RLSD32A081LC

TVS/ESD Arrays RLSD32AXX1LC Features l l l l l l 300 0 Watts Peak Pulse Power per Line (tp = 8/20 8/20μs) Bidirectional Configuration Protects One Power or I/O Port ESD Protection > 40 kilovolts Low Clamping Voltages Ultra Low Capacitance: 1.0 pF Typical SOD-323 Electrical symbol 1 Applications l l l l l Ethernet - 10/100/1000 Base T Cellular Phones Handheld - Wireless Systems Personal Digital Assistant (PDA) USB Interface 2 Part Number Code R L S D 3 2 Package LOGO A 0 5 Straight foot overhanging SOD-323 323 1 L C Protects 1 Lines V= Unidirectional C= Bidirectional VRWM:5V Low Capacitance Absolute Maximum Rating Rating Symbol Value Units Peak Pulse Power (tp =8/20μs) PPP 300 Watts ESD Voltage (Contact) VESD ±8 kV ESD Voltage (Air) VESD ±15 kV Operating Temperature TOPT -55 to 150 °C Storage Temperature TSTG -55 to 150 °C Electrical Characteristics (@ 25°C Unless Otherwise Specified) Reverse Stand-Off Voltage Minimum Breakdown Voltage Peak Pulse Voltage @8/20μS Reverse Leakage @VRWM Typical Capacitance VRWM VBR @1mA VC@1A (max.) @IPP IR@VRWM DC=0V CJ@ 1 MHz V V V V A μA pF RLSD32A051LC 5.0 6.0 9.8 20 20 1 1 RLSD32A081LC 8.0 8.5 13.4 25 15 1 1 RLSD32A121LC 12.0 13.3 19.0 30 8 1 1 RLSD32A151LC 15.0 16.7 24.0 40 6 1 1 RLSD32A241LC 24.0 26.7 43.0 60 3 1 1 VC @8/20μS Type Number Specifications are subject to change without notice. Please refer to http://www.ruilon.com.cn for current information. Revised: 2021-02-07 Page:1 TVS/ESD Arrays RLSD32AXX1LC Electrical Parameters (T=25°C) Symbol I Parameter IPP Maximum Reverse Peak Pulse Current VC Clamping Voltage @ IPP VRWM Ipp Working Peak Reverse Voltage IR VBR IT IR VC VBR VRWM Maximum Reverse Leakage Current @ VRWM IR IT Breakdown Voltage @ IT IT Test Current IF Forward Current VF Forward Voltage @ IF VRWM VBR VC V Ipp Characteristic Curves 8/20μs Pulse Waveform Fig2.ESD .ESD Pulse Waveform (according to IEC61000-4-2) IEC61000 120 tr 100 Test Waveform Parameters tr=8μS td=20μS Peak Value Ipp 80 Percent of Peak Pulse Current% Ipp-Peak Pulse Current-%of Ipp Fig 1. 60 40 td=t Ipp/2 20 0 100% 90% 10% 0.7~1ns Time(ns) 0 5 10 15 20 25 30 t-Time(μS) Figure 4.ESD ESD Clamping(8KV Contact per IEC61000-4-2) Fig 3. Power Derating Curve Tek Run:5.00GS/s Sample we05s Percent of Rated Power for IPP 110 100 90 80 70 60 50 40 30 20 10 R1 0 0 25 50 75 100 125 150 Ch1 5.00mV M10.0ns Ch1 1.36V Ambient Temperature-TA((°C) Specifications are subject to change without notice. Please refer to http://www.ruilon.com.cn for current information. Revised: 2021-02-07 Page:2 TVS/ESD Arrays RLSD32AXX1LC Dimensions Millimeters Inches DIM Min Max Min Max A 1.60 1.80 0.063 0.071 B 0.25 0.35 0.010 0.014 C 2.50 2.70 0.098 0.106 D 0.00 1.00 0.00 0.039 E 1.20 1.40 0.047 0.055 F 0.08 0.15 0.003 0.006 L 0.475REF 0.019REF L1 0.25 0.40 0.010 0.016 H 0.00 0.10 0.00 0.004 Part Number Component package Quantity Reel Size Molding compound flammability rating Lead Finish RLSD32A051LC SOD-323 3000 7 inch UL 94V-0 94V Lead Free Mounting PAD (mm) Soldering Parameters - Reflow Soldering (Surface Mount Devices) Reflow Condition TP Ramp-up Critical Zone TL to TP TL Pre Heat Temperature TS(max) Ramp-down TS(min) Preheat Time to peak temperature (t 25℃ to peak) 150°C -Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 -180 Seconds 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Time Specifications are subject to change without notice. Please refer to http://www.ruilon.com.cn for current information. -Temperature Temperature Min (Ts(min)) Average ramp up rate ( Liquids Liquid Temp TL) to peak Reflo w 25 Pb - Free assembly - Temperature (TL) (Liquids) 217°C - Time (min to max) (ts) 60 -150 Seconds Peak Temperature (TP) 260 +0/-5°C Time within 5°C of actual peak Temperature (tp) 20 - 40 Seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max Do not exceed 280°C Revised: 2021-02-07 Page:3