SFI0402EH060-0R20P

SFI Electronics Technology SEH(0R20) (ESD for High Speed) Series Approval Sheet Customer Information Customer Part Name Part No. Model No. COMPANY PURCHASE R&D Vendor Information Name SFI Electronics Technology Inc. Part Name Chip Surge Protection Device (CSPD) Series Part No. SEH(0R20) (ESD for High Speed) Series Lot No. SFI Electronics Technology Inc. ADDRESS : No.6, Lane 340, Shan-Ying Road, Guishan, Tao Yuan, Taiwan TEL : 886-3-3506998 FAX : 886-3-3507689 Quality Control E-mail : sfi@sfi.com.tw Document Control REV : C Part No. SEH(0R20) Series http://www.sfi.com.tw E-mail : sfi@sfi.com.tw Document No. Business Issue Prepared AS-RDSEH-S01 TEL : 886-3-3506998 Check REV. FAX : 886-3-3507689 C －1－ SFI Electronics Technology SEH(0R20) (ESD for High Speed) Series PART NO. SEH(0R20) Series 1.1 Performance Characteristic Part No. Working Voltage Typical ESD Trigger Voltage Typical ESD Clamping Voltage at 30ns Leakage Current (at Initial State) Leakage Current (after ESD Test) Cap. Value at 1MHz Symbol VDC(max.) Vtrigger(typ.) VC(typ.) ILDC ILDCA C Unit V V V μA μA SFI0402EH060-0R20P 6 300 30 < 0.05 < 10 SFI0402EH120-0R20P 12 300 30 < 0.05 < 10 SFI0402EH240-0R20P 24 300 30 < 0.05 < 10 SFI0603EH060-0R20P 6 300 30 < 0.05 < 10 SFI0603EH120-0R20P 12 300 30 < 0.05 < 10 SFI0603EH240-0R20P 24 300 30 < 0.05 < 10 pF 0.20pF (max. 0.30pF) 0.20pF (max. 0.30pF) 0.20pF (max. 0.30pF) 0.20pF (max. 0.40pF) 0.20pF (max. 0.40pF) 0.20pF (max. 0.40pF) ＊1 The clamping voltage was measured by IEC61000-4-2 level 4, direct discharge 8KV. ＊2 The leakage current was measured at VDC. ＊3 The components shall be employed within 1 year, in the nitrogen condition. 1.2 Reference Data Symbol Response time Operation ambient temperature Storage temperature Withstanding ESD capability Body End termination Packaging Complies with standard Complies with RoHs standard Lead content Marking ESD Wave Form Trise < IEC61000-4-2 < Value Unit 0.5 -50~+85 -50~+125 Level 4 Nano special ceramic Ag/Ni/Sn Reel IEC61000-4-2 Yes 1000 None ns ℃ ℃ ppm IEC61000-4-2 Standards SEVERITY LEVEL AIR DIRCHARGE DIRECT DISCHARGE 1 2KV 2KV 2 4KV 4KV 3 8KV 6KV 4 15KV 8KV IEC61000-4-2 compliant ESD current pulse waveform Part No. SEH(0R20) Series http://www.sfi.com.tw E-mail : sfi@sfi.com.tw Document No. AS-RDSEH-S01 TEL : 886-3-3506998 REV. FAX : 886-3-3507689 C －2－ SFI Electronics Technology SEH(0R20) (ESD for High Speed) Series 2. ESD Testing Circuit and Testing Results PC Oscilloscope ESD generator Voltage probe MLV Current probe Fig 2(A) ESD testing circuit Test with high voltage probe of attenuation factor ×250 Fig 2(B) without ESD protection sample Part No. SEH(0R20) Series http://www.sfi.com.tw E-mail : sfi@sfi.com.tw Document No. AS-RDSEH-S01 TEL : 886-3-3506998 REV. FAX : 886-3-3507689 C －3－ SFI Electronics Technology SEH(0R20) (ESD for High Speed) Series Fig 2(C) with SEH(0R20) sample Part No. SEH(0R20) Series http://www.sfi.com.tw E-mail : sfi@sfi.com.tw Document No. AS-RDSEH-S01 TEL : 886-3-3506998 REV. FAX : 886-3-3507689 C －4－ SFI Electronics Technology SEH(0R20) (ESD for High Speed) Series 3. Size Model 0402(1005) 0603(1608) Length(L) 1.00±0.10 1.60±0.15 Width(W) 0.50±0.10 0.80±0.10 Thickness(T) 0.60 max. 0.90 max. Termination(a) 0.25±0.10 0.30±0.10 4. Environment Reliability Test Characteristic Test Method and Description High Temperature Storage The specimen shall be subjected to 125±2℃ for 1000±2 hours without load and then stored at room temperature and normal humidity for one or two hours. The change of varistor voltage shall be within 10%. Temperature Cycle The temperature cycle of specified temperature shall be repeated five times and then stored at room temperature and normal humidity for one or two hours. The change of varistor voltage shall be within 10% and mechanical damage shall be examined. High Temperature Load Damp Heat Load/ Humidity Load Low Temperature Storage Part No. Temperature Period 1 -40±3℃ 30±3min 2 room temperature 1 hour 3 125±3℃ 30±3min 4 room temperature 1 hour After being continuously applied the maximum allowable voltage at 85±2℃ for 1000±2 hours, the specimen shall be stored at room temperature and normal humidity for one or two hours. The change of varistor voltage shall be within 10%. The specimen should be subjected to 40±2℃ and 90~95% RH, the maximum allowable voltage applied for 1000±2 hours and then stored at room temperature and normal humidity for one or two hours. The change of varistor voltage shall be within 10%. The specimen should be subjected to -40±2℃ for 1000±2 hours without load and then stored at room temperature and normal humidity for one or two hours. The change of varistor voltage shall be within 10%. SEH(0R20) Series http://www.sfi.com.tw Step E-mail : sfi@sfi.com.tw Document No. AS-RDSEH-S01 TEL : 886-3-3506998 REV. FAX : 886-3-3507689 C －5－ SFI Electronics Technology SEH(0R20) (ESD for High Speed) Series 5. Soldering Recommendations 5.1 Recommended solder pad layout (Unit : mm) A B C 0402 0.4~0.6 0.6~0.9 0.5~0.7 0603 0.9~1.2 0.9~1.2 0.8~1.0 5.2 The SIR test of the solder paste shall be done (Based on JIS-Z-3284) 5.3 Steel plate and foot distance printing Foot distance printing (mm) Steel plate thickness (mm) ≧ 0.65mm 0.18mm 0.50~0.65mm 0.15mm 0.40~0.50mm 0.12mm ≦ 0.40mm 0.10mm 5.4 The IR reflow and temperature of soldering for Pb free process Temperature ( ℃ ) Peak Temp 260℃(3~10sec) 250 225 Peak Temp 245 ℃ (10~20sec) 200 175 150 125 100 Pre-Heat 175 ℃ (60~120sec) 75 25 01:00:00 02:00:00 03:00:00 04:00:00 Time (min) ☆ IR reflow Pb free process suggestion profile (1) The solder recommend is Sn96.5/Ag3.5 and thickness recommend as shown in table 5.3 (2) Ramp-up rate (217℃ to peak) +3℃/second max. (3) Temp. maintain at 175±25℃ 180 seconds max. (4) Temp. maintain above 217℃ 60~150 seconds Part No. SEH(0R20) Series http://www.sfi.com.tw E-mail : sfi@sfi.com.tw Document No. AS-RDSEH-S01 TEL : 886-3-3506998 REV. FAX : 886-3-3507689 C －6－ SFI Electronics Technology SEH(0R20) (ESD for High Speed) Series (5) Peak temperature range 245 +20/-10℃ within 5℃ of actually peak temperature (tp) 10~20 seconds (6) Ramp down rate -6℃/second max. ※Perform adequate test in advance as the reflow temperature profile will vary according to the conditions of the manufacturing process and the specification of the reflow furnace. 5.5 Resistance to soldering heat and high temperature resistance : 260℃, 10sec 3 times 5.6 Hand soldering In hand soldering of the SEH devices, large temperature gradient between preheated the SEH devices and the tip of soldering iron may cause electrical failures and mechanical damages such as cracking or breaking of the devices. The soldering shall be carefully controlled and carried out, so that the temperature gradient is kept minimum with following recommended conditions for hand soldering. 5.6.1 Recommended soldering condition 1 (with preheating) (1) Solder 0.12~0.18mm thread solder (Sn96.5:Ag3.5) with soldering flux in the core rosin-based and non-activated flux is recommended. (2) Preheating The SEH devices shall be preheated so that temperature gradient between the devices and the tip of soldering iron is 150℃ or below. (3) Soldering iron Rated power of 20W max. with 3mm soldering tip in diameter Temperature of soldering iron tip 380℃max., 3~5sec (The required amount of solder shall be melted in advance on the soldering tip.) (4) Cooling After soldering, the SEH devices shall be cooled gradually at room ambient temperature. 5.6.2 Recommended soldering condition 2 (without preheating) (1) Solder iron tip shall not directly touch to ceramic dielectrics. (2) Solder iron tip shall be fully preheated before soldering while soldering iron tip to the external electrode of SEH devices. 5.7 Post soldering cleaning 5.7.1 Residues of corrosive soldering fluxes on the PC board after cleaning may greatly have influences on the electrical characteristic and the reliability (such as humidity resistance) of the SEH devices which have been mounted on the board. It shall be confirmed that the characteristic and the reliability of the devices are not affected by the applied cleaning conditions. 5.7.2 When an ultrasonic cleaning is applied to the mounted SEH devices on PC boards. Following conditions are recommended for preventing failures or damages of the devices due to the large vibration energy and the resonance conditions caused by the ultrasonic waves. (1) Frequency 29MHz max. (2) Radiated power 20W/liter max. (3) Period 5 minutes max. Part No. SEH(0R20) Series http://www.sfi.com.tw E-mail : sfi@sfi.com.tw Document No. AS-RDSEH-S01 TEL : 886-3-3506998 REV. FAX : 886-3-3507689 C －7－ SFI Electronics Technology SEH(0R20) (ESD for High Speed) Series 6. Packaging Specification 6.1 Carrier tape and transparent cover tape should be heat-sealed to carry the products, and the reel should be used to reel the carrier tape. 6.2 The adhesion of the heat-sealed cover tape shall be 40 +20/-15 grams. 6.3 Both the head and the end portion of the taping shall be empty for reel package and SMT auto-pickup machine. And a normal paper tape shall be connected in the head of taping for the operator to handle. 0402 0603 (Unit : mm) Symbol A0 ±0.05 B0 ±0.05 K0 ±0.05 D +0.10 -0.05 P ±0.10 P2 ±0.10 P0 ±0.10 W ±0.10 E ±0.10 F ±0.05 0402 0.62 1.12 0.60 1.55 2.00 2.00 4.00 8.00 1.75 3.50 0603 1.10 1.90 0.95 1.56 4.00 2.00 4.00 8.00 1.75 3.50 Part No. SEH(0R20) Series http://www.sfi.com.tw E-mail : sfi@sfi.com.tw Document No. AS-RDSEH-S01 TEL : 886-3-3506998 REV. FAX : 886-3-3507689 C －8－ SFI Electronics Technology SEH(0R20) (ESD for High Speed) Series 7. Reel Dimension (Unit : mm) Symbol A B C D E W W1 0402 178.0±1.0 60.0±0.5 13.0±0.2 21.0±0.2 2.0±0.5 9.0±0.5 1.5±0.1 0603 178.0±1.0 60.0±0.5 13.0±0.2 21.0±0.2 2.0±0.5 9.0±0.5 1.5±0.1 8. Standard Packaging Size 0402 0603 Pcs 10000 5000 Part No. SEH(0R20) Series http://www.sfi.com.tw E-mail : sfi@sfi.com.tw Document No. AS-RDSEH-S01 TEL : 886-3-3506998 REV. FAX : 886-3-3507689 C －9－