TAI-TECH
P1
SMD Power Inductor
TMPC1707HP-3R3MG-D
ECN HISTORY LIST
REV
DATE
DESCRIPTION
APPROVED
CHECKED
DRAWN
1.0
19/10/31
新發行
羅宜春
梁周虎
許靜
備
注
TAI-TECH
P2
SMD Power Inductor
TMPC1707HP-3R3MG-D
1. Features
1. Carbonyl Powder.
2. Compact design.
Halogen
3. High current,low DCR,high efficiency.
4. Very low acoustic noise and very low leakage flux noise.
Halogen-free
5. High reliability.
6. 100% Lead(Pb)-Free and RoHS compliant.
7. Operating temperature -40~+125℃(Including self - temperature rise)
2. Applications
Note PC power system,incl. IMVP-6
DC/DC converter .
3. Dimensions
Recommend PC Board Pattern
C
A
A`
D
3R3
1944
E
H
B
L
G
Series
TMPC1707HP
A(mm)
A’(mm)
17.6±0.4
16.9±0.3
B(mm)
16.9±0.3
C(mm)
D(mm)
6.7±0.3
2.1±0.3
11.9±0.3
4. Part Numbering
TMPC
1707
HP
A
B
C
-
A: Series
B: Dimension
C: Type
D: Inductance
E: Inductance Tolerance
F: Code
3R3
MG
D
E
-
L(mm)
E(mm)
G(mm)
H(mm)
18.5
12.2
12.5
Note: 1. The above PCB layout reference only.
2. Recommend solder paste thickness at
0.17mm and above.
D
F
BxC
HP:H:Carbonyl Powder,P:PAD broaden.
3R3=3.30uH
M=±20%
Marking: Black.3R3 and 1944(19 YY, 44 WW,follow production date).
5. Specification
Part Number
Inductance
L0 (uH)±20%
TMPC1707HP-3R3MG-D
3.30
I rms ( A )
Typ
I sat 1( A )
Typ
I sat2 ( A )
Typ
DCR
(mΩ) Typ.
@25℃
DCR
(mΩ) Max.
@25℃
28.0
45.0
54.0
3.5
3.9
Note:
1. Test frequency : L/Q: 100KHz /1.0V.
2. All test data referenced to 25℃ ambient.
3. Testing Instrument : L/Q: HP4284A,CH11025,CH3302,CH1320 ,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER.
4. Heat Rated Current (Irms) will cause the coil temperature rise approximately Δt of 40℃.
5. Saturation Current (Isat1) will cause L0
to drop approximately 20%.
Saturation Current (Isat2) will cause L0
to drop approximately 30%.
6. The part temperature (ambient + temp rise) should not exceed 125℃under worst case operating conditions.Circuit design,component,PCB trace size and
thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
7. Special inquiries besides the above common used types can be met on your requirement.
TAI-TECH
P3
6. Material List
4
5
NO
Items
1
Core
Carbonyl Powder.
2
Wire
Polyester Wire or equivalent.
3
Clip
100% Pb free solder(Ni+Sn---Plating)
4
paint
Epoxy resin
5
Ink
3
1
2
Materials
Halogen-free ketone
7. Reliability and Test Condition
Item
Performance
Operating temperature
-40~+125℃ (Including self - temperature rise)
Storage temperature
1.-10~+40℃,50~60%RH (Product with taping)
2.-40~+125℃ (on board)
Test Condition
Electrical Performance Test
Inductance
Refer to standard electrical characteristics list.
DCR
HP4284A,CH11025,CH3302,CH1320,CH1320S
LCR Meter.
CH16502,Agilent33420A Micro-Ohm Meter.
Saturation Current (Isat)
Approximately △L20%.
Approximately △L30%.
Saturation DC Current (Isat) will cause L0
to drop △L(%)
Heat Rated Current (Irms)
Approximately △T40℃
Heat Rated Current (Irms) will cause the coil temperature rise
△T(℃) without core loss.
1.Applied the allowed DC current
2.Temperature measured by digital surface thermometer
Reliability Test
Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC
J-STD-020DClassification Reflow Profiles)
Temperature: 125±2℃(Inductor)
Applied current:rated current
Duration:1000±12hrs
Measured at room temperature after placing for 24±2 hrs
Life Test
Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC
J-STD-020DClassification Reflow Profiles
Humidity:85±2﹪R.H,
Temperature:85℃±2℃
Duration:1000hrs Min. with 100% rated current
Measured at room temperature after placing for 24±2 hrs
Load Humidity
Moisture Resistance
Appearance:No damage.
Inductance:within±10% of initial value
Q:Shall not exceed the specification value.
RDC:within ±15% of initial value and shall not
exceed the specification value
Thermal
shock
Vibration
Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC
J-STD-020DClassification Reflow
Profiles
1. Baked at50℃ for 25hrs, measured at room temperature after
placing for 4 hrs.
2. Raise temperature to 65 ± 2 ℃ 90-100%RH in 2.5hrs, and
keep 3 hours, cool down to 25℃ in 2.5hrs.
3. Raise temperature to 65 ± 2 ℃ 90-100%RH in 2.5hrs, and
keep 3 hours, cool down to 25℃ in
2.5hrs,keep at 25℃ for 2 hrs then keep at -10℃ for 3 hrs
4. Keep at 25 ℃ 80-100%RH for 15min and vibrate at the
frequency of 10 to 55 Hz to 10 Hz, measure at
room temperature after placing for 1~2 hrs.
Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC
J-STD-020DClassification
Reflow Profiles
Condition for 1 cycle
Step1:-40±2℃ 30±5min
Step2:25±2℃ ≦0.5min
Step3:125±2℃ 30±5min
Number of cycles: 500
Measured at room temperature after placing for 24±2 hrs
Preconditioning: Run through IR reflow for 2
times.( IPC/JEDECJ-STD-020DClassification Reflow Profiles)
Oscillation Frequency: 10Hz~2KHz~10Hz for 20 minutes
Equipment: Vibration checker
Total Amplitude: 10g
Testing Time : 12 hours(20 minutes, 12 cycles each of 3
orientations)。
TAI-TECH
P4
Item
Performance
Bending
Shock
Solder ability
Appearance:No damage.
Impedance:within±15% of initial value
Inductance:within±10% of initial value
Q:Shall not exceed the specification value.
RDC:within ±15% of initial value and shall not
exceed the specification value
More than 95% of the terminal electrode should
be covered with solder。
Test Condition
Shall be mounted on a FR4 substrate of the
following dimensions: >=0805 inch(2012mm):40x100x1.2mm
=0805 inch(2012mm):1.2mm
0805:1kg ,
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