ES3AF

ES3AF

  • 厂商:

    SK(時科)

  • 封装:

    SMAF(DO-214AD)

  • 描述:

    特性:适用于表面贴装应用。 低外形封装。 玻璃钝化芯片结。 超快反向恢复时间。 符合欧盟 RoHS 2011/65/EU 指令的无铅产品

  • 数据手册
  • 价格&库存
ES3AF 数据手册
Surface Mount Superfast Recovery Rectifier Reverse Voltage – 50 to 600 V Forward Current – 3 A FEATURES • For surface mounted applications • Low profile package • Glass Passivated Chip Juntion • Superfast reverse recovery time • Lead free in comply with EU RoHS 2011/65/EU directives MECHANICAL DATA • Case: SMAF • Terminals: Solderable per MIL-STD-750, 750, Method 2026 • pprox. Weight: 27mg 0.00086oz Absolute Maximum Ratings and Characteristics Characte Ratings at 25℃ ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load.For capacitive load, derate current by 20%. 1 of 3 2 of 3 PACKAGE OUTLINE Plastic surface mounted package; 2 leads SMAF 3 of 3
ES3AF 价格&库存

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