LPL4459
Lonten P-channel -30V, -6.5A, 46mΩ Power MOSFET
Description
Product Summary
These P-Channel enhancement mode power field
VDSS
-30V
effect
RDS(on).max@ VGS=-10V
46mΩ
ID
-6.5A
transistors
are
using
trench
DMOS
technology. This advanced technology has been
especially tailored to minimize on-state resistance,
provide superior switching performance, and with
stand high energy pulse in the avalanche and
commutation mode. These devices are well suited
Pin Configuration
for high efficiency fast switching applications.
Features
◆
-30V,-6.5A,RDS(ON).max=46mΩ@VGS=-10V
◆
Improved dv/dt capability
◆
Fast switching
◆
Green device available
SOP-8
Applications
◆
PWM applications
◆
Load switch
◆
Portable Equipment
Absolute Maximum Ratings
Parameter
Drain-Source Voltage
P-Channel MOSFET
Pb
TA = 25°C unless otherwise noted
Symbol
Value
Unit
VDSS
-30
V
-6.5
A
-4.1
A
Continuous drain current ( TA = 25°C )
ID
Continuous drain current ( TA= 100°C )
Pulsed drain current1)
IDM
-26
A
Gate-Source voltage
VGSS
±20
V
PD
2.9
W
TSTG
-55 to +150
°C
TJ
-55 to +150
°C
Symbol
Value
Unit
RθJA
43
°C/W
Power Dissipation ( TA = 25°C )
Storage Temperature Range
Operating Junction Temperature Range
Thermal Characteristics
Parameter
Thermal Resistance, Junction-to-Ambient
Version 1.2, May- 2019
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LPL4459
Package Marking and Ordering Information
Device
Device Package
Marking
LPL4459
SOP-8
LPL4459
Electrical Characteristics
Parameter
TJ = 25°C unless otherwise noted
Symbol
Test Condition
Min.
Typ.
Max.
Unit
Static characteristics
Drain-source breakdown voltage
BVDSS
VGS=0 V, ID=-250uA
-30
---
---
V
Gate threshold voltage
VGS(th)
VDS=VGS, ID=-250uA
-1.2
-1.7
-2.2
V
VDS=-30 V, VGS=0 V, TJ = 25°C
---
---
-1
μA
VDS=-24V, VGS=0 V, TJ = 125°C
---
---
-10
μA
Drain-source leakage current
IDSS
Gate leakage current, Forward
IGSSF
VGS=20 V, VDS=0 V
---
---
100
nA
Gate leakage current, Reverse
IGSSR
VGS=-20 V, VDS=0 V
---
---
-100
nA
VGS=-10 V, ID=-6.5 A
---
33
46
mΩ
VGS=-4.5 V, ID=-5A
---
43
72
mΩ
VDS =-5 V , ID=-6.5A
---
17
---
S
---
940
---
---
103
---
Drain-source on-state resistance
Forward transconductance
RDS(on)
gfs
Dynamic characteristics
Input capacitance
Output capacitance
Ciss
Coss
VDS = -15 V, VGS = 0 V,
pF
F = 1MHz
Reverse transfer capacitance
Crss
---
88
---
Turn-on delay time
td(on)
---
3.9
---
VDD=-15V,VGS=-10V,ID=-6.5A,
---
33.2
---
Rg=3Ω
---
39.3
---
---
9.2
---
---
11
---
---
2.44
---
---
2.92
---
---
14.6
---
Rise time
tr
ns
Turn-off delay time
td(off)
Fall time
tf
Gate resistance
Rg
VGS=0V,VDS=0V,f=1MHz
Ω
Gate charge characteristics
Gate to source charge
Gate to drain charge
Qgs
Qgd
VDS=-15 V, ID=-6.5A,
nC
VGS=-10 V
Gate charge total
Qg
Drain-Source diode characteristics and Maximum Ratings
Continuous Source Current
IS
---
---
-6.5
A
Pulsed Source Current2)
ISM
---
---
-26
A
Diode Forward Voltage
VSD
---
---
-1.2
V
VGS=0V, IS=-1A, TJ=25℃
Notes:
1: Repetitive Rating: Pulse width limited by maximum junction temperature.
2: Pulse Test:Pulse Width ≤300μs, Duty Cycle≤2%.
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LPL4459
Electrical Characteristics Diagrams
Figure 1. Typ. Output Characteristics
Figure 2. Transfer Characteristics
VGS=-4.5V,-5V,-6V,-7V,-8V,-9V,-10V
Common Source
VDS= -5 V
Pulse test
Common Source
TA = 25°C
Pulse test
VGS=-4V
-ID -Drain current (A)
-ID-Drain current (A)
From Bottom to Top
VGS=-3.5V
VGS=-3V
125°C
25°C
VGS=-2.5V
-VDS -Drain−source voltage (V)
Characteristics
Capacitance (pF)
Ciss = Cgs + Cgd (Cds = shorted)
Coss = Cds + Cgd
Crss = Cgd
Ciss
Notes:
f = 1 MHz
VGS=0 V
Coss
Figure 4. Gate Charge Waveform
Vgs = -10V
-VGS -Gate-Source Voltage (V)
Figure 3. Capacitance
-VGS -Gate−source voltage (V)
Vds = -15 V
ID = -6.5 A
Crss
-VDS -Drain-Source Voltage (V)
Total Gate Charge QG (nC)
125°C
25°C
Figure 6. Rdson-Drain Current
ON-Resistance Rdson (ohm)
-IS -Reverse Drain current (A)
Figure 5. Body-Diode Characteristics
-VSD-Source-Drain Voltage (V)
Version 1.2, May- 2019
VGS = -4.5V
VGS = -10V
-ID-Drain Current (A)
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LPL4459
Figure 7. Rdson-Junction Temperature(℃)
Figure 8. Rds(on) vs Gate Voltage
ON-Resistance Rdson (mohm)
Normalized On-Resistance
ID = -6.5A
VGS = -10V
ID = -6.5A
T -Junction Temperation (°C)
-VGS -Gate−source voltage (V)
J
Normalized Drain to Source Voltage
Figure 9.
BVdss vs. Junction temperature(℃)
Figure 10. Maximum Safe Operating Area
-ID-Drain current (A)
ID = -250uA
T -Junction Temperation (°C)
-VDS -Drain-Source Voltage (V)
J
Figure 11. Normalized Maximum Transient Thermal Impedance (RthJA)
Normalized Transient
θJA
T
J,PK
R
=T +P
C
In descending oder
DM
.Z
θJC
.RθJC
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
=43℃/W
θJA
Z
Thermal Resistance
D=Ton/T
Single Pulse
Pulse Width t (s)
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LPL4459
Test Circuit & Waveform
Figure 8. Gate Charge Test Circuit & Waveform
Figure 9. Resistive Switching Test Circuit & Waveforms
Figure 10. Unclamped Inductive Switching (UIS) Test Circuit & Waveform
Figure 11. Diode Recovery Circuit & Waveform
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LPL4459
Mechanical Dimensions for SOP-8
COMMON DIMENSIONS
SYMBOL
MILLIMETERS
INCHS
MIN
MAX
MIN
MAX
A
1.45
1.75
0.057
0.069
A1
0.05
0.25
0.002
0.010
A2
1.35
1.55
0.053
0.061
b
0.35
0.45
0.014
0.018
c
0.19
0.27
0.007
0.011
D
4.80
5.00
0.189
0.197
E
3.78
3.98
0.149
0.157
e
1.27 TYP.
0.050 TYP.
H
5.80
6.20
0.228
0.244
L
0.40
1.00
0.016
0.039
θ
0°
8°
0°
8°
SOP-8 Part Marking Information
Part Number
LPL4459
YWW
“YWW”
Date Code
Version 1.2, May-2019
6
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LPL4459
Disclaimer
The content specified herein is for the purpose of introducing LONTEN's products (hereinafter "Products").
The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics. Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into
account when designing circuits for mass production.
LONTEN does not assume any liability for infringement of patents, copyrights, or other intellectual property
rights of third parties by or arising from the use of the Products or technical information described in this
document.
The Products are not designed or manufactured to be used with any equipment, device or system which
requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to
human life or create a risk of human injury (such as a medical instrument, transportation equipment,
aerospace machinery, nuclear-reactor controller, fuel-controller or other safety device). LONTEN shall bear no
responsibility in any way for use of any of the Products for the above special purposes.
Although LONTEN endeavors to improve the quality and reliability of its products, semiconductor products
have specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain
use conditions. Please be sure to implement safety measures to guard them against the possibility of physical
injury, and injury or damage caused by fire in the event of the failure of a LONTEN product.
The content specified herein is subject to change for improvement without notice. When using a LONTEN
product, be sure to obtain the latest specifications.
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