L298N

L298 DUAL FULL-BRIDGE DRIVER .. .. . OPERATING SUPPLY VOLTAGE UP TO 46 V TOTAL DC CURRENT UP TO 4 A LOW SATURATION VOLTAGE OVERTEMPERATURE PROTECTION LOGICAL ”0” INPUT VOLTAGE UP TO 1.5 V (HIGH NOISE IMMUNITY) DESCRIPTION Multiw att15 The L298 is an integrated monolithic circuit in a 15lead Multiwatt and PowerSO20 packages. It is a high voltage, high current dual full-bridge driver designed to accept standardTTL logic levels and drive inductive loads such as relays, solenoids, DC and stepping motors. Two enableinputs are provided to enableor disable the deviceindependentlyof the input signals. The emitters of the lower transistors of each bridge are connected together and the corresponding external terminal can be used for the con- PowerSO20 O RDERING NUMBERS : L298N (Multiwatt Vert.) L298HN (Multiwatt Horiz.) L298P (PowerSO20) nectionof an externalsensing resistor. Anadditional supply input is provided so that the logic works at a lower voltage. BLOCK DIAGRAM http://www.hgsemi.com.cn 1 2018 AUG L298 ABSOLUTE MAXIMUM RATINGS Symb ol Value Unit VS Power Supply 50 V V SS Logic Supply Voltage 7 V –0.3 to 7 V 3 2.5 2 A A A VI,Ven IO Vsens Parameter Input and Enable Voltage Peak Output Current (each Channel) – Non Repetitive (t = 100µs) –Repetitive (80% on –20% off; ton = 10ms) –DC Operation Sensing Voltage –1 to 2.3 V 25 W Junction Operating Temperature –25 to 130 °C Storage and Junction Temperature –40 to 150 °C P tot Total Power Dissipation (Tcase = 75°C) Top Tstg, Tj PIN CONNECTIONS (top view) Multiwatt15 15 CURRENT SENSING B 14 OUTPUT 4 13 OUTPUT 3 12 INPUT 4 11 ENABLE B 10 INPUT 3 9 LOGIC SUPPLY VOLTAGE VSS 8 GND 7 INPUT 2 6 ENABLE A 5 INPUT 1 4 SUPPLY VOLTAGE VS 3 OUTPUT 2 2 OUTPUT 1 1 CURRENT SENSING A TAB CONNECTED TO PIN 8 D95IN240A GND 1 20 GND Sense A 2 19 Sense B N.C. 3 18 N.C. 17 Out 4 16 Out 3 Out 1 4 Out 2 5 VS 6 15 Input 4 Input 1 7 14 Enable B Enable A 8 13 Input 3 Input 2 9 12 VSS 10 11 GND GND PowerSO20 D95IN239 THERMAL DATA Symb ol Po werSO20 Mu ltiwatt15 Unit Rth j-case Thermal Resistance Junction-case Parameter Max. – 3 °C/W Rth j-amb Thermal Resistance Junction-ambient Max. 13 (*) 35 °C/W (*) Mounted on aluminum substrate http://www.hgsemi.com.cn 2 2018 AUG L298 PIN FUNCTIONS (refer to the block diagram) MW.15 Po werSO Name 1;15 2;19 Sense A; Sense B Between this pin and ground is connected the sense resistor to control the current of the load. Fun ction 2;3 4;5 Out 1; Out 2 Outputs of the Bridge A; the current that flows through the load connected between these two pins is monitored at pin 1. 4 6 VS Supply Voltage for the Power Output Stages. A non-inductive 100nF capacitor must be connected between this pin and ground. 5;7 7;9 Input 1; Input 2 6;11 8;14 Enable A; Enable B TTL Compatible Inputs of the Bridge A. 8 1,10,11,20 GND Ground. 9 12 VSS Supply Voltage for the Logic Blocks. A100nF capacitor must be connected between this pin and ground. 10; 12 13;15 Input 3; Input 4 13; 14 16;17 Out 3; Out 4 – 3;18 N.C. TTL Compatible Enable Input: the L state disables the bridge A (enable A) and/or the bridge B (enable B). TTL Compatible Inputs of the Bridge B. Outputs of the Bridge B. The current that flows through the load connected between these two pins is monitored at pin 15. Not Connected ELECTRICAL CHARACTERISTICS (VS = 42V; VSS = 5V, Tj = 25°C; unless otherwise specified) Symbol Parameter VS Supply Voltage (pin 4) VSS Logic Supply Voltage (pin 9) Test Co nditions Operative Condition Min . 4.5 Ven = H; IL = 0 Typ . VIH +2.5 Unit 46 V 5 7 V 13 50 22 70 mA mA 4 mA 24 7 36 12 mA mA 6 mA 1.5 V IS Quiescent Supply Current (pin 4) ISS Quiescent Current from VSS (pin 9) Ven = H; IL = 0 V iL Input Low Voltage (pins 5, 7, 10, 12) –0.3 ViH Input High Voltage (pins 5, 7, 10, 12) 2.3 VSS V IiL Low Voltage Input Current (pins 5, 7, 10, 12) Vi = L –10 µA IiH High Voltage Input Current (pins 5, 7, 10, 12) Vi = H ≤ VSS –0.6V 100 µA Ven = L Vi = L Vi = H Max. Vi = X Ven = L Vi = L Vi = H Vi = X 30 Ven = L Enable Low Voltage (pins 6, 11) –0.3 1.5 V Ven = H Enable High Voltage (pins 6, 11) 2.3 VSS V Ien = L Low Voltage Enable Current (pins 6, 11) Ven = L –10 µA Ien = H High Voltage Enable Current (pins 6, 11) Ven = H ≤ VSS –0.6V 30 100 µA 0.95 1.35 2 1.7 2.7 V V 1.2 1.7 1.6 2.3 V V VCEsat (H) Source Saturation Voltage IL = 1A IL = 2A VCEsat (L) Sink Saturation Voltage IL = 1A IL = 2A (5) (5) 0.85 IL = 1A IL = 2A (5) (5) 1.80 3.2 4.9 V V –1 (1) 2 V VCEsat Total Drop Vsens Sensing Voltage (pins 1, 15) http://www.hgsemi.com.cn 3 2018 AUG L298 ELECTRICAL CHARACTERISTICS (continued) Symbol Parameter Test Co nditions Min . Typ . Max. Unit T1 (Vi) Source Current Turn-off Delay 0.5 V i to 0.9 I L (2); (4) 1.5 µs T2 (Vi) Source Current Fall Time 0.9 IL to 0.1 IL (2); (4) 0.2 µs T3 (Vi) Source Current Turn-on Delay 0.5 V i to 0.1 I L (2); (4) 2 µs T4 (Vi) Source Current Rise Time 0.1 IL to 0.9 IL (2); (4) 0.7 µs T5 (Vi) Sink Current Turn-off Delay 0.5 V i to 0.9 I L (3); (4) 0.7 µs T6 (Vi) Sink Current Fall Time 0.9 IL to 0.1 IL (3); (4) 0.25 µs T7 (Vi) Sink Current Turn-on Delay 0.5 V i to 0.9 I L (3); (4) 1.6 µs T8 (Vi) Sink Current Rise Time 0.1 IL to 0.9 IL (3); (4) 0.2 µs Commutation Frequency IL = 2A T1 (Ven) fc (Vi) Source Current Turn-off Delay 0.5 V en to 0.9 IL 25 T2 (Ven) Source Current Fall Time 0.9 IL to 0.1 IL T3 (Ven) Source Current Turn-on Delay 0.5 V en to 0.1 IL T4 (Ven) Source Current Rise Time 0.1 IL to 0.9 IL T5 (Ven) Sink Current Turn-off Delay 0.5 V en to 0.9 IL (2); (4) (2); (4) (2); (4) (2); (4) T6 (Ven) Sink Current Fall Time 0.9 IL to 0.1 IL T7 (Ven) Sink Current Turn-on Delay 0.5 V en to 0.9 IL T8 (Ven) Sink Current Rise Time 0.1 IL to 0.9 IL (3); (4) (3); (4) (3); (4) (3); (4) 40 KHz 3 µs 1 µs 0.3 µs 0.4 µs 2.2 µs 0.35 µs 0.25 µs 0.1 µs 1) 1)Sensing voltage can be –1 V for t ≤ 50 µsec; in steady state V sens min ≥ – 0.5 V. 2) See fig. 2. 3) See fig. 4. 4) The load must be a pure resistor. Figure 1 : Typical Saturation Voltage vs. Output Current. Figure 2 : Switching Times Test Circuits. Note : For INPUT Switching, set EN = H For ENABLESwitching, set IN = H http://www.hgsemi.com.cn 4 2018 AUG L298 Figure 3 : Source Current Delay Times vs. Input or Enable Switching. Figure 4 : Switching Times Test Circuits. Note : For INPUT Switching, set EN = H For ENABLE Switching, set IN = L http://www.hgsemi.com.cn 5 2018 AUG L298 Figure 5 : Sink Current Delay Times vs. Input 0 V Enable Switching. Figure 6 : Bidirectional DC Motor Control. In pu ts Ven = H Ven = L L = Low http://www.hgsemi.com.cn 6 Fu nctio n C=H;D=L Forward C =L; D= H Reverse C=D Fast Motor Stop C=X;D=X Free Running Motor Stop H = High X = Don’t care 2018 AUG L298 Figure 7 : For higher currents, outputs can be paralleled. Take care to parallel channel 1 with channel 4 and channel 2 with channel 3. APPLICATION INFORMATION (Refer to the block diagram) 1.1. POWER OUTPUT STAGE Each input must be connected to the source of the driving signals by means of a very short path. TheL298integratestwo poweroutputstages(A ; B). The power output stage is a bridge configuration Turn-On and Turn-Off : Before to Turn-ON the Supand its outputs can drive an inductive load in comply Voltageand beforeto Turnit OFF, the Enableinmon or differenzialmode, dependingon the state of put must be driven to the Low state. the inputs. The current that flows through the load 3. APPLICATIONS comes out from the bridge at the sense output : an Fig 6 shows a bidirectional DC motor control Scheexternal resistor (RSA ; RSB.) allows to detect the inmatic Diagram for which only one bridge is needed. tensity of this current. The external bridge of diodes D1 to D4 is made by 1.2. INPUT STAGE four fast recovery elements (trr ≤ 200 nsec) that Each bridge is driven by means of four gates the inmust be chosen of a VF as low as possible at the put of which are In1 ; In2 ; EnA and In3 ; In4 ; EnB. worst case of the load current. The In inputs set the bridge state when The En input The sense outputvoltage can be used to control the is high ; a lowstate of the En inputinhibitsthe bridge. current amplitude by chopping the inputs, or to proAll the inputs are TTL compatible. vide overcurrent protection by switching low the enable input. 2. SUGGESTIONS The brake function (Fast motor stop) requires that A non inductive capacitor, usually of 100 nF, must the Absolute Maximum Rating of 2 Amps must be foreseen between both Vs and Vss, to ground, never be overcome. as near as possible to GND pin. When the large capacitor of the power supply is too far from the IC, a When the repetitive peak current needed from the second smaller one must be foreseen near the load is higher than 2 Amps, a paralleled configuraL298. tion can be chosen (See Fig.7). The sense resistor, not of a wire wound type, must An external bridge of diodes are required when inbe grounded near the negative pole of Vs that must ductive loads are driven and when the inputs of the be near the GND pin of the I.C. IC are chopped; Shottkydiodeswould bepreferred. http://www.hgsemi.com.cn 7 2018 AUG L298 Fig 10 shows a second two phase bipolar stepper motor control circuit where the current is controlled by the I.C. L6506. This solution can drive until 3 Amps In DC operation and until 3.5 Amps of a repetitive peak current. OnFig 8 it is shownthe driving ofa twophasebipolar stepper motor ; the needed signals to drive the inputs of the L298 are generated, in this example, from the IC L297. Fig 9 shows an example of P.C.B. designed for the application of Fig 8. Figure 8 : Two Phase Bipolar Stepper Motor Circuit. This circuit drives bipolar stepper motors with winding currents up to 2 A. The diodes are fast 2 A types. RS1 = RS2 = 0.5 Ω D1 to D8 = 2 A Fast diodes http://www.hgsemi.com.cn { VF ≤ 1.2 V @ I = 2 A trr ≤ 200 ns 8 2018 AUG L298 Figure 9 : Suggested Printed Circuit Board Layout for the Circuit of fig. 8 (1:1 scale). Figure 10 : Two Phase Bipolar Stepper Motor Control Circuit by Using the Current Controller L6506. RR and Rsense depend from the load current http://www.hgsemi.com.cn 9 2018 AUG