BL-HRGB32K-3-TRB

BRIGHT LED ELECTRONICS CORP. BB-HRGB32K-TRB ● Features: 1. Emitted Color: Red, Green, Blue, 2. Lens Appearance: Water Clear. 3. 5.0x5.4x1.6mm standard package. ●Package Dimensions: 1 VDD 4 DI N 2 DOUT 3 VSS 5. Compatible with infrared and vapor phase 5. 00 4. Suitable for all SMT assembly methods. reflow solder process. 5. 00 6. Compatible with automatic placement 7. This product doesn’t contain restriction 5. 40 1. 30 equipment. 3. 40 Substance, comply ROHS standard. 3. 00 PWM output can be maintained static screen. 4. 50 1. 30 10. Built-in support for continuous oscillation 4. 30 9. High contrast. 2. 10 8. 256 level Color set. 1. 6 11. Its function will be automatically reset 2. 0 when power on and power off. 13. Transmission distance is beyond 10M. 14. Frequency of data signal : 800KHz 1. 00 3. 4 1. 10 12. Single lane data transfer. NOTES: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.10mm (0.004”) unless otherwise specified. 3. Specifications are subject to change without notice. ● Applications: 1. Large LED Display. 2. Soft Light Bar. 3. Full Color Display. ● Absolute Maximum Ratings(Ta=25℃) Parameter Symbol Range Unit VDD 4.5~5.5 V Vi -0.4~VDD+0.4 V Operating Temperature Topt -40℃~85℃ - Storage Temperature Tstg -40℃~105℃ - Soldering Temperature Tsol See Page 7 - Supply voltage Input Voltage Ver1.0 Page: 1 of 9 BRIGHT LED ELECTRONICS CORP. BB-HRGB32K-TRB ● Electrical characteristics(Ta=25℃) Parameter Symbol Condition Min. Typ. Max. VDD - 4.5 5.0 5.5 V VIH DIN High Level 0.7*VDD - - V VIL DIN Low Level - - 0.3*VDD V Static current IDD VDD = 4. 5V， Iout ”OFF” - 0.5 - mA R/G/B Constant Current Iout - 11 12 13 mA Frequency of data signal FDIN - - 800 - KHz Signal Transfer Delay Time tPLH DIN to DOUT - 80 - ns tPHL - - 80 - ns tTLH - - 10 - ns tTHL - - 12 - ns Symbol Condition Min Typ Max. Unit IV(R) Iout=12mA 317 540 715 mcd IV(G) Iout=12mA 583 960 1305 mcd IV(B) Iout=12mA 140 240 317 mcd WLD(R) Iout=12mA 620 625 630 nm WLD(G) Iout=12mA 520 525 530 nm WLD(B) Iout=12mA 460 465 470 nm 2θ1/2 Iout=12mA - 120 - deg Supply Voltage Unit Input Voltage Level Dout Conversion time ● Optical characteristics(Ta=25℃) Parameter Luminous Intensity Dominant Wavelength View Angle Ver1.0 Page: 2 of 9 BRIGHT LED ELECTRONICS CORP. BB-HRGB32K-TRB ● Sequence Chart Cascade method D1 D2 D4 D3 DIN DO DIN DO DIN DO PIX1 PIX2 PIX3 Input Code symbol parameter Min Typ Max unit T Element cycle 1200 - - ns T0H 0 Code, high level time 200 300 400 ns T0L 0 Code, low level time 800 900 - ns T1H 1 Code, high level time 650 900 1000 ns T1L 1 Code, low level time 200 300 - ns Trst Reset Code,low level time 200 - - us Note: When writing a program, the minimum code cycle requirement is 1200ns Ver1.0 Page: 3 of 9 BRIGHT LED ELECTRONICS CORP. BB-HRGB32K-TRB ● The circuit diagram ● IC’s function diagram ● Data transmission mode Note: D1 is the data sent by the MCU terminal, and D2, D3 and D4 are the data automatically reshaped and forwarded by the cascade circuit R7 R6 R5 R4 R3 R2 R1 R0 G7 G6 G5 G4 G3 G2 G1 G0 B7 B6 B5 B4 B3 B2 B1 B0 Note: Follow the order of RGB to send data and the high bit sent at first. Ver1.0 Page: 4 of 9 BRIGHT LED ELECTRONICS CORP. BB-HRGB32K-TRB ● Tapping and packaging specifications(Units: mm) ● Package Method: (unit : mm) 10bag/box 1000 pcs/reel 200 Bar Code Label 245 220 220 A luminum Foil Bag 185 645 6 box/carton 210 470 Ver1.0 Page: 5 of 9 BRIGHT LED ELECTRONICS CORP. BB-HRGB32K-TRB ● Reliability Test Classification Test Item Reference Standard Operation Life MIL-STD-750:1026 MIL-STD-883:1005 JIS-C-7021 :B-1 High Temperature MIL-STD-202:103B High Humidity JIS-C-7021 :B-11 Endurance Storage Test High MIL-STD-883:1008 Temperature JIS-C-7021 :B-10 Storage Low Temperature JIS-C-7021 :B-12 Storage Temperature MIL-STD-202:107D Cycling MIL-STD-750:1051 MIL-STD-883:1010 JIS-C-7021 :A-4 Thermal Shock MIL-STD-202:107D Environmental MIL-STD-750:1051 Test MIL-STD-883:1011 Solder MIL-STD-202:201A Resistance MIL-STD-750:2031 JIS-C-7021 :A-1 Test Conditions VDD=5V , Iout =12mA Ta=Under room temperature Test time=1,000hrs Ta=+65℃±5℃ RH=90%-95% Test time=240hrs Result 0/20 0/20 High Ta=+85℃±5℃ Test time=1,000hrs 0/20 Low Ta=-35℃±5℃ Test time=1,000hrs 0/20 -35℃ ~ +25℃ ~ +85℃ ~ +25℃ 60min 20min 60min 20min Test Time=5cycle -35℃±5℃ ~+85℃±5℃ 20min 20min Test Time=10cycle Preheating： 140℃-160℃,within 2 minutes. Operation heating： 260℃(Max.), within 10seconds. (Max.) 0/20 0/20 0/20 ● Judgment criteria of failure for the reliability Measuring items Symbol Luminous intensity Iv ( mcd) Note: Measuring conditions Judgment criteria for failure VDD=5V Iout =12mA Below S1X0.5 1. U means the upper limit of specified characteristics. S means initial value. 2. After each test, remove test pieces, wait for 2 hours and test pieces have returned to ambient temperature, then take next measurement. Ver1.0 Page: 6 of 9 BRIGHT LED ELECTRONICS CORP. BB-HRGB32K-TRB ●IR-Reflow RAMP-UP 3°c/s max Max260°C MAX10S 255°C 245°C TEMPERATURE(°c) 240°C 217°C 200°C 30 sec Max 150°C RAMP-UP 3°c/s max RAMP-DOWN 6°c/s max 60-120S 60-120S TIME(sec) 1、Avoid any external stress applied to the resin while the LEDs are at high temperature, especially during soldering. 2、Avoid rapid cooling or any excess vibration during temperature ramp-down process 3、Although the soldering condition is recommended above, soldering at the lowest possible temperature is feasible for the LEDs ●IRON Soldering 350℃ Within 3 sec, one time only. Ver1.0 Page: 7 of 9 BRIGHT LED ELECTRONICS CORP. BB-HRGB32K-TRB ● Handling Precautions Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic significantly reduces thermal stress, it is more susceptible to damage by external mechanical force. As a result, special handling precautions need to be observed during assembly using silicone encapsulated LED products. Failure to comply might lead to damage and premature failure of the LED. 1. Handle the component along the side surfaces by using forceps or appropriate tools.(pic.1) 2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry. (pic.2,pic.3) 3. Do not stack together assembled PCBs, containing exposed LEDs. Impact may scratch the silicone lens or damage the internal circuitry. (pic.4) 4. The outer diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks. The inner diameter of the nozzle should be as large as possible. (pic.5) 5. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup. (pic.5) 6. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup and avoid damage during production. (pic.5) Pic.1 Pic.2 Pic.3 Pic.4 Pic.5 Ver1.0 Page: 8 of 9 BRIGHT LED ELECTRONICS CORP. BB-HRGB32K-TRB ● Notes for designing: Care must be taken to provide the current limiting resistor in the circuit so as to drive the LEDs within the rated figures. Also, caution should be taken not to overload LEDs with instantaneous voltage at the turning ON and OFF of the circuit. When using the pulse drive care must be taken to keep the average current within the rated figures. Also, the circuit should be designed so as be subjected to reverse voltage when turning off the LEDs. ● Storage: In order to avoid the absorption of moisture, it is recommended to solder LEDs as soon as possible after unpacking the sealed envelope. If the envelope is still packed, to store it in the environment as following: (1) Temperature : 5℃-30℃(41℉)Humidity : RH 60﹪Max. (2) After this bag is opened, devices that will be applied to infrared reflow, vapor-phase reflow, or equivalent soldering process must be: a. Completed within 24hours. Stored at less than 20% RH. (3) Devices require baking before mounting, if: 2a or 2b is not met. (4) If baking is required, devices must be baked under below conditions: 48 hours at 60℃±5℃. ● Package and Label of Products: (1) Package: Products are packed in one bag of 2000 pcs (one taping reel) and a label is attached to each bag. (2) Label: BRIGHT LED LOGO Part No. Quantity BIN. Sealing Date XXXXX x xx xx xx Year Month Day Manufacture Location Ver1.0 Page: 9 of 9