Confidential Degree : Confidential
Specification of MEMS
Microphone
(RoHS Compliance & Halogen Free)
Customer Name :
Customer Model :
GoerTek Model : S08OT381-066
GoerTek
CUSTOMER APPROVAL
DESIGN
Jasen
2018.11.10
CHKD
Samual
2018.11.10
STANDARD
Sweety
2018.11.10
APVD
Daniel
2018.11.10
Tel : + 86 536 3051234
E- Mail : goertek@goertek.com
Website: http://www.goertek.com
Address: No.268 Dongfang Road, High-Tech Industry
Development District, Weifang, Shandong, P.R.C.
Version: 1.0
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Restricted
1 Security Warning
The information contained in this document is the exclusive property of GoerTek
Inc. and should not be disclosed to any third party without the written consent of
GoerTek Inc.
2 Publication History
Version
Description
Date
Author
Approved
1.0
New Design
2018.11.10
Jasen
Daniel
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Contents
1 Introduction
4
2 Test Condition
4
3 Acoustic and Electrical Characteristics
4
4 Frequency Response Curve and Limits
4
5 Measurement Circuit
5
6 Test Setup Drawing
5
7 Mechanical Characteristics
6
7.1 Appearance Drawing
7.2 Weight
6
6
8 Reliability Condition
7
8.1
8.2
8.3
8.4
8.5
8.6
8.7
8.8
8.9
Vibration Test
Drop Test
Temperature Test
Humidity Test
Mechanical Shock Test
Thermal Shock Test
Reflow Test
Electrostatic Discharge Test
Air Blow Test
9 Package
7
7
7
7
7
7
7
7
7
8
8
9
9
10
9.1 Tape Specification
9.2 Reel Dimension
9.3 The Content of Box
9.4 Packing Explain
10 Storage and Transportation
10
11 Land Pattern Recommendation
11
11.1 The Pattern of MIC Pad
11.2 Recommended Soldering Surface Land Pattern
12 Soldering Recommendation
12.1 Soldering Machine Condition
12.2 The Drawing and Dimension of Nozzle
12.3 Reflow Profile
13 Cautions
11
11
12
12
12
13
14
13.1 Board Wash Restrictions
13.2 Nozzle Restrictions
13.3 Ultrasonic Restrictions
14
14
14
14 Output Inspection Standard
14
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1 Introduction
MEMS MIC which is able to endure reflow temperature up to 260 ℃ for 50 seconds can be
used in SMT process. It is widely used in telecommunication and electronics device such as
mobile phone, MP3, PDAs etc.
2 Test Condition (Vs=2.0V, L=50cm)
StandardConditions
(As IEC 60268-4)
Environment Conditions
Basic Test Conditions
Air pressure
Humidity
Temperature
+15℃~ +35℃
25%R.H.~75%R.H.
86kPa~106kPa
+20℃ ± 2℃
60%R.H.~70%R.H.
86kPa~106kPa
3 Acoustic and Electrical Characteristics
Symbol
Test Conditions
Min
Typ
Max
Sensitivity
S
f=1kHz, Pin=1Pa
-39
-38
-37
Directivity
D(θ)
Output Impedance
Zout
Item
200
f=1kHz, Pin=1Pa
1.5
I
Current Consumption
Decreasing Voltage Characteristic
S/N Ratio
△S
S/N(A)
Power Supply Rejection
PSR
Power Supply Rejection Ratio
PSRR
dBV/Pa
Omnidirectional
VS
Operating Voltage Range
Unit
Ω
2.0
3.6
V
90
150
μA
f=1kHz, Pin=1Pa
Vs =3.3 → 1.5V
No Change
dBV/Pa
f=1kHz, Pin=1Pa (A-weighted)
63
dB
-95
dBV
65
dB
100mVpp Square wave@217Hz
VDD=2.0V, A-weighted
200mVpp sinewave,1kHz,
VDD=2.0V
Total Harmonic Distortion
THD
94dB SPL@1 kHz
0.1
%
Acoustic Overload Point
AOP
10% THD @1 kHz
127
dB SPL
Relative Response (dB)
4 Frequency Response Curve and Limits
+15
+10
+5
+3
+3 +3
+3
+6
-3
-3
-3
-3
0
-5
-3
-10
-15
100
200
300
500
1k 1.1k
Frequency (Hz)
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3k
5k
8k
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5 Measurement Circuit
Term.1 (Power)
CP
VDD + 2.0V
Filter
Term.4 (Output)
Amp
OUTPUT
C=10μF
Term.2.3(GND)
MEMS
Microphone
GND
6 Test Setup Drawing
Power Amplifier
Free-field 1/2"
Microphone
Audio Analyzer
50cm
Speaker
MIC
Input
Output
Power&Load
Remote Control
Turn Table
Anechoic Room
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7 Mechanical Characteristics
7.1 Appearance Drawing (Unit: mm)
W
1.475
H
1.13
AP
1
4
2
3
Y
L
L
L
1.23
L
1.23
4
0.85 0.85
Top View
Pin# Function
Identification
Number
Bottom View
Item
Dimension
Tol.(±)
Units
1
Power
Length
3.76
0.10
mm
2
GND
Width
2.95
0.10
mm
3
GND
Height
1.10
0.10
mm
4
Output
Ø0.325
0.10
mm
Acoustic Port
(AP)
Note: 1. Tolerance ±0.10mm unless otherwise specified.
2. Identification Number Convention: Job Identification Number.
Identification G W W D
Number
Y LLL
G : GoerTek
Y
:Year
WW
:Week
L L L
D
:Day
: Lot Number
2D Code
7.2 Weight
The weight of the MIC is Less than 0.04g.
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8 Reliability Condition
8.1
Vibration
Test
To be no interference in operation after vibrations, 4 cycles, from 20 to 2,000Hz in each
direction(X,Y,Z), 48 minutes, using peak acceleration of 20g, sensitivity should vary
within ±3dB from initial sensitivity.
(The measurement to be done after 2 hours of conditioning at +15 ℃~+35℃, R.H.25%~75%)
8.2
Drop
Test
To be no interference in operation after dropped to 1.0cm steel plate 12 times from 1.5 meter
height in state of JIG, JIG weight of 150g, sensitivity should vary within ±3dB from
initial sensitivity.
(The measurement to be done after 2 hours of conditioning at +15 ℃~+35℃, R.H.25%~75%)
a) After exposure at +125 ℃ for 200 hours, sensitivity should vary within ±3dB from initial
sensitivity.
(The measurement to be done after 2 hours of conditioning at +15 ℃~+35℃, R.H.25%~75%)
8.3
Temperature
b) After exposure at -40 ℃ for 200 hours, sensitivity should vary within ±3dB from initial
Test
sensitivity.
(The measurement to be done after 2 hours of conditioning at +15 ℃~+35℃, R.H.25%~75%)
8.4
Humidity
Test
After exposure at +85 ℃ and 85% relative humidity for 200 hours, sensitivity should vary within
±3dB from initial sensitivity.
(The measurement to be done after 2 hours of conditioning at +15 ℃~+35℃, R.H.25%~75%)
8.5
Mechanical
Shock Test
Then subject samples to three one-half sine shock pulses (3000 g for 0.3 milliseconds) in each
direction (for six axes in total) along each of the three mutually perpendicular axes for a total of
18 shocks, sensitivity should vary within ±3dB from initial sensitivity.
(The measurement to be done after 2 hours of conditioning at +15 ℃~+35℃, R.H.25%~75%)
8.6
Thermal
Shock Test
After exposure at -40 ℃ for 30 minutes, at +125℃ for 30 minutes (change time 20 seconds)
32 cycles, sensitivity should vary within ±3dB from initial sensitivity.
(The measurement to be done after 2 hours of conditioning at +15 ℃~+35℃, R.H.25%~75%)
8.7
Reflow
Test
Adopt the reflow curve of item 12.3, after three reflows, sensitivity should vary within ±2dB
from initial sensitivity.
(The measurement to be done after 2 hours of conditioning at +15 ℃~+35℃, R.H.25%~75%)
8.8
Electrostatic
Discharge
Test
Under C=150pF, R=330ohm.
Tested to ±8KV contact to the case and tested to ±2kV contact to I/O terminals.10 times.
Grounding. Sensitivity should vary within ±3dB from initial sensitivity.
(The measurement to be done after 2 hours of conditioning at +15 ℃~+35℃, R.H.25%~75%)
8.9
Air Blow
Test
0.4MPa, 30mm, 10s, airgun diameter: 1mm, 20pcs. Sensitivity should vary within 3dB from
initial sensitivity.
(The measurement to be done after 2 hours of conditioning at +15 ℃~+35℃, R.H.25%~75%)
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9 Package
9.1 Tape Specification
P0
P2
E
ØD0
A
B
Power
W
F
A
B
P1
R
ØD1
B-B
A-A
T
10°
A0
10°
B0
K0
The Dimensions as Follows:
ITEM
W
E
F
ØD0
ØD1
DIM(mm)
12.0±0.30
1.75±0.10
5.5±0.05
1.50+0.10
0
1.50+0.10
0
ITEM
P0
10P0
P1
A0
B0
DIM(mm)
4.00±0.10
40.00±0.20
8.00±0.10
3.28±0.05
4.03±0.05
ITEM
K0
P2
T
R
DIM(mm)
1.30±0.10
2.00±0.05
0.30±0.05
0.25±0.10
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9.2 Reel Dimension
7'' reel for sample stage
13'' reel will be provided for the mass production stage
The following is 13'' reel dimensions (unit:mm)
12.4±0.2
inner side
DETAIL A
A
1.9±0.4
Ø100±0.5
Ø330(max)
Ø21±0.4
Ø13±0.2
120°
9.3 The Content of Box(13'' reel)
Packing (5,000PCS)
Two Inner Box(50,000PCS)
Inner Box(25,000PCS)
(340mm 135mm 355mm)
Outer Box(50,000PCS)
(370mm 300mm 390mm)
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9.4 Packing Explain
9.4.1 The Label Content of the Reel
1 12
1 0 1 12
9
87
3
6 54
xx
xx x
xx
xx xxxx x
xx
x
xx x xx xxxx
x
x
xx x xx
x
xx
The Content Includes:
Product type, Lot, Customer P/N;
and other essential information such as
Quantity, Date etc.
9.4.2 The RoHS Label
1 121
10 1
2
9
87
3
RoHS
Compliance Mark&
Halogen Free
6 54
RoHS HF
10 Storage and Transportation
10.1 Keep MEMS MIC in warehouse with less than 75% humidity and without sudden
temperature change, acid air, any other harmful air or strong magnetic field.
Recommend storage period no more than 1 year and floor life(out of bag) at
factory no more than 4 weeks.
10.2 The MEMS MIC with normal pack can be transported by ordinary conveyances. Please
protect products against moist, shock, sunburn and pressure during transportation.
10.3 Storage Temperature Range :-40℃~+70℃(Microphone units with package )
10.4 Operating Temperature Range :-40℃~+105℃
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11 Land Pattern Recommendation
11.1 The Pattern of MIC Pad(Unit:mm)
4
2
3
1.23
1.23
1
0.85 0.85
4-Ø0.8
1.23
1.23
11.2 Recommended Soldering Surface Land Pattern(Unit:mm)
0.85 0.85
4-Ø0.8
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12 Soldering Recommendation
12.1 Soldering Machine Condition
8 zones
Temperature Control
Heater Type
Hot Air
Solder Type
Lead-free
12.2 The Drawing and Dimension of Nozzle
Nozzle Diameter: Φ1.0mm
2.11
3.76
1.13
1.475
AP
Forbidden area for
vacuum application
Recommendation
area for pick up
2.75
Please don't vacuum over the acoustic port
directly. The recommendation is for reference.
Ø1.0
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12.3 Reflow Profile
Temp. °C
Tp
Max. Ramp-up rate = 3 ℃/s
Max. Ramp-down rate = 6 ℃/s
TL
Tsmax
Preheat area
tp
tL
Tsmin
ts
25
time 25℃ to peak
Time. sec
Key Features of The Profile:
Average Ramp-up rate(T smax to Tp)
3℃/s max.
Preheat :
Temperature Min(T smin)
Temperature Max(T smax )
Time(Tsmin to Tsmax )(ts)
150℃
200℃
60~180s
Time maintained above :
Tempreature(TL)
Time(tL)
217℃
60~150s
Peak Temperature(T p)
260℃
Time within 5 ℃ of actual Peak Temperature(t p) :
30~40s
Ramp-down rate(T p to Tsmax )
6℃/s max
Time 25℃ to Peak Temperature
8min max
When MEMS MIC is soldered on PCB, the reflow profile is set according to solder paste
and the thickness of PCB etc.
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12.4 Rework
(1) 250℃~270℃, maximum 30 sec ,Peak temperature 330 ℃.
(2) Wind speed: 15L/m.
(3) It is very important not to put a heatgun over the acoustic port of the microphone.
13 Cautions
13.1 Board Wash Restrictions
It is very important not to board wash the PCBA after reflow process, otherwise this
could damage the microphone.
13.2 Vacuum Restrictions
It is very important not to put a vacuum over the acoustic port of the microphone.
otherwise this could damage the microphone.
13.3 Ultrasonic Restrictions
It is very important not to use ultrasonic process. otherwise this could damage the
microphone.
14 Output Inspection Standard
Output inspection standard is executed according to .
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