FCM1005KF-102T03

P1. TAI-TECH Ferrite Chip Bead(Lead Free) FCM1005KF-102T03 1.Features 1.Monolithic inorganic material construction. 2.Closed magnetic circuit avoids crosstalk. 3.S.M.T. type. Halogen Pb Halogen-free Pb-free 4.Suitable for flow and reflow soldering. 5.Shapes and dimensions follow E.I.A. spec. 6.Available in various sizes. 7.Excellent solderability and heat resistance. 8.High reliability. 9.This component is compliant with RoHS legislation and also support lead-free soldering. 2.Dimensions D Chip Size C A A 1.00±0.10 B 0.50±0.10 C 0.50±0.10 D 0.25±0.10 Units: mm B 3.Part Numbering FCM 1005 KF A B C A: Series B: Dimension C: Material D: Impedance E: Packaging F: Rated Current - 102 T 03 D E F LxW Lead Free Material 102=1000Ω T=Taping and Reel, B=Bulk(Bags) 03=300mA 4.Specification Tai-Tech Part Number Impedance (Ω) Test Frequency (Hz) DC Resistance (Ω) max. Rated Current (mA) max. FCM1005KF-102T03 1000±25% 60mV/100M 1.20 300 „ Impedance-Frequency Characteristics FCM1005KF-102T03 1500 IMPEDANCE(Ohm) 1250 1000 Z 750 500 250 X R 0 1 10 100 FREQUENCY(MHz) www.tai-tech.com.tw 1000 P2. TAI-TECH 5. Reliability and Test Condition Item Series No. Operating Temperature Performance FCB FCM HCB HPB HFB FCA Test Condition FCI FHI FCH HCI -- -55~+125℃ (Including self-temperature rise) -40~+85℃ (Including self-temperaturerise) -- -55~+125℃ -40~+85℃ Storage Temperature -- Impedance (Z) Inductance (Ls) Q Factor HP4291A, HP4287A+16092A Refer to standard electrical characteristics list DC Resistance HP4338B Rated Current ** Temperature Rise Test Solder heat Resistance 1. Applied the allowed DC current. 2. Temperature measured by digital surface thermometer. Preheat: 150℃,60sec. Solder: Sn-Ag3.0-Cu0.5 Solder tamperature: 260±5℃ Flux for lead free: rosin Dip time: 10±0.5sec. 30℃ max. (ΔT) Appearance: No significant abnormality. No mechanical damage. Impedance change: Within ± 30%. Remaining terminal electrode:70% min. Preheating Dipping Natural cooling 260°C 150°C 60 second Preheat: 150℃,60sec. Solder: Sn-Ag3.0-Cu0.5 Solder tamperature: 245±5℃ Flux for lead free: rosin Dip time: 4±1sec. Preheating Dipping Natural cooling More than 90% of the terminal Solderability 245° C electrode should be covered 150° C with solder. 4±1 second 60 second W The terminal electrode and the dielectric must Terminal strength not be damaged by the forces applied on the right conditions. 10±0.5 second W For FCB FCM HCB HPB HFB FCI FHI FCH HCI: Size Force (Kgf) Time(sec) 1005 0.2 1608 0.5 2012 0.6 3216 1.0 >25 3225 1.0 4516 1.0 4532 1.5 5750 2.0 For FCA: Size Force (Kgf) Time(sec) 3216 0.5 >25 20(.787) The terminal electrode and the dielectric must Flexture strength not be damaged by the forces applied on the Bending 45(1.772) 45(1.772) right conditions. Solder a chip on a test substrate, bend the substrate by 2mm (0.079in)and return. 40(1.575) 100(3.937) R 0.5(0.02) Bending Strength The ferrite should not be damaged by Forces applied on the right condition. Appearance: Cracking, shipping and any other defects harmful to the Random Vibration Test characteristics should not be allowed. Impedance: within±30% www.tai-tech.com.tw Size mm(inches) P-Kgf 1608 2012 FCA3216 3216 3225 4516 4532 5750 0.80(0.033) 1.40(0.055) 2.00(0.079) 0.3 1.0 1.5 2.00(0.079) 2.5 2.70(0.106) 2.5 Frequency: 10-55-10Hz for 1 min. Amplitude: 1.52mm Directions and times: X, Y, Z directions for 2 hours. A period of 2 hours in each of 3 mutually perpendicular directions (Total 6 hours). P3. TAI-TECH Item Performance Test Condition Temperature: 125±5℃(bead),85±5℃(inductor) Applied current: rated current. Duration: 1008±12hrs. Measured at room temperature after placing for 2 to 3hrs. Loading at High Appearance: no damage. Temperature Impedance: within±30%of initial value. Inductance: within±10%of initial value. Q: within±30%of initial value. (FCI FHI FCH) Q: within±20%of initial value. (HCI ) Humidity Humidity: 90~95%RH. Temperature: 40±2℃. Temperature: 60±2℃.(HCI) Duration: 1008±12hrs. Measured at room temperature after placing for 2 to 3hrs. For Bead： Appearance: no damage. Phase Temperature(℃) Time(min.) 1 -55±2℃ 2 +125±5℃ Measured: 5 times 30±3 Impedance: within±30%of initial value. 30±3 Inductance: within±10%of initial value. Q: within±30%of initial value. (FCI FHI FCH) For Inductor： Q: within±20%of initial value. Phase Temperature(℃) Time(min.) (HCI) Thermal shock 1 -40±2℃ 2 +85±5℃ Measured: 100 times Low temperature storage 30±3 30±3 test Temperature: -55±2℃. Duration: 1008±12hrs. Measured at room temperature after placing for 2 to 3hrs. Drop 10 times on a concrete floor from a height of 75cm a: No mechanical damage Drop For FCB FCM HCB HPB HFB FCA： Condition for 1 cycle Step1: -55±2℃ 30±3 min. Step2: +125±5℃ 30±3 min. Number of cycles: 5 For FCI FHI FCH HCI： Condition for 1 cycle Step1: -40±2℃ 30±3 min. Step2: +85±5℃ 30±3 min. Number of cycles: 100 Measured at room temperature after placing for 2 to 3 hrs. b: Impedance change: ±30% Derating **Derating Curve For the ferrite chip bead which withstanding current over 1.5A, as the operating temperature over 85℃, the derating current information is necessary to consider with. For the detail derating of current, please refer to the Derated Current vs. Operating Temperature curve. Derated Current(A) 6 5 4 3 2 1 6A 5A 4A 3A 2A 1.5A 1A 0 6.Soldering and Mounting 85 125 Operating Temperature(°C) 6-1. Recommended PC Board Pattern Land Patterns For Reflow Soldering Chip Size FCB 1005 1.0±0.10 0.50±0.10 0.50±0.10 0.25±0.10 2.10 0.50 0.55 FCM 1608 1.6±0.15 0.80±0.15 0.80±0.15 0.30±0.20 2.60 0.60 0.80 2.0±0.20 1.25±0.20 0.85±0.20 0.50±0.30 3.00 1.00 1.00 2.0±0.20 1.25±0.20 1.25±0.20 0.50±0.30 HCB 2012 HPB FCA3216 A(mm) B(mm) C(mm) D(mm) L(mm) G(mm) H(mm) HFB 2520 2.5±0.20 2.00±0.20 1.60±0.20 0.50±0.30 3.90 1.50 1.50 FCI 3216 3.2±0.20 1.60±0.20 1.10±0.20 0.50±0.30 4.40 2.20 1.40 FHI 3225 3.2±0.20 2.50±0.20 1.30±0.20 0.50±0.30 4.40 2.20 3.40 FCH 4516 4.5±0.20 1.60±0.20 1.60±0.20 0.50±0.30 5.70 2.70 1.40 HCI 4532 4.5±0.20 3.20±0.20 1.50±0.20 0.50±0.30 5.90 2.57 4.22 UHI 5750 5.7±0.20 5.00±0.30 1.80±0.20 0.50±0.30 8.00 4.00 5.80 Land Solder Resist 2.8 0.8 Type 2.2-2.6 Series 0.8 Pitch 0.4 H L PC board should be designed so that products are not sufficient under mechanical stress as warping the board. Products shall be positioned in the sideway direction against the mechanical stress to prevent failure. G 6-2. Soldering Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. www.tai-tech.com.tw P4. TAI-TECH 6-2.1 Lead Free Solder re-flow: Recommended temperature profiles for lead free re-flow soldering in Figure 1. 6-2.2 Solder Wave: Wave soldering is perhaps the most rigorous of surface mount soldering processes due to the steep rise in temperature seen by the circuit when immersed in the molten solder wave , Due to the risk of thermal damage to products, wave soldering of large size products is discouraged. Recommended temperature profile for wave soldering is shown in Figure 2. 6-2.3 Soldering Iron(Figure 3): Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. •Never contact the ceramic with the iron tip •1.0mm tip diameter (max) Note：•Preheat circuit and products to 150℃ •350℃ tip temperature for Ferrite chip bead (max) •Use a 20 watt soldering iron with tip diameter of 1.0mm •Limit soldering time to 3 sec. Reflow Soldering SOLDERING PRE-HEATING PRE-HEATING SOLDERING 20~40s NATURAL COOLING NATURAL COOLING PRE-HEATING NATURAL COOLING SOLDERING 3s(max.) 350 260 60~150s 200 150 60~180s 10s(max.) 0 217 245 TEMPERATURE C 0 TEMPERATURE C TEMPERATURE(°C) TP(260° C / 10s max.) 150 330 150 480s max. 25 TIME( sec.) Over 2 min. Gradual Cooling Within 10 sec. Figure 1. Re-flow Soldering(Lead Free) Gradual Cooling Over 1 min. Figure 2. Wave Soldering Figure 3. Hand Soldering 6-2.4 Solder Volume: Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. Solder shall be used not to be exceed as shown in right side: Upper limit Recommendable t 7.Packaging Information 7-1. Reel Dimension C B R1 .9 0 R1 7"x8mm Type A(mm) B(mm) C(mm) D(mm) 7”x8mm 9.0±0.5 60±2 13.5±0.5 178±2 7”x12mm 13.5±0.5 60±2 13.5±0.5 178±2 .5 R0.5 120° 7"x12mm 7-2.1 Tape Dimension / 8mm ■Material of taping is paper 05 0. 10. + 56 1. D: F:3.5±0.1 B0 t W:8.0±0.1 P0:4±0.1 E:1.75±0.1 P2:2±0.1 A0 P Series Size Bo(mm) Ao(mm) Ko(mm) P(mm) t(mm) D1(mm) FCB.FCM.HCB 100505 1.12±0.03 0.62±0.03 0.60±0.03 2.0±0.10 0.60±0.03 none HPB.HFB.FCI 160808 1.85±0.05 1.05±0.05 0.95±0.05 4.0±0.10 0.95±0.05 none FHI.FCH.HCI 201209 2.30±0.05 1.50±0.05 0.95±0.05 4.0±0.10 0.95±0.05 none Ko ■Material of taping is plastic Po:4±0.1 t F:3.5±0.05 ± :1 D1 P 1 0. Series Size Bo(mm) Ao(mm) Ko(mm) P(mm) t(mm) D1(mm) FCB,FCM 160808 1.95±0.10 1.05±0.10 1.05±0.10 4.0±0.10 0.23±0.05 none HCB,HPB 201209 2.25±0.10 1.42±0.10 1.04±0.10 4.0±0.10 0.22±0.05 1.0±0.10 HFB.FCI 201212 2.35±0.10 1.50±0.10 1.45±0.10 4.0±0.10 0.22±0.05 1.0±0.10 FHI.FCH 321611 3.50±0.10 1.88±0.10 1.27±0.10 4.0±0.10 0.22±0.05 1.0±0.10 HCI 322513 3.42±0.10 2.77±0.10 1.55±0.10 4.0±0.10 0.22±0.05 1.0±0.10 FCA 321609 3.40±0.10 1.77±0.10 1.04±0.10 4.0±0.10 0.22±0.05 1.0±0.10 A W:8.0±0.1 1 0. 5+ 1. D: A Ao Bo P2:2±0.05 E:1.75±0.1 D 13 2±0.5 .5 ±0 .5 A Ko SECTION A-A www.tai-tech.com.tw P5. TAI-TECH 7-2.2 Tape Dimension / 12mm 1.75±0.1 Po:4±0.1 P2:2.0±0.05 t D1:1.5±0.1 Series Size Bo(mm) Ao(mm) Ko(mm) P(mm) FCB, 451616 4.95±0.1 1.93±0.1 1.93±0.1 4.0±0.1 0.24±0.05 1.5±0.1 453215 4.95±0.1 3.66±0.1 1.85±0.1 8.0±0.1 0.24±0.05 1.5±0.1 FCI 575018 6.10±0.1 5.40±0.1 2.00±0.1 8.0±0.1 0.30±0.05 1.5±0.1 Ao 7-3. Packaging Quantity Chip Size 575018 453215 451616 322513 321611 201212 201209 160808 100505 Chip / Reel 1000 1000 2000 2500 3000 2000 4000 4000 10000 Inner box 4000 4000 8000 12500 15000 10000 20000 20000 50000 Middle box 20000 20000 40000 62500 75000 50000 100000 100000 250000 Carton 40000 40000 80000 125000 150000 100000 200000 200000 500000 Bulk (Bags) 7000 12000 20000 30000 50000 100000 150000 200000 300000 7-4. Tearing Off Force Top cover tape D1(mm) HCB.FCM Ko P F t(mm) Bo W:12.0±0.1 5.5±0.05 D:1.5+0.1 The force for tearing off cover tape is 15 to 60 grams in the arrow direction under the following conditions. 165° to180° Base tape Room Temp. Room Humidity Room atm Tearing Speed (℃) (%) (hPa) mm/min 5~35 45~85 860~1060 300 Application Notice •Storage Conditions To maintain the solderability of terminal electrodes: 1. Temperature and humidity conditions: -10~ 40℃ and 30~70% RH. 2. Recommended products should be used within 6 months from the time of delivery. 3. The packaging material should be kept where no chlorine or sulfur exists in the air. •Transportation 1.Products should be handled with care to avoid damage or contamination from perspiration and skin oils. 2. The use of tweezers or vacuum pick up is strongly recommended for individual components. 3. Bulk handling should ensure that abrasion and mechanical shock are minimized. www.tai-tech.com.tw