CORP. BL-HZ235B-LB13-TRB C o l o r B i n L i m i ts ( A t 2 m A ) C.I.E CHROMATICITY DIAGRAM y 4-7 4-6 4-5 4-4 4-3 4-2 4-1 5-7 5-6 5-5 5-4 5-3 5-2 5-1 6-7 6-6 6-5 6-4 6-3 6-2 6-1 x Ver.1.0 Page 5 of 10 BRIGHT LED ELECTRONICS CORP. BL-HZ235B-LB13-TRB C o l o r B i n L i m i ts ( A t 2 m A ) BIN 4-1 4-2 4-3 4-4 4-5 4-6 4-7 5-1 5-2 5-3 5-4 5-5 5-6 5-7 6-1 6-2 6-3 6-4 6-5 6-6 6-7 X Y X Y X Y X Y X Y X Y X Y X Y X Y X Y X Y X Y X Y X Y X Y X Y X Y X Y X Y X Y X y Chromaticity Coordinates 0.265 0.21 0.265 0.22 0.265 0.23 0.265 0.24 0.265 0.25 0.265 0.26 0.265 0.27 0.305 0.25 0.305 0.26 0.305 0.27 0.305 0.28 0.305 0.29 0.305 0.3 0.305 0.31 0.33 0.225 0.2 0.225 0.21 0.225 0.22 0.225 0.23 0.225 0.24 0.225 0.25 0.225 0.26 0.265 0.24 0.265 0.25 0.265 0.26 0.265 0.27 0.265 0.28 0.265 0.29 0.265 0.3 0.305 0.29 0.33 0.28 0.305 0.225 0.21 0.225 0.22 0.225 0.23 0.225 0.24 0.225 0.25 0.225 0.26 0.225 0.27 0.265 0.25 0.265 0.26 0.265 0.27 0.265 0.28 0.265 0.29 0.265 0.3 0.265 0.31 0.305 0.29 0.305 0.3 0.33 0.29 0.305 0.3 0.305 0.31 0.33 0.3 0.305 0.31 0.305 0.32 0.33 0.31 0.305 0.32 0.305 0.33 0.33 0.32 0.305 0.33 0.305 0.34 0.33 0.35 0.33 0.305 0.34 0.34 0.305 0.35 0.265 0.22 0.265 0.23 0.265 0.24 0.265 0.25 0.265 0.26 0.265 0.27 0.265 0.28 0.305 0.26 0.305 0.27 0.305 0.28 0.305 0.29 0.305 0.3 0.305 0.31 0.305 0.32 0.33 0.3 0.33 0.31 0.33 0.32 0.33 0.33 0.33 0.34 0.33 0.35 0.33 0.36 Ver.1.0 Page 6 of 10 BRIGHT LED ELECTRONICS CORP. BL-HZ235B-LB13-TRB ● Reliability Test MIL-STD-750D:1026 Ta: Under room temperature Operation Life MIL-STD-883D:1005 Test time:1,000hrs JIS-C-7021 :B-1 IF=Product Recommended IF High Environmental Temperature MIL-STD-202F:103B Ta:85±5℃ Test High Humidity JIS-C-7021 :B-11 RH:90%-95% Storage Test time:240hrs Ta:100±5℃ High MIL-STD-883:1008 Test time:1,000hrs Temperature JIS-C-7021 :B-10 Storage Ta: -40±5℃ Low Temperature JIS-C-7021 :B-11 Test time=1,000hrs Storage MIL-STD-202F:107D Temperature MIL-STD-750D:1051 Ta:-35±5℃~25±5℃~85±5℃~25±5℃ 30min 5min Cycling MIL-STD-883D:1010 30min 5min JIS-C-7021 :A-2 MIL-STD-202F:107D( Ta:-40±5℃ ~+85±5℃ 10min 10 min 1980) 10cycle MIL-STD-750D:1051( Time: 20min/cycle Thermal Shock 95) MIL-STD-883D:1011(1 991) Endurance Test 0/32 0/32 0/32 0/32 0/32 0/32 Wetting balance MIL-STD-883:2003 MIL-STD-202F:208D MIL-STD-883D:2003 Ta:230±5℃ Time:5±0.5s 0/32 Solder Resistance MIL-STD-202F:210A MIL-STD-883D:1011 JIS-C-7021 :A-1 Ta:260±10℃ Time:10±1s 0/32 ● Judgment criteria of failure for the reliability Measuring items Forward voltage Reverse current Luminous intensity Note: Symbol VF ( V) IR(uA) Iv ( mcd ) Measuring conditions IF=2mA VR=5V IF=2mA Judgement criteria for failure Initial Level*1.1 Over U*2 Initial Level*0.7 1.U means the upper limit of specified characteristics. 2.Measurment shall be taken between 2 hours and after the test pieces have been returned to normal ambient conditions after completion of each test. Ver.1.0 Page7 of 10 BRIGHT LED ELECTRONICS CORP. BL-HZ235B-LB13-TRB ●IR-Reflow Soldering 260℃ Max. 10sec.Max. Above255℃ 30sec.Max. 3℃/sec.Max. 6℃/sec.Max. Above 217℃ 60~150sec. Pre-heating 150~200℃ 60~120sec. 1. Avoid any external stress applied to the resin while the LEDs are at high temperature, especially during soldering . 2. Avoid rapid cooling or any excess vibration during temperature ramp-down process 3. Although the soldering condition is recommended above, soldering at the lowest possible temperature is feasible for the LEDs Ver.1.0 Page 8 of 10 BRIGHT LED ELECTRONICS CORP. BL-HZ235B-LB13-TRB ● Dip Soldering TEMPERATURE( °C) 300 Max:260℃,5sec. Suggest:2~3sec. 250 200 150 100 Fluxing 50 30 Preheat 10 20 30 40 50 60 70 80 90 100 110 120 TIME(sec.) 1. Please avoid any external stress applied to the lead-frames and epoxy while the LEDs are at high temperature,especially during soldering 2. DIP soldering and hand soldering should not be done more than one time. 3. After soldering, avoid the epoxy lens from mechanical shock or vibration until the LEDs are back to room temerature. 4. Avoid rapid cooling during temperature ramp-down process 5. Although the soldering condition is recommended above, soldering at the lowest possible temperature is feasible for the LEDs ● IRON Soldering 300℃ Within 3 sec.,One time only. Ver.1.0 Page 9 of 10 BRIGHT LED ELECTRONICS CORP. BL-HZ235B-LB13-TRB ● Notes for designing: Care must be taken to provide the current limiting resistor in the circuit so as to drive the BRIGHT LEDs within the rated figures. Also, caution should be taken not to overload BRIGHT LEDs with instantaneous voltage at the turning ON and OFF of the circuit. When using the pulse drive care must be taken to keep the average current within the rated figures. Also, the circuit should be designed so as be subjected to reverse voltage when turning off the BRIGHT LEDs. ● Storage: In order to avoid the absorption of moisture, it is recommended to solder BRIGHT LEDs as soon as possible after unpacking the sealed envelope. If the envelope is still packed, to store it in the environment as following: (1) Temperature : 5℃-30℃(41℉)Humidity : RH 60﹪Max. (2) After this bag is opened, devices that will be applied to infrared reflow, vapor-phase reflow, or equivalent soldering process must be: a. Completed within 168 hours. b. Stored at less than 30% RH. (3) Devices require baking before mounting, if: (2) a or (2) b is not met. (4) If baking is required, devices must be baked under below conditions: 48 hours at 60℃±3℃. ● Package and Label of Products: (1) Package: Products are packed in one bag of 3000 pcs (one taping reel) and a label is attached on each bag. (2) Label: BRIGHT LED LOGO B Part No. Quantity BIN. Sealing Date x xx xx Year Month xx Day Manufacture Location Ver.1.0 Page 10 of 10