SMFJ SERIES
Features
Features
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For surface mounted applications
Low-profile package
Optimized for LAN protection applications
Ideal for ESD protection of data lines in
accordance with IEC 1000-4-2 (IEC801-2)
Ideal for EFT protection of data lines in
accordance with IEC 1000-4-4 (IEC801-4)
Low incremental surge resistance
IEC 1000-4-2 (ESD) 15 kV (air) 8 kV (contact)
IEC 1000-4-4 (EFT) 40 A (tp = 5/ 50 ns)
IEC 1000-4-5 (Lightning) 24 A (tp = 8/ 20 µs
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Low incremental surge resistance, excellent clamping capability
• 200 W peak pulse power capability with a
10/1000 µs waveform, repetition rate (duty cycle): 0.01 %
• Very fast response time
High temperature soldering guaranteed:
260°C/ 10 seconds at terminals
Applications
TVS devices are ideal for the protection of I/O interfaces, VCC bus and other vulnerable circuits used in
telecom,computer, industrial and consumer electronic applications.
Absolute Maximum Rating
Rating
Rating
Symbol
Symbol
Value
Value
Units
Units
PPPM
200
Watts
Power Dissipation on infinite heat sink at TA=50OC
PD
2
Watts
Peak Forward Surge Current, 8.3ms Single Half
Sine Wave (Note 3)
IFSM
20
Amps
Maximum Instantaneous Forward Voltage at 25A for
Unidirectional only (Note 4)
VF
3.5V/6.5
V
Operating junction and Storage Temperature Range.
TJ,TSTG
-55 to 150
°C
Typical Thermal Resistance Junction to Lead
RuJL
30
°C/W
Typical Thermal Resistance Junction
to Ambient
RuJA
120
°C/W
Peak Pulse Power Dissipation at TA=25ºC by
10x1000μs waveform (Fig.1)(Note 1), (Note 2)
Notes:
1. Non-repetitive current pulse , per Fig. 3 and derated above TA = 25°C per Fig. 2.
2. Measured on 8.3ms single half sine wave or equivalent square wave, duty cycle=4 per minute maximum.
3. VF
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