ISP4520-US-ST

ISP4520 Data Sheet Smart LoRa and Bluetooth Low Energy Module with MCU and Antennas This highly miniaturized LGA module, 9.8 x 17.2 x 1.7 mm, is based on the new SX126x LoRa transceiver series and nRF52832 BLE chip. Using a simple user interface via the SPI connection and integrating a Cortex™ M4 CPU, flash and RAM memory combined with single optimized antenna for both LoRa and BLE standards, ISP4520 offers the perfect stand-alone module solution for large spectrum of application in IoT domains. For longer range use case, ISP4520 can be used in conjunction with an external LoRa antenna. Key Features ▪ LoRaWAN Protocol Stack ▪ Single Mode BLE 5 Ready ▪ NFC-A Tag for OOB pairing ▪ Fully integrated LoRa & BLE matching and Antennas ▪ Integrated LoRa and BLE 32 MHz & 32.768 kHz Clocks ▪ LoRa section based on Semtech SX126x series transceiver ▪ BLE section based on Nordic Semi nRF52 ▪ Externally Controlled or using embedded 32-bit ARM Cortex M4 CPU ▪ Smart Cities / Smart Retail ▪ Industrial Internet ▪ Big Data / Data Science ▪ Energy Engagement / Smart grids Certifications ▪ 512 kB Flash and 64 kB SRAM ▪ Analog and Digital peripherals ▪ CE certified ▪ SPI interface ▪ FCC / IC certified ▪ Supply Voltage 1.8V to 3.6V ▪ Very small size 9.8 x 17.2 x 1.7 mm ▪ Temperature -30 to +85 °C Applications ▪ Telec certified ▪ LoRaWAN pre-certified ▪ Bluetooth SIG certified ▪ RoHS compliant www.insightsip.com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission. Specification subject to change without notice. Document reference isp_lora_DS4520_R9.docx Page 1/30 ISP4520 Data Sheet Revision History Revision Date Ref Change Description R0 25/01/2018 hc pg Preliminary release R1 17/05/2018 hc pg Engineering sample release R2 05/07/2018 hc pg Schematic & IO changes R3 21/02/2019 hc pg RF performance update R4 16/10/2019 jf pg RF specification update, addition of §5 and §6 R5 13/02/2020 nw pg JP variant extended to Asia Pacific zone, called AS R6 06/04/2020 ys pg EU Variant Engineering E US and AS Variant Engineering B Electrical specification update, schematics update R7 07/01/2021 cb pg Marking added for CE, Telec and US/IC versions R8 19/01/2022 cb pg Removed pending in certification pending R9 29/04/2022 pd pg Document layout update www.insightsip.com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission. Specification subject to change without notice. Document reference isp_lora_DS4520_R9.docx Page 2/30 ISP4520 Data Sheet Contents 1. Block Diagram.......................................................................................................................................................... 4 2. 2.1. 2.2. 2.3. 2.4. 2.5. 2.6. 2.7. 2.8. 2.9. 2.10. Specifications........................................................................................................................................................... 5 Important Notice ............................................................................................................................................ 5 Absolute Maximum Ratings ........................................................................................................................... 5 Operating Conditions ..................................................................................................................................... 5 Current Consumption ..................................................................................................................................... 6 Clock Sources................................................................................................................................................ 6 LoRa Radio Specifications ............................................................................................................................. 6 BLE Radio Specifications............................................................................................................................... 8 Antenna Performance .................................................................................................................................... 8 Electrical Schematic..................................................................................................................................... 11 Internal Module Connections ....................................................................................................................... 13 3. Pin Description ...................................................................................................................................................... 14 4. 4.1. 4.2. 4.3. Mechanical Outlines .............................................................................................................................................. 16 Mechanical Dimensions ............................................................................................................................... 16 SMT Assembly Guidelines ........................................................................................................................... 18 Antenna Keep-Out Zone .............................................................................................................................. 18 5. 5.1. 5.2. 5.3. 5.4. Product Development Tools ................................................................................................................................ 19 Hardware ..................................................................................................................................................... 19 Firmware ...................................................................................................................................................... 19 Development Tools ...................................................................................................................................... 20 LoRa Rx/Tx Switch and TCXO Control ........................................................................................................ 20 6. 6.1. Reference Design .................................................................................................................................................. 21 Sensor Board Design ................................................................................................................................... 21 7. 7.1. 7.2. 7.3. 7.4. Packaging & Ordering information ..................................................................................................................... 24 Marking ........................................................................................................................................................ 24 Prototype Packaging .................................................................................................................................... 24 Tape and Reel ............................................................................................................................................. 25 Ordering Information .................................................................................................................................... 25 8. 8.1. 8.2. 8.3. Storage & Soldering information ......................................................................................................................... 26 Storage and Handling .................................................................................................................................. 26 Moisture Sensitivity ...................................................................................................................................... 26 Soldering information ................................................................................................................................... 27 9. 9.1. 9.2. 9.3. 9.4. 9.5. 9.6. 9.7. Quality & User information ................................................................................................................................... 28 Certifications ................................................................................................................................................ 28 USA – User information ............................................................................................................................... 28 Canada – User information .......................................................................................................................... 28 RF Exposure Information ............................................................................................................................. 29 Informations concernant l'exposition aux fréquences radio (RF) ................................................................. 29 Discontinuity ................................................................................................................................................ 29 Disclaimer .................................................................................................................................................... 30 www.insightsip.com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission. Specification subject to change without notice. Document reference isp_lora_DS4520_R9.docx Page 3/30 ISP4520 Data Sheet 1. Block Diagram This module is based on the Semtech SX126x single-chip LoRa transceiver series and the nRF52832 Nordic Semiconductor 2.4GHz wireless System on Chip (SoC). It integrates a 32-bit ARM Cortex™ M4F CPU, flash memory as well as analog and digital peripherals. ISP4520 can support LoRa connectivity compliant to LoRa Alliance standards. LoRa section can be used as a stand-alone transmitting module connected to a LoRaWAN network for long range communication; or in a private LoRa network. SX1261 chipset is used for EU and AS variants, SX1262 for US variant. ISP4520 also integrates a BLE connectivity compliant to Bluetooth V4.2. It can be used either in Peripheral or Central roles for BLE. Fully qualified BLE stacks for nRF52832 are implemented in the S132 SoftDevice which can be freely downloaded. Despite the small size of 9.8 x 17.2 x 1.7 mm, the module integrates decoupling capacitors, 32 MHz crystals for LoRa and BLE and 32.768 kHz crystal for BLE, DC-DC converters in addition to the wireless SoCs. On the RF side, the ISP4520 also integrates the matching circuits for LoRa and BLE transmitters and receivers, a switch for Rx/Tx LoRa transmissions and a diplexer with common antenna for LoRa and BLE operation. Ultra-low power consumption and advanced power management enables battery lifetimes up to several years on a coin cell battery. www.insightsip.com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission. Specification subject to change without notice. Document reference isp_lora_DS4520_R9.docx Page 4/30 ISP4520 Data Sheet 2. Specifications 2.1. Important Notice The electrical specifications of the module are directly related to the Semtech SX126x series transceiver and the Nordic Semiconductor nRF52832 specifications for chipsets. The information below is only a summary of the main parameters. For more detailed information, please refer to the up-to-date specification of chipsets available on Semtech and Nordic Semi website. The LoRa part of the modules is designed to work according to the LoRaWan specifications. The module functionalities and performances are tested with bandwidths of 125 kHz to 500 kHz. They are not guaranteed with lower bandwidths. 2.2. Absolute Maximum Ratings Parameter Min Supply Voltage VCC Typ Max Unit -0.3 3.9 V IO & Control Pins -0.3 3.9 V Storage Temperature -40 +125 °C Module Total Capacity 16 µF Module Total Inductance 25 µH Moisture Sensitivity Level 5 - 10000 cycles Flash Endurance ATTENTION CONSERVE PRECAUTION FOR HANDLING ELECTROSTATIC SENSITIVE DEVICES Human Body Model Class 3A 2.3. Operating Conditions Parameter Min Typ Max Unit Operating Supply Voltage VCC, EU and AS variant 1.8 3.0 3.6 V Operating Supply Voltage VCC, US variant 1.8 3.3 (1) 3.6 V Operating Input Voltage IO Pins P0.xx / GPIO -0.3 VCC V Operating Temperature Range -30 +85 °C (1) +25 Min 3.3V required to achieve maximum output power of +22 dBm www.insightsip.com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission. Specification subject to change without notice. Document reference isp_lora_DS4520_R9.docx Page 5/30 ISP4520 Data Sheet 2.4. Current Consumption Parameter Min LoRa current, Receiver active (1) Typ Max Unit 4.6 mA 25.5 mA LoRa current, Transmitter active, US variant (3) 118 mA LoRa standby mode, no oscillator active 0.6 mA LoRa sleep mode, with warm start 600 nA LoRa off mode 160 nA LoRa current, Transmitter active, EU and AS variant (2) BLE Peak current, Receiver active (4) 6.1 mA (5) 7.9 mA BLE Peak current, Transmitter active 0 dBm Output Power (5) 5.4 mA CPU System OFF current, no RAM retention 0.3 µA CPU System ON base current, full RAM retention 1.2 µA CPU Additional RAM retention current per 4 KB block 20 BLE Peak current, Transmitter active +4 dBm Output Power (1) (2) (3) DC-DC enabled, Power supply 3.3V, LoRa 125kHz DC-DC enabled, Power supply 3.3V, Output power +14 dBm DC-DC enabled, Power supply 3.3V, Output power +22 dBm (4) (5) N nA DC-DC enabled, Power supply 3V, 1 Mbps DC-DC enabled, Power supply 3V 2.5. Clock Sources Parameter Max Unit Internal High Frequency Clock for LoRa Synchronization: 32 MHz TCXO Tolerance (1) ±5 ppm Internal High Frequency Clock for BLE RF Stability: 32 MHz Crystal Frequency Tolerance (1) ± 40 ppm Internal Low Frequency Clock for BLE Synchronization: 32.768 kHz Crystal Frequency Tolerance (1) ± 40 ppm Internal Low Frequency Clock for BLE Synchronization: RC Oscillator (2) ± 250 ppm (1) (2) Min Typ Including initial tolerance, drift, aging, and frequency pulling Frequency tolerance after calibration 2.6. LoRa Radio Specifications The ISP4520 is designed to be used in the upper ISM Bands in the region 800 – 900 Mhz. There are currently three variations of the ISP4520, aimed at different markets. The key differences between the products are the central frequency band that they are tuned for, and the output power that they are capable of. www.insightsip.com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission. Specification subject to change without notice. Document reference isp_lora_DS4520_R9.docx Page 6/30 ISP4520 Data Sheet EU variant It can be used in European Union countries, India, Russia and most of the Middle East and Africa. Parameter - EU variant Min LoRa Frequency Band (EU) Typ 863 LoRa Rx sensitivity Level for BER