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S08OT381-066

S08OT381-066

  • 厂商:

    GOERTEK(歌尔)

  • 封装:

    MIC_3.76X2.95MM_SM

  • 描述:

    S08OT381-066

  • 数据手册
  • 价格&库存
S08OT381-066 数据手册
Confidential Degree : Confidential Specification of MEMS Microphone (RoHS Compliance & Halogen Free) Customer Name : Customer Model : GoerTek Model : S08OT381-066 GoerTek CUSTOMER APPROVAL DESIGN Jasen 2018.11.10 CHKD Samual 2018.11.10 STANDARD Sweety 2018.11.10 APVD Daniel 2018.11.10 Tel : + 86 536 3051234 E- Mail : goertek@goertek.com Website: http://www.goertek.com Address: No.268 Dongfang Road, High-Tech Industry Development District, Weifang, Shandong, P.R.C. Version: 1.0 Confidential in Goertek, shall not be spread if not be privileged. page 1/14 Confidential Degree : Confidential Restricted 1 Security Warning The information contained in this document is the exclusive property of GoerTek Inc. and should not be disclosed to any third party without the written consent of GoerTek Inc. 2 Publication History Version Description Date Author Approved 1.0 New Design 2018.11.10 Jasen Daniel Confidential in Goertek, shall not be spread if not be privileged. page 2/14 Confidential Degree : Confidential Contents 1 Introduction 4 2 Test Condition 4 3 Acoustic and Electrical Characteristics 4 4 Frequency Response Curve and Limits 4 5 Measurement Circuit 5 6 Test Setup Drawing 5 7 Mechanical Characteristics 6 7.1 Appearance Drawing 7.2 Weight 6 6 8 Reliability Condition 7 8.1 8.2 8.3 8.4 8.5 8.6 8.7 8.8 8.9 Vibration Test Drop Test Temperature Test Humidity Test Mechanical Shock Test Thermal Shock Test Reflow Test Electrostatic Discharge Test Air Blow Test 9 Package 7 7 7 7 7 7 7 7 7 8 8 9 9 10 9.1 Tape Specification 9.2 Reel Dimension 9.3 The Content of Box 9.4 Packing Explain 10 Storage and Transportation 10 11 Land Pattern Recommendation 11 11.1 The Pattern of MIC Pad 11.2 Recommended Soldering Surface Land Pattern 12 Soldering Recommendation 12.1 Soldering Machine Condition 12.2 The Drawing and Dimension of Nozzle 12.3 Reflow Profile 13 Cautions 11 11 12 12 12 13 14 13.1 Board Wash Restrictions 13.2 Nozzle Restrictions 13.3 Ultrasonic Restrictions 14 14 14 14 Output Inspection Standard 14 Confidential in Goertek, shall not be spread if not be privileged. page 3/14 Confidential Degree : Confidential 1 Introduction MEMS MIC which is able to endure reflow temperature up to 260 ℃ for 50 seconds can be used in SMT process. It is widely used in telecommunication and electronics device such as mobile phone, MP3, PDAs etc. 2 Test Condition (Vs=2.0V, L=50cm) StandardConditions (As IEC 60268-4) Environment Conditions Basic Test Conditions Air pressure Humidity Temperature +15℃~ +35℃ 25%R.H.~75%R.H. 86kPa~106kPa +20℃ ± 2℃ 60%R.H.~70%R.H. 86kPa~106kPa 3 Acoustic and Electrical Characteristics Symbol Test Conditions Min Typ Max Sensitivity S f=1kHz, Pin=1Pa -39 -38 -37 Directivity D(θ) Output Impedance Zout Item 200 f=1kHz, Pin=1Pa 1.5 I Current Consumption Decreasing Voltage Characteristic S/N Ratio △S S/N(A) Power Supply Rejection PSR Power Supply Rejection Ratio PSRR dBV/Pa Omnidirectional VS Operating Voltage Range Unit Ω 2.0 3.6 V 90 150 μA f=1kHz, Pin=1Pa Vs =3.3 → 1.5V No Change dBV/Pa f=1kHz, Pin=1Pa (A-weighted) 63 dB -95 dBV 65 dB 100mVpp Square wave@217Hz VDD=2.0V, A-weighted 200mVpp sinewave,1kHz, VDD=2.0V Total Harmonic Distortion THD 94dB SPL@1 kHz 0.1 % Acoustic Overload Point AOP 10% THD @1 kHz 127 dB SPL Relative Response (dB) 4 Frequency Response Curve and Limits +15 +10 +5 +3 +3 +3 +3 +6 -3 -3 -3 -3 0 -5 -3 -10 -15 100 200 300 500 1k 1.1k Frequency (Hz) Confidential in Goertek, shall not be spread if not be privileged. 3k 5k 8k page 4/14 Confidential Degree : Confidential 5 Measurement Circuit Term.1 (Power) CP VDD + 2.0V Filter Term.4 (Output) Amp OUTPUT C=10μF Term.2.3(GND) MEMS Microphone GND 6 Test Setup Drawing Power Amplifier Free-field 1/2" Microphone Audio Analyzer 50cm Speaker MIC Input Output Power&Load Remote Control Turn Table Anechoic Room Confidential in Goertek, shall not be spread if not be privileged. page 5/14 Confidential Degree : Confidential 7 Mechanical Characteristics 7.1 Appearance Drawing (Unit: mm) W 1.475 H 1.13 AP 1 4 2 3 Y L L L 1.23 L 1.23 4 0.85 0.85 Top View Pin# Function Identification Number Bottom View Item Dimension Tol.(±) Units 1 Power Length 3.76 0.10 mm 2 GND Width 2.95 0.10 mm 3 GND Height 1.10 0.10 mm 4 Output Ø0.325 0.10 mm Acoustic Port (AP) Note: 1. Tolerance ±0.10mm unless otherwise specified. 2. Identification Number Convention: Job Identification Number. Identification G W W D Number Y LLL G : GoerTek Y :Year WW :Week L L L D :Day : Lot Number 2D Code 7.2 Weight The weight of the MIC is Less than 0.04g. Confidential in Goertek, shall not be spread if not be privileged. page 6/14 Confidential Degree : Confidential 8 Reliability Condition 8.1 Vibration Test To be no interference in operation after vibrations, 4 cycles, from 20 to 2,000Hz in each direction(X,Y,Z), 48 minutes, using peak acceleration of 20g, sensitivity should vary within ±3dB from initial sensitivity. (The measurement to be done after 2 hours of conditioning at +15 ℃~+35℃, R.H.25%~75%) 8.2 Drop Test To be no interference in operation after dropped to 1.0cm steel plate 12 times from 1.5 meter height in state of JIG, JIG weight of 150g, sensitivity should vary within ±3dB from initial sensitivity. (The measurement to be done after 2 hours of conditioning at +15 ℃~+35℃, R.H.25%~75%) a) After exposure at +125 ℃ for 200 hours, sensitivity should vary within ±3dB from initial sensitivity. (The measurement to be done after 2 hours of conditioning at +15 ℃~+35℃, R.H.25%~75%) 8.3 Temperature b) After exposure at -40 ℃ for 200 hours, sensitivity should vary within ±3dB from initial Test sensitivity. (The measurement to be done after 2 hours of conditioning at +15 ℃~+35℃, R.H.25%~75%) 8.4 Humidity Test After exposure at +85 ℃ and 85% relative humidity for 200 hours, sensitivity should vary within ±3dB from initial sensitivity. (The measurement to be done after 2 hours of conditioning at +15 ℃~+35℃, R.H.25%~75%) 8.5 Mechanical Shock Test Then subject samples to three one-half sine shock pulses (3000 g for 0.3 milliseconds) in each direction (for six axes in total) along each of the three mutually perpendicular axes for a total of 18 shocks, sensitivity should vary within ±3dB from initial sensitivity. (The measurement to be done after 2 hours of conditioning at +15 ℃~+35℃, R.H.25%~75%) 8.6 Thermal Shock Test After exposure at -40 ℃ for 30 minutes, at +125℃ for 30 minutes (change time 20 seconds) 32 cycles, sensitivity should vary within ±3dB from initial sensitivity. (The measurement to be done after 2 hours of conditioning at +15 ℃~+35℃, R.H.25%~75%) 8.7 Reflow Test Adopt the reflow curve of item 12.3, after three reflows, sensitivity should vary within ±2dB from initial sensitivity. (The measurement to be done after 2 hours of conditioning at +15 ℃~+35℃, R.H.25%~75%) 8.8 Electrostatic Discharge Test Under C=150pF, R=330ohm. Tested to ±8KV contact to the case and tested to ±2kV contact to I/O terminals.10 times. Grounding. Sensitivity should vary within ±3dB from initial sensitivity. (The measurement to be done after 2 hours of conditioning at +15 ℃~+35℃, R.H.25%~75%) 8.9 Air Blow Test 0.4MPa, 30mm, 10s, airgun diameter: 1mm, 20pcs. Sensitivity should vary within 3dB from initial sensitivity. (The measurement to be done after 2 hours of conditioning at +15 ℃~+35℃, R.H.25%~75%) Confidential in Goertek, shall not be spread if not be privileged. page 7/14 Confidential Degree : Confidential 9 Package 9.1 Tape Specification P0 P2 E ØD0 A B Power W F A B P1 R ØD1 B-B A-A T 10° A0 10° B0 K0 The Dimensions as Follows: ITEM W E F ØD0 ØD1 DIM(mm) 12.0±0.30 1.75±0.10 5.5±0.05 1.50+0.10 0 1.50+0.10 0 ITEM P0 10P0 P1 A0 B0 DIM(mm) 4.00±0.10 40.00±0.20 8.00±0.10 3.28±0.05 4.03±0.05 ITEM K0 P2 T R DIM(mm) 1.30±0.10 2.00±0.05 0.30±0.05 0.25±0.10 Confidential in Goertek, shall not be spread if not be privileged. page 8/14 Confidential Degree : Confidential 9.2 Reel Dimension 7'' reel for sample stage 13'' reel will be provided for the mass production stage The following is 13'' reel dimensions (unit:mm) 12.4±0.2 inner side DETAIL A A 1.9±0.4 Ø100±0.5 Ø330(max) Ø21±0.4 Ø13±0.2 120° 9.3 The Content of Box(13'' reel) Packing (5,000PCS) Two Inner Box(50,000PCS) Inner Box(25,000PCS) (340mm 135mm 355mm) Outer Box(50,000PCS) (370mm 300mm 390mm) Confidential in Goertek, shall not be spread if not be privileged. page 9/14 Confidential Degree : Confidential 9.4 Packing Explain 9.4.1 The Label Content of the Reel 1 12 1 0 1 12 9 87 3 6 54 xx xx x xx xx xxxx x xx x xx x xx xxxx x x xx x xx x xx The Content Includes: Product type, Lot, Customer P/N; and other essential information such as Quantity, Date etc. 9.4.2 The RoHS Label 1 121 10 1 2 9 87 3 RoHS Compliance Mark& Halogen Free 6 54 RoHS HF 10 Storage and Transportation 10.1 Keep MEMS MIC in warehouse with less than 75% humidity and without sudden temperature change, acid air, any other harmful air or strong magnetic field. Recommend storage period no more than 1 year and floor life(out of bag) at factory no more than 4 weeks. 10.2 The MEMS MIC with normal pack can be transported by ordinary conveyances. Please protect products against moist, shock, sunburn and pressure during transportation. 10.3 Storage Temperature Range :-40℃~+70℃(Microphone units with package ) 10.4 Operating Temperature Range :-40℃~+105℃ Confidential in Goertek, shall not be spread if not be privileged. page 10/14 Confidential Degree : Confidential 11 Land Pattern Recommendation 11.1 The Pattern of MIC Pad(Unit:mm) 4 2 3 1.23 1.23 1 0.85 0.85 4-Ø0.8 1.23 1.23 11.2 Recommended Soldering Surface Land Pattern(Unit:mm) 0.85 0.85 4-Ø0.8 Confidential in Goertek, shall not be spread if not be privileged. page 11/14 Confidential Degree : Confidential 12 Soldering Recommendation 12.1 Soldering Machine Condition 8 zones Temperature Control Heater Type Hot Air Solder Type Lead-free 12.2 The Drawing and Dimension of Nozzle Nozzle Diameter: Φ1.0mm 2.11 3.76 1.13 1.475 AP Forbidden area for vacuum application Recommendation area for pick up 2.75 Please don't vacuum over the acoustic port directly. The recommendation is for reference. Ø1.0 Confidential in Goertek, shall not be spread if not be privileged. page 12/14 Confidential Degree : Confidential 12.3 Reflow Profile Temp. °C Tp Max. Ramp-up rate = 3 ℃/s Max. Ramp-down rate = 6 ℃/s TL Tsmax Preheat area tp tL Tsmin ts 25 time 25℃ to peak Time. sec Key Features of The Profile: Average Ramp-up rate(T smax to Tp) 3℃/s max. Preheat : Temperature Min(T smin) Temperature Max(T smax ) Time(Tsmin to Tsmax )(ts) 150℃ 200℃ 60~180s Time maintained above : Tempreature(TL) Time(tL) 217℃ 60~150s Peak Temperature(T p) 260℃ Time within 5 ℃ of actual Peak Temperature(t p) : 30~40s Ramp-down rate(T p to Tsmax ) 6℃/s max Time 25℃ to Peak Temperature 8min max When MEMS MIC is soldered on PCB, the reflow profile is set according to solder paste and the thickness of PCB etc. Confidential in Goertek, shall not be spread if not be privileged. page 13/14 Confidential Degree : Confidential 12.4 Rework (1) 250℃~270℃, maximum 30 sec ,Peak temperature 330 ℃. (2) Wind speed: 15L/m. (3) It is very important not to put a heatgun over the acoustic port of the microphone. 13 Cautions 13.1 Board Wash Restrictions It is very important not to board wash the PCBA after reflow process, otherwise this could damage the microphone. 13.2 Vacuum Restrictions It is very important not to put a vacuum over the acoustic port of the microphone. otherwise this could damage the microphone. 13.3 Ultrasonic Restrictions It is very important not to use ultrasonic process. otherwise this could damage the microphone. 14 Output Inspection Standard Output inspection standard is executed according to . Confidential in Goertek, shall not be spread if not be privileged. page 14/14
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