ESP32WROOM32E
ESP32WROOM32UE
Datasheet
2.4 GHz WiFi + Bluetooth® + Bluetooth LE module
Built around ESP32 series of SoCs, Xtensa® dualcore 32bit LX6 microprocessor
4/8/16 MB flash available
26 GPIOs, rich set of peripherals
Onboard PCB antenna or external antenna connector
ESP32WROOM32E
ESP32WROOM32UE
Version 1.5
Espressif Systems
Copyright © 2022
www.espressif.com
1 Module Overview
1 Module Overview
Note:
Check the link or the QR code to make sure that you use the latest version of this document:
https://espressif.com/documentation/esp32-wroom-32e_esp32-wroom-32ue_datasheet_en.pdf
1.1 Features
(compatible with ISO 11898-1, i.e. CAN
CPU and OnChip Memory
Specification 2.0)
• ESP32-D0WD-V3 or ESP32-D0WDR2-V3
embedded, Xtensa dual-core 32-bit LX6
Integrated Components on Module
microprocessor, up to 240 MHz
• 40 MHz crystal oscillator
• 448 KB ROM
• 4/8/16 MB SPI flash
• 520 KB SRAM
• 16 KB SRAM in RTC
Antenna Options
• ESP32-WROOM-32E: On-board PCB antenna
• ESP32-D0WDR2-V3 also provides 2 MB PSRAM
• ESP32-WROOM-32UE: external antenna via a
WiFi
connector
• 802.11b/g/n
Operating Conditions
• Bit rate: 802.11n up to 150 Mbps
• Operating voltage/Power supply: 3.0 ~ 3.6 V
• A-MPDU and A-MSDU aggregation
• Operating ambient temperature:
• 0.4 µs guard interval support
– 85 °C version: –40 ~ 85 °C
• Center frequency range of operating channel:
2412 ~ 2484 MHz
– 105 °C version: –40 ~ 105 °C. Note that
only the modules embedded with a 4/8 MB
Bluetooth
flash support this version.
• Bluetooth V4.2 BR/EDR and Bluetooth LE
specification
Certification
• Class-1, class-2 and class-3 transmitter
• Bluetooth certification: BQB
• AFH
• RF certification: See certificates for
ESP32-WROOM-32E and
• CVSD and SBC
ESP32-WROOM-32UE
Peripherals
• Green certification: REACH/RoHS
• SD card, UART, SPI, SDIO, I2C, LED PWM,
Reliability Test
Motor PWM, I2S, IR, pulse counter, GPIO,
®
capacitive touch sensor, ADC, DAC, TWAI
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• HTOL/HTSL/uHAST/TCT/ESD
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1 Module Overview
1.2 Description
ESP32-WROOM-32E and ESP32-WROOM-32UE are two powerful, generic Wi-Fi + Bluetooth + Bluetooth LE
MCU modules that target a wide variety of applications, ranging from low-power sensor networks to the most
demanding tasks, such as voice encoding, music streaming and MP3 decoding.
ESP32-WROOM-32E comes with a PCB antenna, and ESP32-WROOM-32UE with a connector for an external
antenna. The information in this datasheet is applicable to both modules.
The Series Comparison for the two modules is as follows:
Table 1: ESP32WROOM32E Series Comparison1
Ordering Code
Ambient Temp.2
Size3
(°C)
(mm)
Flash
PSRAM
ESP32-WROOM-32E-N4
4 MB (Quad SPI)
—
–40 ~ 85
ESP32-WROOM-32E-N8
8 MB (Quad SPI)
—
–40 ~ 85
ESP32-WROOM-32E-N16
16 MB (Quad SPI)
—
–40 ~ 85
ESP32-WROOM-32E-H4
4 MB (Quad SPI)
—
–40 ~ 105
ESP32-WROOM-32E-H8
8 MB (Quad SPI)
—
–40 ~ 105
ESP32-WROOM-32E-N4R2
4 MB (Quad SPI)
2 MB (Quad SPI)4
–40 ~ 85
ESP32-WROOM-32E-N8R2
8 MB (Quad SPI)
2 MB (Quad SPI)
4
–40 ~ 85
ESP32-WROOM-32E-N16R2
16 MB (Quad SPI)
2 MB (Quad SPI)4
–40 ~ 85
1
18.0 × 25.5 × 3.1
This table shares the same notes presented in the table 2 below.
Table 2: ESP32WROOM32UE Series Comparison
Ordering Code
Ambient Temp.2
Size3
(°C)
(mm)
Flash
PSRAM
ESP32-WROOM-32UE-N4
4 MB (Quad SPI)
—
–40 ~ 85
ESP32-WROOM-32UE-N8
8 MB (Quad SPI)
—
–40 ~ 85
ESP32-WROOM-32UE-N16
16 MB (Quad SPI)
—
–40 ~ 85
ESP32-WROOM-32UE-H4
4 MB (Quad SPI)
—
–40 ~ 105
ESP32-WROOM-32UE-H8
8 MB (Quad SPI)
—
–40 ~ 105
ESP32-WROOM-32UE-N4R2
4 MB (Quad SPI)
2 MB (Quad SPI)4
–40 ~ 85
8 MB (Quad SPI)
2 MB (Quad SPI)
4
–40 ~ 85
2 MB (Quad SPI)
4
–40 ~ 85
ESP32-WROOM-32UE-N8R2
ESP32-WROOM-32UE-N16R2
2
16 MB (Quad SPI)
18.0 × 19.2 × 3.2
Ambient temperature specifies the recommended temperature range of the environment immediately outside the
Espressif module.
3
For details, refer to Section 7.1 Physical Dimensions.
4
This module uses PSRAM integrated in the chip’s package.
At the core of the module is the ESP32-D0WD-V3 chip or ESP32-D0WDR2-V3 chip*. The chip embedded is
designed to be scalable and adaptive. There are two CPU cores that can be individually controlled, and the CPU
clock frequency is adjustable from 80 MHz to 240 MHz. The chip also has a low-power coprocessor that can be
used instead of the CPU to save power while performing tasks that do not require much computing power, such
as monitoring of peripherals. ESP32 integrates a rich set of peripherals, ranging from capacitive touch sensors,
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1 Module Overview
Hall sensors, SD card interface, Ethernet, high-speed SPI, UART, I2S and I2C.
Note:
* For details on the part numbers of the ESP32 family of chips, please refer to the document ESP32 Series Datasheet.
The integration of Bluetooth, Bluetooth LE and Wi-Fi ensures that a wide range of applications can be targeted,
and that the module is all-around: using Wi-Fi allows a large physical range and direct connection to the Internet
through a Wi-Fi router, while using Bluetooth allows the user to conveniently connect to the phone or broadcast
low energy beacons for its detection. The sleep current of the ESP32 chip is less than 5 µA, making it suitable for
battery powered and wearable electronics applications. The module supports a data rate of up to 150 Mbps,
and 20 dBm output power at the antenna to ensure the widest physical range. As such the module does offer
industry-leading specifications and the best performance for electronic integration, range, power consumption,
and connectivity.
The operating system chosen for ESP32 is freeRTOS with LwIP; TLS 1.2 with hardware acceleration is built in as
well. Secure (encrypted) over the air (OTA) upgrade is also supported, so that users can upgrade their products
even after their release, at minimum cost and effort.
1.3 Applications
• Generic Low-power IoT Sensor Hub
• Smart Building
• Generic Low-power IoT Data Loggers
• Industrial Automation
• Cameras for Video Streaming
• Smart Agriculture
• Over-the-top (OTT) Devices
• Audio Applications
• Speech Recognition
• Health Care Applications
• Image Recognition
• Wi-Fi-enabled Toys
• Mesh Network
• Wearable Electronics
• Home Automation
• Retail & Catering Applications
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Contents
Contents
1
Module Overview
2
1.1
Features
2
1.2
Description
3
1.3
Applications
4
2
Block Diagram
9
3
Pin Definitions
10
3.1
Pin Layout
10
3.2
Pin Description
10
3.3
Strapping Pins
12
4
Electrical Characteristics
14
4.1
Absolute Maximum Ratings
14
4.2
Recommended Operating Conditions
14
4.3
DC Characteristics (3.3 V, 25 °C)
14
4.4
Current Consumption Characteristics
15
4.5
Wi-Fi RF Characteristics
16
4.5.1
Wi-Fi RF Standards
16
4.5.2
Transmitter Characteristics
16
4.5.3
Receiver Characteristics
16
4.6
4.7
Bluetooth Radio
18
4.6.1
Receiver – Basic Data Rate
18
4.6.2
Transmitter – Basic Data Rate
18
4.6.3
Receiver – Enhanced Data Rate
19
4.6.4
Transmitter – Enhanced Data Rate
19
Bluetooth LE Radio
20
4.7.1
Receiver
20
4.7.2
Transmitter
20
5
Module Schematics
22
6
Peripheral Schematics
24
7
Physical Dimensions and PCB Land Pattern
25
7.1
Physical Dimensions
25
7.2
Recommended PCB Land Pattern
26
7.3
Dimensions of External Antenna Connector
28
8
Product Handling
29
8.1
Storage Conditions
29
8.2
Electrostatic Discharge (ESD)
29
8.3
Reflow Profile
29
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Contents
8.4
Ultrasonic Vibration
30
9
Related Documentation and Resources
31
Revision History
Espressif Systems
32
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List of Tables
List of Tables
1
ESP32-WROOM-32E Series Comparison
3
2
ESP32-WROOM-32UE Series Comparison
3
3
Pin Definitions
11
4
Strapping Pins
13
5
Description of ESP32 Power-up and Reset Timing Parameters
13
6
Absolute Maximum Ratings
14
7
Recommended Operating Conditions
14
8
DC Characteristics (3.3 V, 25 °C)
14
9
Current Consumption Depending on RF Modes
15
10
Wi-Fi RF Standards
16
11
TX Power Characteristics
16
12
RX Sensitivity Characteristics
16
13
RX Maximum Input Level
17
14
Adjacent Channel Rejection
17
15
Receiver Characteristics – Basic Data Rate
18
16
Transmitter Characteristics – Basic Data Rate
18
17
Receiver Characteristics – Enhanced Data Rate
19
18
Transmitter Characteristics – Enhanced Data Rate
19
19
Receiver Characteristics – Bluetooth LE
20
20
Transmitter Characteristics – Bluetooth LE
21
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List of Figures
List of Figures
1
ESP32-WROOM-32E Block Diagram
9
2
ESP32-WROOM-32UE Block Diagram
9
3
Pin Layout (Top View)
10
4
ESP32 Power-up and Reset Timing
13
5
ESP32-WROOM-32E Schematics
22
6
ESP32-WROOM-32UE Schematics
23
7
Peripheral Schematics
24
8
ESP32-WROOM-32E Physical Dimensions
25
9
ESP32-WROOM-32UE Physical Dimensions
25
10
ESP32-WROOM-32E Recommended PCB Land Pattern
26
11
ESP32-WROOM-32UE Recommended PCB Land Pattern
27
12
Dimensions of External Antenna Connector
28
13
Reflow Profile
29
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QSPI Flash
ESP32-WROOM-32UE
2 Block Diagram
2 Block Diagram
40 MHz
Crystal
3V3
ESP32-D0WD-V3
EN
ESP32-D0WDR2-V3
Antenna
RF Matching
GPIOs
SPICS
SPICLK
SPIDI
SPIDO
SPIHD
SPIWP
VDD_SDIO
PSRAM(opt.)
(QSPI)
QSPI Flash
ESP32-WROOM-32E
Figure 1: ESP32WROOM32E Block Diagram
40 MHz
Crystal
3V3
ESP32-D0WD-V3
EN
ESP32-D0WDR2-V3
Antenna
RF Matching
GPIOs
SPICS
SPICLK
SPIDI
SPIDO
SPIHD
SPIWP
VDD_SDIO
PSRAM(opt.)
(QSPI)
QSPI Flash
ESP32-WROOM-32UE
Figure 2: ESP32WROOM32UE Block Diagram
40 MHz
Crystal
3V3
ESP32-D0WD-V3
EN
ESP32-D0WDR2-V3
Antenna
RF Matching
GPIOs
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SPICS
SPICLK
SPIDI
SPIDO
SPIHD
SPIWP
VDD_SDIO
PSRAM(opt.)
(QSPI)
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3 Pin Definitions
3 Pin Definitions
3.1 Pin Layout
The pin layout of ESP32-WROOM-32UE is the same as that of ESP32-WROOM-32E, except that
ESP32-WROOM-32UE has no keepout zone.
The pin diagram below shows the approximate location of pins on the module. For the actual diagram drawn to
scale, please refer to Figure 7.1 Physical Dimensions.
Keepout Zone
6
IO34
GND
GND
GND
IO21
33
7
IO35
GND
39
GND
GND
NC
32
8
IO32
GND
GND
GND
IO19
31
9
IO33
IO18
30
10
IO25
IO5
29
11
IO26
IO17
28
12
IO27
IO16
27
13
IO14
IO4
26
14
IO12
IO0
25
IO2
34
24
RXD0
IO15
SENSOR_VN
23
5
NC
35
22
TXD0
NC
SENSOR_VP
21
4
NC
36
20
IO22
NC
EN
19
3
NC
37
18
IO23
NC
3V3
17
2
IO13
38
16
GND
GND
GND
15
1
Figure 3: Pin Layout (Top View)
3.2 Pin Description
The module has 38 pins. See pin definitions in Table 3.
For peripheral pin configurations, please refer to ESP32 Series Datasheet.
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3 Pin Definitions
Table 3: Pin Definitions
Type1 Function
Name
No.
GND
1
P
Ground
3V3
2
P
Power supply
High: On; enables the chip
EN
3
I
Low: Off; the chip powers off
Note: Do not leave the pin floating.
SENSOR_VP
4
I
GPIO36, ADC1_CH0, RTC_GPIO0
SENSOR_VN
5
I
GPIO39, ADC1_CH3, RTC_GPIO3
IO34
6
I
GPIO34, ADC1_CH6, RTC_GPIO4
IO35
7
I
GPIO35, ADC1_CH7, RTC_GPIO5
IO32
8
I/O
IO33
9
I/O
IO25
10
I/O
GPIO25, DAC_1, ADC2_CH8, RTC_GPIO6, EMAC_RXD0
IO26
11
I/O
GPIO26, DAC_2, ADC2_CH9, RTC_GPIO7, EMAC_RXD1
IO27
12
I/O
GPIO27, ADC2_CH7, TOUCH7, RTC_GPIO17, EMAC_RX_DV
IO14
13
I/O
IO12
14
I/O
GND
15
P
IO13
16
I/O
NC
17
-
See note 2
NC
18
-
See note 2
NC
19
-
See note 2
NC
20
-
See note 2
NC
21
-
See note 2
NC
22
-
See note 2
IO15
23
I/O
IO2
24
I/O
IO0
25
I/O
IO4
26
I/O
IO16
27
I/O
GPIO16, HS1_DATA4, U2RXD, EMAC_CLK_OUT
IO17
28
I/O
GPIO17, HS1_DATA5, U2TXD, EMAC_CLK_OUT_180
IO5
29
I/O
GPIO5, VSPICS0, HS1_DATA6, EMAC_RX_CLK
IO18
30
I/O
GPIO18, VSPICLK, HS1_DATA7
3
GPIO32, XTAL_32K_P (32.768 kHz crystal oscillator input), ADC1_CH4,
TOUCH9, RTC_GPIO9
GPIO33, XTAL_32K_N (32.768 kHz crystal oscillator output),
ADC1_CH5, TOUCH8, RTC_GPIO8
GPIO14, ADC2_CH6, TOUCH6, RTC_GPIO16, MTMS, HSPICLK,
HS2_CLK, SD_CLK, EMAC_TXD2
GPIO12, ADC2_CH5, TOUCH5, RTC_GPIO15, MTDI, HSPIQ,
HS2_DATA2, SD_DATA2, EMAC_TXD3
Ground
GPIO13, ADC2_CH4, TOUCH4, RTC_GPIO14, MTCK, HSPID,
HS2_DATA3, SD_DATA3, EMAC_RX_ER
GPIO15, ADC2_CH3, TOUCH3, MTDO, HSPICS0, RTC_GPIO13,
HS2_CMD, SD_CMD, EMAC_RXD3
GPIO2, ADC2_CH2, TOUCH2, RTC_GPIO12, HSPIWP, HS2_DATA0,
SD_DATA0
GPIO0, ADC2_CH1, TOUCH1, RTC_GPIO11, CLK_OUT1,
EMAC_TX_CLK
GPIO4, ADC2_CH0, TOUCH0, RTC_GPIO10, HSPIHD, HS2_DATA1,
SD_DATA1, EMAC_TX_ER
Cont’d on next page
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3 Pin Definitions
Table 3 – cont’d from previous page
1
Name
No.
Type
Function
IO19
31
I/O
NC
32
-
IO21
33
I/O
GPIO21, VSPIHD, EMAC_TX_EN
RXD0
34
I/O
GPIO3, U0RXD, CLK_OUT2
TXD0
35
I/O
GPIO1, U0TXD, CLK_OUT3, EMAC_RXD2
IO22
36
I/O
GPIO22, VSPIWP, U0RTS, EMAC_TXD1
IO23
37
I/O
GPIO23, VSPID, HS1_STROBE
GND
38
P
GPIO19, VSPIQ, U0CTS, EMAC_TXD0
-
Ground
1
P: power supply; I: input; O: output.
2
Pins GPIO6 to GPIO11 on the ESP32-D0WD-V3/ESP32-D0WDR2-V3 chip are connected to the SPI
flash integrated on the module and are not led out.
3
In module variants that have embedded QSPI PSRAM, i.e., that embed ESP32-D0WDR2-V3, IO16 is
connected to the embedded PSRAM and can not be used for other functions.
3.3 Strapping Pins
Note:
The content below is excerpted from Section Strapping Pins in ESP32 Series Datasheet. For the strapping pin mapping
between the chip and modules, please refer to Chapter 5 Module Schematics.
ESP32 has five strapping pins:
• MTDI
• GPIO0
• GPIO2
• MTDO
• GPIO5
Software can read the values of these five bits from register ”GPIO_STRAPPING”.
During the chip’s system reset release (power-on-reset, RTC watchdog reset and brownout reset), the latches of
the strapping pins sample the voltage level as strapping bits of ”0” or ”1”, and hold these bits until the chip is
powered down or shut down. The strapping bits configure the device’s boot mode, the operating voltage of
VDD_SDIO and other initial system settings.
Each strapping pin is connected to its internal pull-up/pull-down during the chip reset. Consequently, if a
strapping pin is unconnected or the connected external circuit is high-impedance, the internal weak
pull-up/pull-down will determine the default input level of the strapping pins.
To change the strapping bit values, users can apply the external pull-down/pull-up resistances, or use the host
MCU’s GPIOs to control the voltage level of these pins when powering on ESP32.
After reset release, the strapping pins work as normal-function pins.
Refer to Table 4 for a detailed boot-mode configuration by strapping pins.
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3 Pin Definitions
Table 4: Strapping Pins
Voltage of Internal LDO (VDD_SDIO)
Pin
MTDI
Default
3.3 V
1.8 V
Pull-down
0
1
Booting Mode
Pin
Default
SPI Boot
Download Boot
GPIO0
Pull-up
1
0
GPIO2
Pull-down
Don’t-care
0
Enabling/Disabling Debugging Log Print over U0TXD During Booting
Pin
Default
U0TXD Active
U0TXD Silent
MTDO
Pull-up
1
0
Timing of SDIO Slave
FE Sampling
FE Sampling
RE Sampling
RE Sampling
Pin
Default
FE Output
RE Output
FE Output
RE Output
MTDO
Pull-up
0
0
1
1
GPIO5
Pull-up
0
1
0
1
*
FE: falling-edge, RE: rising-edge
*
Firmware can configure register bits to change the settings of ”Voltage of Internal
LDO (VDD_SDIO)” and ”Timing of SDIO Slave”, after booting.
*
The module integrates a 3.3 V SPI flash, so the pin MTDI cannot be set to 1 when
the module is powered up.
The illustration below shows the ESP32 power-up and reset timing. Details about the parameters are listed in
Table 5.
t0
t1
VDD3P3_RTC Min
VDD
VIL_nRST
CHIP_PU
Figure 4: ESP32 Powerup and Reset Timing
Table 5: Description of ESP32 Powerup and Reset Timing Parameters
Parameters
t0
t1
Espressif Systems
Description
Time between the 3.3 V rails being brought up and CHIP_PU being
activated
Duration of CHIP_PU signal level < VIL_nRST (refer to its value in
Table 8 DC Characteristics) to reset the chip
13
Min.
Unit
50
µs
50
µs
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4 Electrical Characteristics
4 Electrical Characteristics
4.1 Absolute Maximum Ratings
Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the device. These
are stress ratings only and functional operation of the device at these or any other conditions beyond those
indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated
conditions for extended periods may affect device reliability.
Table 6: Absolute Maximum Ratings
Symbol
Parameter
Min
Max
Unit
VDD33
Power supply voltage
–0.3
3.6
V
TST ORE
Storage temperature
–40
105
°C
*
Please
see
Appendix
IO
MUX
of
ESP32 Series Datasheet for IO’s power domain.
4.2 Recommended Operating Conditions
Table 7: Recommended Operating Conditions
Symbol
Parameter
Min
Typ
Max
Unit
VDD33
Power supply voltage
3.0
3.3
3.6
V
IV DD
Current delivered by external power supply
0.5
—
—
A
T
Operating ambient temperature
–40
—
85 °C version
105 °C version
85
°C
105
4.3 DC Characteristics (3.3 V, 25 °C)
Table 8: DC Characteristics (3.3 V, 25 °C)
Symbol
Parameter
CIN
Pin capacitance
VIH
High-level input voltage
Min
Typ
—
2
0.75 × VDD
1
—
Max
Unit
—
pF
1
VDD + 0.3
V
1
VIL
Low-level input voltage
–0.3
—
0.25 × VDD
IIH
High-level input current
—
—
50
nA
IIL
Low-level input current
—
—
50
nA
—
—
VOH
VOL
High-level output voltage
0.8 × VDD
Low-level output voltage
—
1
—
0.1 × VDD
V
V
1
V
Cont’d on next page
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4 Electrical Characteristics
Table 8 – cont’d from previous page
Symbol
Parameter
High-level source current
1
(VDD = 3.3 V,
IOH
VDD3P3_CPU
power domain 1, 2
VDD3P3_RTC
VOH >= 2.64 V,
output drive strength set
to the maximum)
power domain 1, 2
VDD_SDIO power
domain 1, 3
Min
Typ
Max
Unit
—
40
—
mA
—
40
—
mA
—
20
—
mA
—
28
—
mA
Low-level sink current
IOL
(VDD1= 3.3 V, VOL = 0.495 V,
output drive strength set to the maximum)
RP U
Resistance of internal pull-up resistor
—
45
—
kΩ
RP D
Resistance of internal pull-down resistor
—
45
—
kΩ
—
—
0.6
V
VIL_nRST
1
Low-level input voltage of CHIP_PU
to power off the chip
Please see Appendix IO MUX of ESP32 Series Datasheet for IO’s power domain. VDD is the I/O voltage
for a particular power domain of pins.
2
For VDD3P3_CPU and VDD3P3_RTC power domain, per-pin current sourced in the same domain is
gradually reduced from around 40 mA to around 29 mA, VOH >=2.64 V, as the number of currentsource pins increases.
3
Pins occupied by flash and/or PSRAM in the VDD_SDIO power domain were excluded from the test.
4.4 Current Consumption Characteristics
Owing to the use of advanced power-management technologies, the module can switch between different power
modes. For details on different power modes, please refer to Section RTC and Low-Power Management
in ESP32 Series Datasheet.
Table 9: Current Consumption Depending on RF Modes
Work mode
Description
TX
Active (RF working)
RX
1
Average (mA)
Peak (mA)
802.11b, 20 MHz, 1 Mbps, @19.5 dBm
239
379
802.11g, 20 MHz, 54 Mbps, @15 dBm
190
276
802.11n, 20 MHz, MCS7, @13 dBm
183
258
802.11n, 40 MHz, MCS7, @13 dBm
165
211
802.11b/g/n, 20 MHz
112
112
802.11n, 40 MHz
118
118
The current consumption measurements are taken with a 3.3 V supply at 25 °C of ambient temperature
at the RF port. All transmitters’ measurements are based on a 50% duty cycle.
2
The current consumption figures for in RX mode are for cases when the peripherals are disabled and the
CPU idle.
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4 Electrical Characteristics
4.5 WiFi RF Characteristics
4.5.1 WiFi RF Standards
Table 10: WiFi RF Standards
Name
Description
Center frequency range of operating channel
2412 ~ 2484 MHz
Wi-Fi wireless standard
IEEE 802.11b/g/n
11b: 1, 2, 5.5, 11 Mbps
20 MHz
Data rate
11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
11n: MCS0-7, 72.2 Mbps (Max)
40 MHz
11n: MCS0-7, 150 Mbps (Max)
PCB antenna, external antenna2
Antenna type
1
Device should operate in the center frequency range allocated by regional regulatory authorities.
Target center frequency range is configurable by software.
2
For the modules that use external antennas, the output impedance is 50 Ω. For other modules
without external antennas, the output impedance is irrelevant.
4.5.2 Transmitter Characteristics
Target TX power is configurable based on device or certification requirements. The default characteristics are
provided in Table 11.
Table 11: TX Power Characteristics
Rate
Typ (dBm)
11b, 1 Mbps
19.5
11b, 11 Mbps
19.5
11g, 6 Mbps
18
11g, 54 Mbps
14
11n, HT20, MCS0
18
11n, HT20, MCS7
13
11n, HT40, MCS0
18
11n, HT40, MCS7
13
4.5.3 Receiver Characteristics
Table 12: RX Sensitivity Characteristics
Rate
Typ (dBm)
1 Mbps
–97
2 Mbps
–94
5.5 Mbps
–92
11 Mbps
–88
Cont’d on next page
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Table 12 – cont’d from previous page
Rate
Typ (dBm)
6 Mbps
–93
9 Mbps
–91
12 Mbps
–89
18 Mbps
–87
24 Mbps
–84
36 Mbps
–80
48 Mbps
–77
54 Mbps
–75
11n, HT20, MCS0
–92
11n, HT20, MCS1
–88
11n, HT20, MCS2
–86
11n, HT20, MCS3
–83
11n, HT20, MCS4
–80
11n, HT20, MCS5
–76
11n, HT20, MCS6
–74
11n, HT20, MCS7
–72
11n, HT40, MCS0
–89
11n, HT40, MCS1
–85
11n, HT40, MCS2
–83
11n, HT40, MCS3
–80
11n, HT40, MCS4
–76
11n, HT40, MCS5
–72
11n, HT40, MCS6
–71
11n, HT40, MCS7
–69
Table 13: RX Maximum Input Level
Rate
Typ (dBm)
11b, 1 Mbps
5
11b, 11 Mbps
5
11g, 6 Mbps
0
11g, 54 Mbps
–8
11n, HT20, MCS0
0
11n, HT20, MCS7
–8
11n, HT40, MCS0
0
11n, HT40, MCS7
–8
Table 14: Adjacent Channel Rejection
Rate
Typ (dB)
11b, 11 Mbps
35
11g, 6 Mbps
27
Cont’d on next page
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Table 14 – cont’d from previous page
Rate
Typ (dB)
11g, 54 Mbps
13
11n, HT20, MCS0
27
11n, HT20, MCS7
12
11n, HT40, MCS0
16
11n, HT40, MCS7
7
4.6 Bluetooth Radio
4.6.1 Receiver – Basic Data Rate
Table 15: Receiver Characteristics – Basic Data Rate
Parameter
Conditions
Min
Typ
Max
Unit
Sensitivity @0.1% BER
—
–90
–89
–88
dBm
Maximum received signal @0.1% BER
—
0
—
—
dBm
Co-channel C/I
—
—
+7
—
dB
F = F0 + 1 MHz
—
—
–6
dB
F = F0 – 1 MHz
—
—
–6
dB
F = F0 + 2 MHz
—
—
–25
dB
F = F0 – 2 MHz
—
—
–33
dB
F = F0 + 3 MHz
—
—
–25
dB
F = F0 – 3 MHz
—
—
–45
dB
30 MHz ~ 2000 MHz
–10
—
—
dBm
2000 MHz ~ 2400 MHz
–27
—
—
dBm
2500 MHz ~ 3000 MHz
–27
—
—
dBm
3000 MHz ~ 12.5 GHz
–10
—
—
dBm
—
–36
—
—
dBm
Adjacent channel selectivity C/I
Out-of-band blocking performance
Intermodulation
4.6.2 Transmitter – Basic Data Rate
Table 16: Transmitter Characteristics – Basic Data Rate
Parameter
Min
Typ
Max
Unit
—
—
0
—
dBm
Gain control step
—
—
3
—
dB
RF power control range
—
–12
—
+9
dBm
+20 dB bandwidth
—
—
0.9
—
MHz
F = F0 ± 2 MHz
—
–55
—
dBm
F = F0 ± 3 MHz
—
–55
—
dBm
F = F0 ± > 3 MHz
—
–59
—
dBm
∆ f 1avg
—
—
—
155
kHz
∆ f 2max
—
127
—
—
kHz
RF transmit power
Conditions
*
Adjacent channel transmit power
Cont’d on next page
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Table 16 – cont’d from previous page
Parameter
Conditions
Min
Typ
Max
∆ f 2avg /∆ f 1avg
—
—
0.92
—
—
ICFT
—
—
–7
—
kHz
Drift rate
—
—
0.7
—
kHz/50 µs
Drift (DH1)
—
—
6
—
kHz
Drift (DH5)
—
—
6
—
kHz
*
Unit
There are a total of eight power levels from 0 to 7, and the transmit power ranges from –12 dBm to 9
dBm. When the power level rises by 1, the transmit power increases by 3 dB. Power level 4 is used
by default and the corresponding transmit power is 0 dBm.
4.6.3 Receiver – Enhanced Data Rate
Table 17: Receiver Characteristics – Enhanced Data Rate
Parameter
Conditions
Min
Typ
Max
Unit
π/4 DQPSK
Sensitivity @0.01% BER
—
–90
–89
–88
dBm
Maximum received signal @0.01% BER
—
—
0
—
dBm
Co-channel C/I
—
—
11
—
dB
F = F0 + 1 MHz
—
–7
—
dB
F = F0 – 1 MHz
—
–7
—
dB
F = F0 + 2 MHz
—
–25
—
dB
F = F0 – 2 MHz
—
–35
—
dB
F = F0 + 3 MHz
—
–25
—
dB
F = F0 – 3 MHz
—
–45
—
dB
Adjacent channel selectivity C/I
8DPSK
Sensitivity @0.01% BER
—
–84
–83
–82
dBm
Maximum received signal @0.01% BER
—
—
–5
—
dBm
C/I c-channel
—
—
18
—
dB
F = F0 + 1 MHz
—
2
—
dB
F = F0 – 1 MHz
—
2
—
dB
F = F0 + 2 MHz
—
–25
—
dB
F = F0 – 2 MHz
—
–25
—
dB
F = F0 + 3 MHz
—
–25
—
dB
F = F0 – 3 MHz
—
–38
—
dB
Adjacent channel selectivity C/I
4.6.4 Transmitter – Enhanced Data Rate
Table 18: Transmitter Characteristics – Enhanced Data Rate
Parameter
Conditions
Min
Typ
Max
Unit
RF transmit power (see note under Table 16)
—
—
0
—
dBm
Gain control step
—
—
3
—
dB
RF power control range
—
–12
—
+9
dBm
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Parameter
Conditions
Min
Typ
Max
Unit
π/4 DQPSK max w0
—
—
–0.72
—
kHz
π/4 DQPSK max wi
—
—
–6
—
kHz
π/4 DQPSK max |wi + w0|
—
—
–7.42
—
kHz
8DPSK max w0
—
—
0.7
—
kHz
8DPSK max wi
—
—
–9.6
—
kHz
8DPSK max |wi + w0|
—
—
–10
—
kHz
RMS DEVM
—
4.28
—
%
99% DEVM
—
100
—
%
Peak DEVM
—
13.3
—
%
RMS DEVM
—
5.8
—
%
99% DEVM
—
100
—
%
Peak DEVM
—
14
—
%
F = F0 ± 1 MHz
—
–46
—
dBm
F = F0 ± 2 MHz
—
–44
—
dBm
F = F0 ± 3 MHz
—
–49
—
dBm
F = F0 +/– > 3 MHz
—
—
–53
dBm
—
—
100
—
π/4 DQPSK modulation accuracy
8 DPSK modulation accuracy
In-band spurious emissions
EDR differential phase coding
%
4.7 Bluetooth LE Radio
4.7.1 Receiver
Table 19: Receiver Characteristics – Bluetooth LE
Parameter
Conditions
Min
Typ
Max
Unit
Sensitivity @30.8% PER
—
–94
–93
–92
dBm
Maximum received signal @30.8% PER
—
0
—
—
dBm
Co-channel C/I
—
—
+10
—
dB
F = F0 + 1 MHz
—
–5
—
dB
F = F0 – 1 MHz
—
–5
—
dB
F = F0 + 2 MHz
—
–25
—
dB
F = F0 – 2 MHz
—
–35
—
dB
F = F0 + 3 MHz
—
–25
—
dB
F = F0 – 3 MHz
—
–45
—
dB
30 MHz ~ 2000 MHz
–10
—
—
dBm
2000 MHz ~ 2400 MHz
–27
—
—
dBm
2500 MHz ~ 3000 MHz
–27
—
—
dBm
3000 MHz ~ 12.5 GHz
–10
—
—
dBm
—
–36
—
—
dBm
Adjacent channel selectivity C/I
Out-of-band blocking performance
Intermodulation
4.7.2 Transmitter
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Table 20: Transmitter Characteristics – Bluetooth LE
Parameter
Conditions
Min
Typ
Max
Unit
RF transmit power (see note under Table 16)
—
—
0
—
dBm
Gain control step
—
—
3
—
dB
RF power control range
—
–12
—
+9
dBm
F = F0 ± 2 MHz
—
–55
—
dBm
F = F0 ± 3 MHz
—
–57
—
dBm
F = F0 ± > 3 MHz
—
–59
—
dBm
∆ f 1avg
—
—
—
265
kHz
∆ f 2max
—
210
—
—
kHz
∆ f 2avg /∆ f 1avg
—
—
+0.92
—
—
ICFT
—
—
–10
—
kHz
Drift rate
—
—
0.7
—
kHz/50 µs
Drift
—
—
2
—
kHz
Adjacent channel transmit power
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R1
C5
GND
20K(5%)
VDD33
3
GND
40MHz(±10ppm）
C6
10nF/6.3V(10%)
3.3nF/6.3V(10%)
R3
499
C9
0.1uF
GPIO21
U0TXD
U0RXD
GPIO22
D1
ESD
GND
C11
C10
C21
10uF
NC
1uF
0.1uF
NC
GND
CAP1
CAP2
VDDA
XTAL_P
XTAL_N
VDDA
GPIO21
U0TXD
U0RXD
GPIO22
C12
GND
L5
C13
49
GND
2.0nH(0.1nH)
48
47
46
45
44
43
42
41
40
39
VDD33
C4
GND
VDD33
0.1uF
NC
GND
GND
GND
C17
NC
The values of C15, L4 and C14
vary with the actual PCB board.
NC: No component.
U2
GPIO19
GPIO23
GPIO18
GPIO5
SDI/SD1
SDO/SD0
SCK/CLK
SCS/CMD
SWP/SD3
SHD/SD2
GPIO17
SCS/CMD
1
SCK/CLK
6
SHD/SD2
7
/CS
CLK
/HOLD
U3
GPIO16
GND
C18
VDD_SDIO
1uF
ESP32-D0WD-V3
ESP32-D0WDR2-V3
VDD33
GND
DI
DO
/WP
FLASH
5
SDI/SD1
2
SDO/SD0
3
SWP/SD3
GND
GND
GPIO23
VDD33
CHIP_PU
GPIO22
SENSOR_VP
U0TXD
SENSOR_VN
U0RXD
GPIO34
GPIO21
GPIO35
EPAD
GPIO32
GPIO19
GPIO33
GPIO18
GPIO25
GPIO5
GPIO26
GPIO17
GPIO27
GPIO16
GPIO14
GPIO4
GPIO12
GPIO0
GND
C19
0.1uF
GND
Pin.15
GND
Pin.16
IO13
Pin.17
NC
Pin.18
NC
Pin.19
NC
Pin.20
NC
Pin.21
NC
Pin.22
NC
Pin.23
IO15
Pin.24
IO2
TBD
38
37
36
35
34
33
32
31
30
29
28
27
26
25
8
TBD
GPIO19
VDD3P3_CPU
GPIO23
GPIO18
GPIO5
SD_DATA_1
SD_DATA_0
SD_CLK
SD_CMD
SD_DATA_3
SD_DATA_2
GPIO17
VDD_SDIO
GPIO16
VCC
C16
VDDA
LNA_IN
VDD3P3
VDD3P3
SENSOR_VP
SENSOR_CAPP
SENSOR_CAPN
SENSOR_VN
CHIP_PU
VDET_1
VDET_2
32K_XP
32K_XN
GPIO25
GND
C14
1
2
3
4
SENSOR_VP 5
6
7
SENSOR_VN 8
CHIP_PU
9
10
GPIO34
11
GPIO35
12
GPIO32
13
GPIO33
14
GPIO25
4
C15
PCB_ANT
VDD_SDIO
GND
GPIO13
GPIO15
GPIO2
GPIO0
GPIO4
GND
TBD
GPIO26
GPIO27
MTMS
MTDI
VDD3P3_RTC
MTCK
MTDO
GPIO2
GPIO0
GPIO4
GND
L4
15
16
17
18
19
20
21
22
23
24
GND
1
2
GPIO26
GPIO27
GPIO14
GPIO12
GND
ANT1
Pin.1
GND
Pin.2
3V3
Pin.3
EN
Pin.4
SENSOR_VP
Pin.5
SENSOR_VN
Pin.6
IO34
Pin.7
IO35
Pin.8
IO32
Pin.9
IO33
Pin.10
IO25
Pin.11
IO26
Pin.12
IO27
Pin.13
IO14
Pin.14
IO12
GPIO2
GND
TBD
GPIO15
1uF
VDD33
C2
GPIO13
100pF
GND
0
C20
R2
C3
PCB ANTENNA
GND XOUT
GND
1
TBD
GND
2
The value of R2 varies with the actual
PCB board.
VDD33
U1
XIN
C1
4
GND
GND
ESP32-WROOM-32E & WROOM-32UE Datasheet v1.5
A
This is the reference design of the module.
22
B
5 Module Schematics
The values of C1 and C2 vary with
the selection of the crystal.
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5 Module Schematics
Espressif Systems
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ESP32-WROOM-32E(pin-out)
Figure 5: ESP32WROOM32E Schematics
Pin.38
GND
Pin.37
IO23
Pin.36
IO22
Pin.35
TXD0
Pin.34
RXD0
Pin.33
IO21
Pin.32
NC
Pin.31
IO19
Pin.30
IO18
Pin.29
IO5
Pin.28
IO17
Pin.27
IO16
Pin.26
IO4
Pin.25
IO0
D
R1
C5
GND
20K(5%)
3
2
1
TBD
VDD33
GND
40MHz(±10ppm)
C6
10nF/6.3V(10%)
3.3nF/6.3V(10%)
R3
499
C9
0.1uF
GPIO21
U0TXD
U0RXD
GPIO22
D1
ESD
GND
C13
C11
C10
C21
10uF
1uF
0.1uF
NC
GND
C
GND
CAP1
CAP2
VDDA
XTAL_P
XTAL_N
VDDA
GPIO21
U0TXD
U0RXD
GPIO22
49
L5
GND
2.0nH(0.1nH)
48
47
46
45
44
43
42
41
40
39
VDD33
C4
GND
VDD33
0.1uF
GND
GND
GND
SENSOR_VN
EN
GPIO34
GPIO35
GPIO32
GPIO33
GPIO25
VDDA
LNA_IN
VDD3P3
VDD3P3
SENSOR_VP
SENSOR_CAPP
SENSOR_CAPN
SENSOR_VN
CHIP_PU
VDET_1
VDET_2
32K_XP
32K_XN
GPIO25
NC: No component.
U2
GPIO19
VDD3P3_CPU
GPIO23
GPIO18
GPIO5
SD_DATA_1
SD_DATA_0
SD_CLK
SD_CMD
SD_DATA_3
SD_DATA_2
GPIO17
VDD_SDIO
GPIO16
38
37
36
35
34
33
32
31
30
29
28
27
26
25
GPIO19
GPIO23
GPIO18
GPIO5
SDI/SD1
SDO/SD0
SCK/CLK
SCS/CMD
SWP/SD3
SHD/SD2
GPIO17
8
1
2
3
4
5
6
7
8
9
10
11
12
13
14
SCS/CMD
1
SCK/CLK
6
SHD/SD2
7
VCC
SENSOR_VP
TBD
The values of C15, L4 and C14
vary with the actual PCB board.
23
/CS
CLK
/HOLD
U3
GPIO16
GND
C18
VDD_SDIO
1uF
ESP32-D0WD-V3
ESP32-D0WDR2-V3
VDD33
GND
DI
DO
/WP
FLASH
5
SDI/SD1
2
SDO/SD0
3
SWP/SD3
GND
Pin.38
GND
Pin.37
IO23
Pin.36
IO22
Pin.35
TXD0
Pin.34
RXD0
Pin.33
IO21
Pin.32
NC
Pin.31
IO19
Pin.30
IO18
Pin.29
IO5
Pin.28
IO17
Pin.27
IO16
Pin.26
IO4
Pin.25
IO0
GND
GPIO23
VDD33
EN
GPIO22
SENSOR_VP
U0TXD
SENSOR_VN
U0RXD
GPIO34
GPIO21
GPIO35
EPAD
GPIO32
GPIO19
GPIO33
GPIO18
GPIO25
GPIO5
GPIO26
GPIO17
GPIO27
GPIO16
GPIO14
GPIO4
GPIO12
GPIO0
GND
0.1uF
GND
Pin.15
GND
Pin.16
IO13
Pin.17
NC
Pin.18
NC
Pin.19
NC
Pin.20
NC
Pin.21
NC
Pin.22
NC
Pin.23
IO15
Pin.24
IO2
GPIO13
GPIO15
GPIO2
GPIO0
GPIO4
GPIO26
GPIO27
GPIO14
GPIO12
C19
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TBD
C14
VDD_SDIO
GND
LNA_IN
GND
IPEX
C15
TBD
4
3
2
J39
GND
L4
GPIO26
GPIO27
MTMS
MTDI
VDD3P3_RTC
MTCK
MTDO
GPIO2
GPIO0
GPIO4
GND
1
15
16
17
18
19
20
21
22
23
24
GND
Pin.1
GND
Pin.2
3V3
Pin.3
EN
Pin.4
SENSOR_VP
Pin.5
SENSOR_VN
Pin.6
IO34
Pin.7
IO35
Pin.8
IO32
Pin.9
IO33
Pin.10
IO25
Pin.11
IO26
Pin.12
IO27
Pin.13
IO14
Pin.14
IO12
GPIO2
GND
C2
GPIO15
1uF
VDD33
GND
GPIO13
100pF
GND
0
C20
C1
TBD
R2
C3
GND XOUT
4
The value of R2 varies with the actual
PCB board.
VDD33
U1
XIN
GND
GND
The values of C1 and C2 vary with
the selection of the crystal.
5 Module Schematics
Espressif Systems
GND
ESP32-WROOM-32UE(pin-out)
Figure 6: ESP32WROOM32UE Schematics
Title
Size
5
4
3
2
Document Number
C
Date:
Monday, July 04, 2022
Sheet
1
2
6 Peripheral Schematics
6 Peripheral Schematics
This is the typical application circuit of the module connected with peripheral components (for example, power
supply, antenna, reset button, JTAG interface, and UART interface).
VDD33
GND
C1
C2
22uF
0.1uF
1
GND
C4 12pF(NC)
R4
NC
GND
GND
2
GND
R1
X1
32.768KHz(NC)
GND
C7
12pF(NC)
EN
I36
I39
I34
X1: ESR = Max. 70 KΩ I35
IO32
R3
0(NC)
IO33
R5
0(NC)
IO25
R4: 5 MΩ ~ 10 MΩ
IO26
IO27
IO14
IO12
C3
TBD
GND
VDD33
IO23
IO22
TXD0
RXD0
IO21
IO19
IO18
IO5
IO17
IO16
IO4
IO0
15
16
17
18
19
20
21
22
23
24
TMS
TDI
TCK
TDO
1
2
3
4
UART
GND
R6
1
2
VDD33
10K
GND
Boot Option
R2
1
2
3
4
JTAG
1
2
3
4
SW1
JP3
IO14
IO12
IO13
IO15
JP2
IO15
IO2
IO13
U1
JP1
1
2
3
4
In module variants that have
embedded QSPI PSRAM,
i.e., that embed
ESP32-D0WDR2-V3, IO16
should be pulled-up and can
not be used for other funtion.
GND2
IO13
NC
NC
NC
NC
NC
NC
IO15
IO2
NC: No component.
TBD
ESP32-WROOM-32E/ESP32-WROOM-32UE
39
P_GND 38
1
GND1
GND3
2
37
IO23 36
3 3V3
IO22 35
4 EN
TXD0 34
5 SENSOR_VP
RXD0 33
6 SENSOR_VN
IO34
IO21 32
7
NC 31
8 IO35
IO19 30
9 IO32
IO18 29
10 IO33
IO5 28
11 IO25
IO17 27
12 IO26
IO16 26
13 IO27
IO4 25
14 IO14
IO12
IO0
C4
0
EN
0.1uF
GND
IO12 should be kept low when the module is powered on.
Figure 7: Peripheral Schematics
• Soldering EPAD Pin 39 to the ground of the base board is not a must, however, it can optimize thermal
performance. If you choose to solder it, please apply the correct amount of soldering paste.
• To ensure that the power supply to the ESP32 chip is stable during power-up, it is advised to add an RC
delay circuit at the EN pin. The recommended setting for the RC delay circuit is usually R = 10 kΩ and C =
1 µF. However, specific parameters should be adjusted based on the power-up timing of the module and
the power-up and reset sequence timing of the chip. For ESP32’s power-up and reset sequence timing
diagram, please refer to Section Power Scheme in ESP32 Series Datasheet.
5
4
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7 Physical Dimensions and PCB Land Pattern
7 Physical Dimensions and PCB Land Pattern
ESP32-WROOM-32E Dimensions
ESP32-WROOM-32E Dimensions
7.1 Physical Dimensions
Unit: mm
Unit: mm
18±0.15
3.1±0.15
0.8
3.1±0.15
0.8
3.7
3.7 3.7
38 x 38
0.9x 0.9
38 x Ø0.55
1.05 1.05
17.6 17.6
15.8
38 x Ø0.55
0.9 0.9
10.2910.29
0.9
0.5
0.9
0.5
15.8
Ø
Ø
0. 0.
5
5
25.5±0.15
25.5±0.15
16.5116.51
1.5 1.5 38 x 38
0.9x 0.9
1.27 1.27
6.19 6.19
18±0.15
3.7
7.5
7.5
11.43
38 x 0.45
1.1
11.43
38 xTop
0.45
View 1.1
Side View
1.27
38 x 0.85
1.27
38
x 0.85
Bottom
View
Top View
Side View
Bottom View
Figure 8: ESP32WROOM32E Physical Dimensions
ESP32-WROOM-32UE Dimensions
ESP32-WROOM-32UE Dimensions
Unit: mm
Unit: mm
38 x 38
0.9x 0.9
3.07 3.07
1.1 1.1
15.65
13.0513.05
15.65
38 x Ø0.55
17.5 17.5
19.2±0.15
19.2±0.15
16.5116.51
1.5 1.5 38 x 38
0.9x 0.9
1.27 1.27
10.75
38 x Ø0.55
0.5 0.5
10.6710.67
0.9
0.5
0.9
0.5
10.75
3.7
3.7 3.7
3.2±0.15
0.8
3.2±0.15
0.8
18±0.15
3.27
18±0.15
3.27
3.7
11.43
38 x 0.45 1.18
11.43
38 xTop
0.45
View1.18
Side View
1.27
38 x 0.85
1.27
38
x 0.85
Bottom
View
Top View
Side View
Bottom View
Figure 9: ESP32WROOM32UE Physical Dimensions
7.5
7.5
Note:
For information about tape, reel, and product marking, please refer to Espressif Module Package Information.
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7 Physical Dimensions and PCB Land Pattern
ESP32-WROOM-32E
7.2 Recommended
PCB Land Pattern
Land Pattern
Unit: mm
Via for thermal pad
Copper
Antenna Area
38 x1.5
38
1
1.5
0.5
7.5
1.27
10.29
3.7
0.9
3.7
25.5
0.9
0.5
38 x0.9
16.51
6.19
7.49
18
25
14
0.5 1.27
3.285 3.285
17.5
Figure 10: ESP32WROOM32E Recommended PCB Land Pattern
ESP32-WROOM-32UE Land Pattern
Unit: mm
Via for thermal pad
Copper
18
38 x1.5
38
1.19
19.2
0.9
0.5
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26
1.27
10.67
1.5
0.5
3.7
0.9
3.7
38 x0.9
16.51
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25
14
0.5 1.27
ESP32-WROOM-32UE Land Pattern
7 Physical Dimensions and PCB Land Pattern
Unit: mm
Via for thermal pad
Copper
18
38 x1.5
38
1.19
19.2
0.9
0.5
7.5
1.27
10.67
1.5
0.5
3.7
0.9
3.7
38 x0.9
16.51
1
25
14
0.5 1.27
3.285 3.285
17.5
Figure 11: ESP32WROOM32UE Recommended PCB Land Pattern
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7 Physical Dimensions and PCB Land Pattern
7.3 Dimensions of External Antenna Connector
ESP32-WROOM-32UE uses the first generation external antenna connector as shown in Figure 12. This
connector is compatible with the following connectors:
• U.FL Series connector from Hirose
• MHF I connector from I-PEX
• AMC connector from Amphenol
Unit: mm
Figure 12: Dimensions of External Antenna Connector
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8 Product Handling
8 Product Handling
8.1 Storage Conditions
The products sealed in moisture barrier bags (MBB) should be stored in a non-condensing atmospheric
environment of < 40 °C and 90%RH. The module is rated at the moisture sensitivity level (MSL) of 3.
After unpacking, the module must be soldered within 168 hours with the factory conditions 25 ± 5 °C and 60
%RH. If the above conditions are not met, the module needs to be baked.
8.2 Electrostatic Discharge (ESD)
• Human body model (HBM): ±2000 V
• Charged-device model (CDM): ±500 V
8.3 Reflow Profile
Temperature (℃)
Solder the module in a single reflow.
Peak Temp.
235 ~ 250 ℃
250
Preheating zone
150 ~ 200 ℃
60 ~ 120 s
217
200
Reflow zone
217 ℃ 60 ~ 90 s
Cooling zone
–1 ~ –5 ℃/s
Soldering time
> 30 s
Ramp-up zone
1 ~ 3 ℃/s
100
50
25
Time (sec.)
0
0
50
100
150
200
250
Ramp-up zone — Temp.: 25 ~ 150 ℃ Time: 60 ~ 90 s Ramp-up rate: 1 ~ 3 ℃/s
Preheating zone — Temp.: 150 ~ 200 ℃ Time: 60 ~ 120 s
Reflow zone — Temp.: >217 ℃
60 ~ 90 s; Peak Temp.: 235 ~ 250 ℃ Time: 30 ~ 70 s
Cooling zone — Peak Temp. ~ 180 ℃ Ramp-down rate: –1 ~ –5 ℃/s
Solder — Sn-Ag-Cu (SAC305) lead-free solder alloy
Figure 13: Reflow Profile
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8 Product Handling
8.4 Ultrasonic Vibration
Avoid exposing Espressif modules to vibration from ultrasonic equipment, such as ultrasonic welders or
ultrasonic cleaners. This vibration may induce resonance in the in-module crystal and lead to its malfunction or
even failure. As a consequence, the module may stop working or its performance may deteriorate.
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9 Related Documentation and Resources
9 Related Documentation and Resources
Related Documentation
• ESP32 Series Datasheet – Specifications of the ESP32 hardware.
• ESP32 Technical Reference Manual – Detailed information on how to use the ESP32 memory and peripherals.
• ESP32 Hardware Design Guidelines – Guidelines on how to integrate the ESP32 into your hardware product.
• ESP32 ECO and Workarounds for Bugs – Correction of ESP32 design errors.
• Certificates
https://espressif.com/en/support/documents/certificates
• ESP32 Product/Process Change Notifications (PCN)
https://espressif.com/en/support/documents/pcns
• ESP32 Advisories – Information on security, bugs, compatibility, component reliability.
https://espressif.com/en/support/documents/advisories
• Documentation Updates and Update Notification Subscription
https://espressif.com/en/support/download/documents
Developer Zone
• ESP-IDF Programming Guide for ESP32 – Extensive documentation for the ESP-IDF development framework.
• ESP-IDF and other development frameworks on GitHub.
https://github.com/espressif
• ESP32 BBS Forum – Engineer-to-Engineer (E2E) Community for Espressif products where you can post questions,
share knowledge, explore ideas, and help solve problems with fellow engineers.
https://esp32.com/
• The ESP Journal – Best Practices, Articles, and Notes from Espressif folks.
https://blog.espressif.com/
• See the tabs SDKs and Demos, Apps, Tools, AT Firmware.
https://espressif.com/en/support/download/sdks-demos
Products
• ESP32 Series SoCs – Browse through all ESP32 SoCs.
https://espressif.com/en/products/socs?id=ESP32
• ESP32 Series Modules – Browse through all ESP32-based modules.
https://espressif.com/en/products/modules?id=ESP32
• ESP32 Series DevKits – Browse through all ESP32-based devkits.
https://espressif.com/en/products/devkits?id=ESP32
• ESP Product Selector – Find an Espressif hardware product suitable for your needs by comparing or applying filters.
https://products.espressif.com/#/product-selector?language=en
Contact Us
• See the tabs Sales Questions, Technical Enquiries, Circuit Schematic & PCB Design Review, Get Samples
(Online stores), Become Our Supplier, Comments & Suggestions.
https://espressif.com/en/contact-us/sales-questions
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Revision History
Revision History
Date
Version
Release notes
Added module variants embedded with ESP32-D0WDR2-V3 chip
Added Table 1: ESP32-WROOM-32E Series Comparison and Table 2: ESP32-
2022-07-20
v1.5
WROOM-32UE Series Comparison
Added Figure 4 and Table 5 in Section 3.3: Strapping Pins
Updated Section 8: Product Handling
2022-02-22
v1.4
Added a link to RF certificates in Section 1.1
Fixed a pin name typo in Figure 7
Added a 105 °C module variant
Updated Table 6: Absolute Maximum Ratings
Updated Table 7: Recommended Operating Conditions
2021-11-08
v1.3
Replaced Espressif Product Ordering Information with ESP Product Selector
Updated the description of TWAI in Section 1.1: Features
Added a note below Figure 9: ESP32-WROOM-32UE Physical Dimensions
Upgraded figure formatting
Upgraded document formatting
Updated Figure 10: ESP32-WROOM-32E Recommended PCB Land Pattern,
Figure 11: ESP32-WROOM-32UE Recommended PCB Land Pattern, Figure 8:
2021-02-09
v1.2
ESP32-WROOM-32E Physical Dimensions, and Figure 9: ESP32-WROOM-32UE
Physical Dimensions.
Modified the note below Figure 13: Reflow Profile.
Updated the trade mark from TWAI™ to TWAI® .
Updated the table 9.
2020-11-02
v1.1
Added a note to EPAD in Section 7.2 Recommended PCB Land Pattern.
Updated the note to RC circuit in Section 6 Peripheral Schematics.
2020-05-29
v1.0
Official release.
2020-05-18
v0.5
Preliminary release.
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Disclaimer and Copyright Notice
Information in this document, including URL references, is subject to change without notice.
ALL THIRD PARTY’S INFORMATION IN THIS DOCUMENT IS PROVIDED AS IS WITH NO
WARRANTIES TO ITS AUTHENTICITY AND ACCURACY.
NO WARRANTY IS PROVIDED TO THIS DOCUMENT FOR ITS MERCHANTABILITY, NONINFRINGEMENT, FITNESS FOR ANY PARTICULAR PURPOSE, NOR DOES ANY WARRANTY
OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION OR SAMPLE.
All liability, including liability for infringement of any proprietary rights, relating to use of information
in this document is disclaimed. No licenses express or implied, by estoppel or otherwise, to any
intellectual property rights are granted herein.
The Wi-Fi Alliance Member logo is a trademark of the Wi-Fi Alliance. The Bluetooth logo is a
registered trademark of Bluetooth SIG.
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All trade names, trademarks and registered trademarks mentioned in this document are property
of their respective owners, and are hereby acknowledged.
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