TB67S109AFTG/FNG
TOSHIBA BiCD Integrated Circuit Silicon Monolithic
TB67S109AFTG, TB67S109AFNG
CLOCK-in controlled Bipolar Stepping Motor Driver
The TB67S109A is a two-phase bipolar stepping motor driver
using a PWM chopper. The clock in decoder is built in.
Fabricated with the BiCD process, rating is 50 V/4.0 A .
FTG
Features
• BiCD process integrated monolithic IC.
• Capable of controlling 1 bipolar stepping motor.
P-WQFN48-0707-0.50-003
• PWM controlled constant-current drive.
Weight 0.10g (typ.)
• Allows full, half, quarter, 1/8, 1/16, 1/32 step operation.
• Low on-resistance (High + Low side=0.49Ω(typ.)) MOSFET
output stage.
FNG
• High efficiency motor current control mechanism (Advanced
Dynamic Mixed Decay)
• High voltage and current (For specification, please refer to absolute
maximum ratings and operation ranges)
• Error detection (TSD/ISD) signal output function
HTSSOP48-P-300-0.50
• Built-in error detection circuits (Thermal shutdown (TSD), over-current
shutdown (ISD), and power-on reset (POR))
Weight 0.21g (typ.)
• Built-in VCC regulator for internal circuit use.
• Chopping frequency of a motor can be customized by external resistance and capacitor.
• Multi package lineup
TB67S109AFTG: P-WQFN48-0707-0.50-003
TB67S109AFNG: HTSSOP48-P-300-0.50
Note) Please be careful about thermal conditions during use.
© 2014-2020
Toshiba Electronic Devices & Storage Corporation
1
2020-2-4
TB67S109AFTG/FNG
Pin assignment (TB67S109A)
NC
OUTB+
OUTB+
NC
RSB
RSB
NC
VM
NC
VCC
NC
NC
(Top View)
36 35 34 33 32 31 30 29 28 27 26 25
NC
37
24 NC
LO
38
23 NC
DMODE0
39
22 GND
GND
40
21 OUTB-
VREFB
41
20 OUTBFTG
19 GND
45
16 OUTA-
DMODE1
46
15 GND
DMODE2
47
14 NC
NC
48
13 NC
4
5
6
7
8
9 10 11 12
NC
3
OUTA+
2
OUTA+
1
NC
MO
RSA
17 OUTA-
RSA
44
NC
CW/CCW
GND
18 GND
RESET
43
ENABLE
OSCM
CLK
42
NC
VREFA
Please solder the four corner pins of the QFN package and the exposed pad to the GND area of the PCB.
(Top View)
OSCM
NC
CW/CCW
MO
DMODE1
NC
DMODE2
CLK
ENABLE
RESET
GND
NC
RSA
RSA
NC
OUTA+
OUTA+
NC
NC
GND
NC
OUTAOUTAGND
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
FNG
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
VREFA
VREFB
GND
DMODE0
LO
NC
NC
VCC
NC
VM
NC
NC
RSB
RSB
NC
OUTB+
OUTB+
NC
NC
GND
NC
OUTBOUTBGND
Please solder the exposed pad of the HTSSOP package to the GND area of the PCB.
2
2020-2-4
TB67S109AFTG/FNG
TB67S109A Block diagram
DMODE0
Standby
Control
+
Step
Resolution
Selector
DMODE1
DMODE2
OSC-Clock
Converter
Motor
Oscillator
System
Oscillator
VCC
Regulator
OSCM
VCC
VM
Power-on
Reset
Signal
Decode
Logic
CW/CCW
CLK
Current
Level
Set
RESET
ENABLE
Current
Reference
Setting
MO
VREFA
VREFB
LO
Angle monitor
Current
Comp
Error Output
Motor Control Logic
Predriver
TSD
Current
Comp
Predriver
RSA
RSB
ISD
H-bridge
H-bridge
GND
OUTA+
OUTA-
OUTB+
OUTB-
Functional blocks/circuits/constants in the block chart etc. may be omitted or simplified for explanatory purposes.
3
2020-2-4
TB67S109AFTG/FNG
Application Notes
When using TB67S109A, the GND pattern of PCB should be a solid pattern and be externally terminated at only
one point. Also, a grounding method should be considered for efficient heat dissipation.
Careful attention should be paid to the layout of the output, VDD(VM) and GND traces, to avoid short circuits
across output pins or to the power supply or ground. If such a short circuit occurs, the device may be permanently
damaged.
Also, the utmost care should be taken for pattern designing and implementation of the device since it has power
supply pins (VM, RS, OUT, GND) through which a particularly large current may run. If these pins are wired
incorrectly, an operation error may occur or the device may be destroyed.
The logic input pins must also be wired correctly. Otherwise, the device may be damaged owing to a current running
through the IC that is larger than the specified current.
4
2020-2-4
TB67S109AFTG/FNG
Pin explanations
TB67S109AFTG (QFN48)
Pin No.1 to 28
Pin No.
Pin Name
Function
1
NC
Non-connection pin
2
CLK
CLK signal input pin
3
ENABLE
4
RESET
5
GND
6
NC
7
RSA (*)
Motor Ach current sense pin
8
RSA (*)
Motor Ach current sense pin
9
NC
10
OUTA+ (*)
Motor Ach (+) output pin
11
OUTA+ (*)
Motor Ach (+) output pin
12
NC
Non-connection pin
13
NC
Non-connection pin
14
NC
Non-connection pin
15
GND
16
OUTA- (*)
Motor Ach (-) output pin
17
OUTA- (*)
Motor Ach (-) output pin
18
GND
Ground pin
19
GND
Ground pin
20
OUTB- (*)
Motor Bch (-) output pin
21
OUTB- (*)
Motor Bch (-) output pin
22
GND
23
NC
Non-connection pin
24
NC
Non-connection pin
25
NC
Non-connection pin
26
OUTB+ (*)
Motor Bch (+) output pin
27
OUTB+ (*)
Motor Bch (+) output pin
28
NC
Ach/Bch output stage ON/OFF control pin
Electric angle reset pin
Ground pin
Non-connection pin
Non-connection pin
Ground pin
Ground pin
Non-connection pin
5
2020-2-4
TB67S109AFTG/FNG
Pin No.29 to 48
Pin No.
Pin Name
Function
29
RSB (*)
Motor Bch current sense pin
30
RSB (*)
Motor Bch current sense pin
31
NC
Non-connection pin
32
VM
Motor power supply pin
33
NC
Non-connection pin
34
VCC
35
NC
Non-connection pin
36
NC
Non-connection pin
37
NC
Non-connection pin
38
LO
Error detect signal output pin
39
DMODE0
40
GND
41
VREFB
Motor Bch output set pin
42
VREFA
Motor Ach output set pin
43
OSCM
Oscillating circuit frequency for chopping set pin
44
CW/CCW
45
MO
Electric angle monitor pin
46
DMODE1
Step resolution set pin no.1
47
DMODE2
Step resolution set pin no.2
48
NC
Internal VCC regulator monitor pin
Step resolution set pin no.0
Ground pin
Motor rotation direction set pin
Non-connection pin
• Please do not connect anything to the NC pins.
*: Please connect the pins with the same pin name, while using the TB67S109A.
6
2020-2-4
TB67S109AFTG/FNG
Pin explanations
TB67S109AFNG (HTSSOP48)
Pin No.1 to 28
Pin No.
Pin Name
Function
1
OSCM
2
NC
3
CW/CCW
4
MO
Electric angle monitor pin
5
DMODE1
Step resolution set pin no.1
6
NC
7
DMODE2
8
CLK
9
ENABLE
10
RESET
11
GND
12
NC
13
RSA (*)
Motor Ach current sense pin
14
RSA (*)
Motor Ach current sense pin
15
NC
16
OUTA+ (*)
Motor Ach (+) output pin
17
OUTA+ (*)
Motor Ach (+) output pin
18
NC
Non-connection pin
19
NC
Non-connection pin
20
GND
21
NC
22
OUTA- (*)
Motor Ach (-) output pin
23
OUTA- (*)
Motor Ach (-) output pin
24
GND
Ground pin
25
GND
Ground pin
26
OUTB- (*)
Motor Bch (-) output pin
27
OUTB- (*)
Motor Bch (-) output pin
28
NC
Oscillating circuit frequency for chopping set pin
Non-connection pin
Motor rotation direction set pin
Non-connection pin
Step resolution set pin no.2
CLK signal input pin
Ach/Bch output stage ON/OFF control pin
Electric angle reset pin
Ground pin
Non-connection pin
Non-connection pin
Ground pin
Non-connection pin
Non-connection pin
7
2020-2-4
TB67S109AFTG/FNG
Pin No.29 to 48
Pin No.
Pin Name
Function
29
GND
30
NC
Non-connection pin
31
NC
Non-connection pin
32
OUTB+ (*)
Motor Bch (+) output pin
33
OUTB+ (*)
Motor Bch (+) output pin
34
NC
35
RSB (*)
Motor Bch current sense pin
36
RSB (*)
Motor Bch current sense pin
37
NC
Non-connection pin
38
NC
Non-connection pin
39
VM
Motor power supply pin
40
NC
Non-connection pin
41
VCC
42
NC
Non-connection pin
43
NC
Non-connection pin
44
LO
Error detect signal output pin
45
DMODE0
46
GND
47
VREFB
Motor Bch output set pin
48
VREFA
Motor Ach output set pin
Ground pin
Non-connection pin
Internal VCC regulator monitor pin
Step resolution set pin no.0
Ground pin
• Please do not connect anything to the NC pins.
*: Please connect the pins with the same pin name, while using the TB67S109A.
8
2020-2-4
TB67S109AFTG/FNG
INPUT/OUTPUT equivalent circuit (TB67S109A)
DMODE0
DMODE1
DMODE2
CLK
ENABLE
RESET
CW/CCW
LO
MO
IN/OUT signal
Equivalent circuit
1kΩ
Logic
Input
Pin
Digital Input (VIH/VIL)
100kΩ
Pin name
VIH: 2.0V(min) to 5.5V(max)
VIL: 0V(min) to 0.8V(max)
GND
Logic
Output
Pin
Digital Output (VOH/VOL)
(Pullup resistance:10k to 100kΩ)
GND
VCC
VCC
VREFA
VREFB
VCC voltage range
4.75V(min) to 5.0V(typ.) to 5.25V(max)
1kΩ
VREF
VREF voltage range
0V to 3.6V
GND
1kΩ
OSCM
OSCM frequency setting range
0.64MHz(min) to 1.12MHz(typ.) to 2.4MHz(max)
500Ω
OSCM
GND
RS
OUT A+
OUT AOUT B+
OUT BRSA
RSB
VM power supply voltage range
10V(min) to 47V(max)
OUT+
OUTPUT pin voltage
10V(min) to 47V(max)
OUT-
GND
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes.
9
2020-2-4
TB67S109AFTG/FNG
Function explanation (Stepping motor)
CLK Function
Each up-edge of the CLK signal will shift the motor’s electrical angle per step.
CLK Input
Function
Up-edge
Shifts the electrical angle per step.
Down-edge
(State of the electrical angle does not change.)
ENABLE function
The ENABLE pin controls the ON and OFF of the corresponding output stage. This pin serves to select if the motor is
stopped in OFF mode (High impedance) or activated. Please set the ENABLE pin to ‘L’ during VM power-on and
power-off sequence.
ENABLE Input
Function
H
Output stage=‘ON’ (Normal operation mode)
L
Output stage=’OFF (High impedance mode)
CW/CCW function and the output pin function (Output logic at the time of a charge start)
The CW/CCW pin controls the rotation direction of the motor. When set to ‘Clockwise’, the current of OUTA is output
first, with a phase difference of 90°. When set to ‘Counterclockwise”, the current of OUTB is output first with a phase
difference of 90°.
CW/CCW Input
OUT (+)
OUT (-)
H: Clockwise operation(CW)
H
L
L: Counterclockwise operation(CCW)
L
H
Step resolution select function
DMODE0
DMODE1
DMODE2
Function
L
L
L
Standby mode (the OSCM is disabled and the output stage is
set to ‘OFF’ status)
L
L
H
Full step resolution
L
H
L
Half step resolution(Type A)
L
H
H
Quarter step resolution
H
L
L
Half step resolution(Type B)
H
L
H
1/8 step resolution
H
H
L
1/16 step resolution
H
H
H
1/32 step resolution
When switching the DMODE0,1,2; setting the RESET signal to Low (will set the electrical angle to the initial status),
is recommended.
10
2020-2-4
TB67S109AFTG/FNG
Step resolution setting and initial angle
[Full step resolution]
CLK
MO
H
L
H
L
+100%
Iout(A)
0%
-100%
+100%
Iout(B)
0%
-100%
CCW
CW
[Half step resolution (Type A)]
CLK
MO
H
L
H
L
+100%
Iout(A)
0%
-100%
+100%
Iout(B)
0%
-100%
CCW
CW
MO output shown in the timing chart is when the MO pin is pulled up.
Timing charts may be simplified for explanatory purpose.
11
2020-2-4
TB67S109AFTG/FNG
[Half step resolution (Type B)]
CLK
MO
H
L
H
L
+100%
+71%
Iout(A)
0%
-71%
-100%
+100%
+71%
Iout(B)
0%
-71%
-100%
CCW
CW
[Quarter step resolution]
CLK
MO
H
L
H
L
+100%
+71%
+38%
0%
Iout(A) -38%
-71%
-100%
+100%
+71%
+38%
Iout(B) 0%
-38%
-71%
-100%
CCW
CW
MO output shown in the timing chart is when the MO pin is pulled up.
Timing charts may be simplified for explanatory purpose.
12
2020-2-4
TB67S109AFTG/FNG
[1/8 step resolution]
CLK
MO
H
L
H
L
+100%
+98%
+96%
+83%
+71%
+56%
+38%
+20%
Iout(A)
0%
-20%
-38%
-56%
-71%
-83%
-96%
-98%
-100%
+100%
+98%
+96%
+83%
+71%
+56%
+38%
+20%
Iout(B)
0%
-20%
-38%
-56%
-71%
-83%
-96%
-98%
-100%
CCW
CW
MO output shown in the timing chart is when the MO pin is pulled up.
Timing charts may be simplified for explanatory purpose.
13
2020-2-4
TB67S109AFTG/FNG
[1/16 step resolution]
CLK
MO
H
L
H
L
+100%
+98%
+96%
+83%
+71%
+56%
+38%
+20%
Iout(A)
0%
-20%
-38%
-56%
-71%
-83%
-96%
-98%
-100%
+100%
+98%
+96%
+83%
+71%
+56%
+38%
+20%
Iout(B)
0%
-20%
-38%
-56%
-71%
-83%
-96%
-98%
-100%
CCW
CW
MO output shown in the timing chart is when the MO pin is pulled up.
Timing charts may be simplified for explanatory purpose.
14
2020-2-4
TB67S109AFTG/FNG
[1/32 step resolution]
H
L
H
L
CLK
MO
+100%
Iout(A)
0%
-100%
+100%
Iout(B)
0%
-100%
CCW
CW
MO output shown in the timing chart is when the MO pin is pulled up.
Timing charts may be simplified for explanatory purpose.
15
2020-2-4
TB67S109AFTG/FNG
Step setting and current percentage
Current [%]
100%
99%
98%
97%
96%
94%
92%
90%
88%
86%
83%
80%
77%
74%
71%
67%
63%
60%
56%
52%
47%
43%
38%
34%
29%
25%
20%
15%
10%
5%
0%
Full
Available
Half (A)
Available
Half (B)
Available
Quarter
Available
1/8
Available
Available
Available
1/16
Available
Available
Available
Available
Available
Available
Available
Available
Available
Available
Available
Available
Available
Available
Available
Available
Available
Available
Available
Available
Available
Available
Available
Available
Available
Available
Available
Available
Available
1/32
Available
Available
Available
Available
Available
Available
Available
Available
Available
Available
Available
Available
Available
Available
Available
Available
Available
Available
Available
Available
Available
Available
Available
Available
Available
Available
Available
Available
Available
Available
Available
RESET function
RESET Input
Function
H
Sets the electrical angle to the initial condition.
L
Normal operation mode
The current for each channel (while RESET is applied) is shown in the table below. MO will show ‘L’ at this time.
Step resolution setting
Ach current setting
Bch current setting
Default electrical angle
Full step
100%
100%
45°
Half step (Type A)
100%
100%
45°
Half step (Type B)
71%
71%
45°
Quarter step
71%
71%
45°
1/8 step
71%
71%
45°
1/16 step
71%
71%
45°
1/32 step
71%
71%
45°
16
2020-2-4
TB67S109AFTG/FNG
LO(Error detect signal) output function
When Thermal shutdown(TSD) or Over-current shutdown(ISD) is applied, the LO voltage will be switched to Low(GND) level.
VCC
10kΩ
The LO is an open-drain output pin. LO pin needs to be pulled up to 3.3-V/5.0-V level for proper function. During regular operation, the
LO pin level will stay High(VCC level). When error detection (TSD, ISD) is applied, the LO pin will show Low (GND) level.
17
2020-2-4
TB67S109AFTG/FNG
Decay function
ADMD(Advanced Dynamic Mixed Decay) constant current control
The Advanced Dynamic Mixed Decay threshold, which determines the current ripple level during current feedback control, is
a unique value.
fchop
Internal
OSC
Setting
current value
NF detect
Detect
Advanced Dynamic Mixed
Decay threshold
ADMDth
Iout
Charge Mode -> NF detect -> Fast Decay -> ADMDth detect ->
Slow Decay -> fchop 1 cycle -> Charge mode
fchop 1 cycle: 16clk
Auto Decay Mode current waveform
fchop
fchop
Internal
OSC
Setting
current value
NF detect
NF detect
Iout
Fast Decay
Slow Decay
ADMDth (Advanced Dynamic Mixed Decay threshold)
Timing charts may be simplified for explanatory purpose.
18
2020-2-4
TB67S109AFTG/FNG
ADMD current waveform
When the next current step is higher:
fchop
fchop
fchop
fchop
Internal
OSC
Setting
current value
NF
NF
Fast
Fast
Charge
Setting
current value
NF
Slow
NF
Fast
Fast
Charge
Charge
Charge
Slow
Slow
Slow
When Charge period is more than 1 fchop cycle:
fchop
fchop
fchop
fchop
Internal
OSC
Setting
current value
NF
Fast
Slow
Charge
Setting
current value
NF
NF
Fast
Fast
Charge
Charge
Slow
Slow
When the Charge period is longer than fchop cycle, the Charge period will be extended until the motor current reaches the
NF threshold. Once the current reaches the next current step, then the sequence will go on to decay
mode.
19
2020-2-4
TB67S109AFTG/FNG
When the next current step is lower:
fchop
Internal
OSC
Setting
current value
fchop
NF
The operation mode will be switched to ‘Charge’ to
monitor the motor current with the RS comparator;
then will be switched to ‘Fast’ because the motor
current is above the threshold.
NF
Fast
Fast
NF
Charge
Charge
fchop
fchop
Slow Charge
Slow
Fast
Setting
current value
Fast
Charge
Slow
Slow
When the Fast continues past 1 fchop cycle (the motor current not reaching the ADMD threshold
during 1 fchop cycle)
fchop
fchop
fchop
fchop
Internal
OSC
Setting
current value
NF
Fast
The operation mode will be switched to ‘Charge’ to
monitor the motor current with the RS comparator;
then will be switched to ‘Fast’ because the motor
current is above the threshold.
NF
Charge
Slow
Charge
If the motor current is still above the ADMD threshold
after reaching 1 fchop cycle, the output stage function
will stay ‘Fast’ until the current reaches the ADMDth.
Fast
Setting
current value
Fast
Charge
ADMDth
Slow
20
Slow
2020-2-4
TB67S109AFTG/FNG
Output transistor function mode
VM
VM
RRS
VM
RRS
RS pin
RRS
RS pin
U1
RS pin
U2
U1
U2
U1
U2
OFF
OFF
ON
OFF
OFF
L1
L2
L1
L2
L1
OFF
ON
ON
OFF
ON
ON
Load
Load
PGND
Load
PGND
Charge mode
A current flows into the motor coil.
L2
ON
PGND
Fast mode
The energy of the motor coil
is fed back to the power
Slow mode
A current circulates around the
motor coil and this device.
Output transistor function
MODE
U1
U2
L1
L2
CHARGE
ON
OFF
OFF
ON
SLOW
OFF
OFF
ON
ON
FAST
OFF
ON
ON
OFF
Note: This table shows an example of when the current flows as indicated by the arrows in the figures shown above.
If the current flows in the opposite direction, refer to the following table.
MODE
U1
U2
L1
L2
CHARGE
OFF
ON
ON
OFF
SLOW
OFF
OFF
ON
ON
FAST
ON
OFF
OFF
ON
This IC controls the motor current to be constant by 3 modes listed above.
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes.
21
2020-2-4
TB67S109AFTG/FNG
Calculation of the Predefined Output Current
For PWM constant-current control, this IC uses a clock generated by the OSCM oscillator.
The peak output current (Setting current value) can be set via the current-sensing resistor (RS) and the reference
voltage (Vref), as follows:
Vref(V)
Iout(max) = Vref(gain) ×
RRS(Ω)
Vref(gain): the Vref decay rate is 1/ 5.0 (typ.)
For example: In the case of a 100% setup
when Vref = 3.0 V, Torque=100%,RS=0.51Ω, the motor constant current (Setting current value) will be
calculated as:
Iout = 3.0V / 5.0 / 0.51Ω= 1.18 A
Calculation of the OSCM oscillation frequency (chopper reference frequency)
An approximation of the OSCM oscillation frequency (fOSCM) and chopper frequency (fchop)
can be calculated by the following expressions.
fOSCM=1/[0.56x{Cx(R1+500)}]
....... C,R1: External components for OSCM (C=270pF , R1=5.1kΩ => About fOSCM= 1.18MHz(Typ.))
fchop = fOSCM / 16
....... fOSCM=1.18MHz => fchop =About 74kHz
If chopping frequency is raised, Ripple of current will become small and wave-like reproducibility will improve. However, the
gate loss inside IC goes up and generation of heat becomes large.
By lowering chopping frequency, reduction in generation of heat is expectable. However, Ripple of current may become large.
It is a standard about 70 kHz. A setup in the range of 50 to 100 kHz is recommended.
22
2020-2-4
TB67S109AFTG/FNG
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Rating
Unit
Motor power supply
VM
50
V
―
Motor output voltage
Vout
50
V
―
Motor output current
Iout
4.0
A
(Note 1)
Internal Logic power supply
VCC
6.0
V
When externally applied.
VIN(H)
6.0
V
―
Logic input voltage
Remarks
VIN(L)
-0.4
V
―
MO output voltage
VMO
6.0
V
―
LO output voltage
VLO
IMO
ILO
6.0
30
30
V
mA
mA
―
―
―
WQFN48
PD
1.3
W
(Note 2)
HTSSOP48
PD
1.3
W
(Note 2)
Operating temperature
TOPR
-20 to 85
°C
―
Storage temperature
TSTR
-55 to 150
°C
―
Junction temperature
Tj(max)
150
°C
―
MO Inflow current
LO Inflow current
Power dissipation
Note 1: Usually, the maximum current value at the time should use 70% or less of the absolute maximum ratings for a
standard on thermal rating. The maximum output current may be further limited in view of thermal
considerations, depending on ambient temperature and board conditions.
Note 2: Device alone (Ta =25°C)
Ta: Ambient temperature
Topr: Ambient temperature while the IC is active
Tj: Junction temperature while the IC is active. Tj(max) is limited by the thermal
shutdown (TSD) circuitry. It is advisable to keep the maximum current below a certain level so that the
maximum junction temperature, Tj (max), will not exceed 120°C.
Caution) Absolute maximum ratings
The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a
moment. Do not exceed any of these ratings.
Exceeding the rating (s) may cause device breakdown, damage or deterioration, and may result in injury by
explosion or combustion.
The value of even one parameter of the absolute maximum ratings should not be exceeded under any
circumstances. The TB67S109A does not have overvoltage detection circuit. Therefore, the device is damaged if a
voltage exceeding its rated maximum is applied.
All voltage ratings, including supply voltages, must always be followed. The other notes and considerations
described later should also be referred to.
Operation Ranges (Ta=-20 to 85°C)
Characteristics
Symbol
Min
Typ.
Max
Unit
Motor power supply
VM
10
24
47
V
―
Motor output current
Iout
―
1.5
3.0
A
(Note 1)
VIN(H)
VIN(L)
2.0
0
―
―
5.5
0.8
V
V
Logic input High Level
Logic input Low Level
VMO
VLO
―
―
3.3
3.3
5.0
5.0
V
V
fCLK
―
―
100
kHz
―
―
―
fchop(range)
40
70
150
kHz
―
Vref
GND
2.0
3.6
V
―
Logic input voltage
MO output pin voltage
LO output pin voltage
Clock input frequency
Chopper frequency
Vref input voltage
Remarks
Note 1: Maximum current for actual usage may be limited by the operating circumstances such as operating conditions
(exciting mode, operating time, and so on), ambient temperature, and heat conditions (board condition and so on).
23
2020-2-4
TB67S109AFTG/FNG
Electrical Specifications 1 (Ta = 25°C, VM = 24 V, unless otherwise specified)
Characteristics
Symbol
Test condition
Min
Typ.
Max
Unit
HIGH
VIN(H)
Logic input
2.0
―
5.5
V
LOW
VIN(L)
Logic input
0
―
0.8
V
VIN(HYS)
Logic input (Note 1)
100
―
300
mV
HIGH
IIN(H)
VIN(H)=3.3V
―
33
―
µA
LOW
IIN(L)
VIN(L)=0V
―
―
1
µA
MO output pin voltage
LOW
VOL(MO)
IOL=24mA output=Low
―
0.2
0.5
V
LO output pin voltage
LOW
VOL(LO)
IOL=24mA output=Low
―
0.2
0.5
V
Output pins=open
Standby mode
Output pins=open
Standby release ENABLE=Low
Output pins=open
Full step resolution
―
2
3.5
mA
―
3.5
5.5
mA
―
5.5
7
mA
Logic input voltage
Logic input hysteresis voltage
Logic input current
IM1
Current consumption
IM2
IM3
High-side
IOH
VRS=VM=50V,Vout=0V
―
―
1
µA
Low-side
IOL
VRS=VM=Vout=50V
-1
―
―
µA
-5
0
5
%
Iout=1.5A
-5
0
5
%
Output leakage current
Motor current channel differential
ΔIout1
Motor current setting accuracy
ΔIout2
RS pin current
IRS
VRS=VM=24V
0
―
10
µA
Ron(H+L)
Tj=25°C, Forward direction
(High-side+Low-side)
―
0.49
0.6
Ω
Motor output ON-resistance
(High-side+Low-side)
Current differential between Ch
Note 1: VIN (H) is defined as the VIN voltage that causes the outputs (OUTA,OUTB) to change when a pin under test
is gradually raised from 0 V. V IN (L) is defined as the V IN voltage that causes the outputs (OUTA, OUTB) to change
when the pin is then gradually lowered. The difference between V IN (H) and V IN (L) is defined as the V IN (HYS).
Note: When the logic signal is applied to the device whilst the VM power supply is not asserted; the device is designed
not to function, but for safe usage, please apply the logic signal after the VM power supply is asserted and the VM
voltage reaches the proper operating range.
24
2020-2-4
TB67S109AFTG/FNG
Electrical Specifications 2 (Ta =25°C, VM = 24 V, unless otherwise specified)
Characteristics
Symbol
Test condition
Min
Typ.
Max
Unit
Vref input current
Iref
Vref=2.0V
―
0
1
μA
VCC voltage
VCC
ICC=5.0mA
4.75
5.0
5.25
V
VCC current
ICC
VCC=5.0V
―
2.5
5
mA
Vref gain rate
Thermal shutdown(TSD)
threshold (Note1)
Vref(gain)
Vref=2.0V
1/5.2
1/5.0
1/4.8
―
TjTSD
―
145
160
175
°C
VM recovery voltage
Over-current detection (ISD)
threshold (Note2)
VMR
―
7.0
8.0
9.0
V
ISD
―
4.1
4.9
5.7
A
Note1: About TSD
When the junction temperature of the device reached the TSD threshold, the TSD circuit is triggered; the internal reset
circuit then turns off the output transistors. Noise rejection blanking time is built-in to avoid misdetection. Once the
TSD circuit is triggered, the device will be set to standby mode, and can be cleared by reasserting the VM power source,
or setting the DMODE pins to standby mode. The TSD circuit is a backup function to detect a thermal error, therefore
is not recommended to be used aggressively.
Note2: About ISD
When the output current reaches the threshold, the ISD circuit is triggered; the internal reset circuit then turns off the
output transistors. Once the ISD circuit is triggered, the device keeps the output off until power-on reset (POR), is
reasserted or the device is set to standby mode by DMODE pins. For fail-safe, please insert a fuse to avoid secondary
trouble.
Back-EMF
While a motor is rotating, there is a timing at which power is fed back to the power supply. At that timing, the motor
current recirculates back to the power supply due to the effect of the motor back-EMF.
If the power supply does not have enough sink capability, the power supply and output pins of the device might rise
above the rated voltages. The magnitude of the motor back-EMF varies with usage conditions and motor
characteristics. It must be fully verified that there is no risk that the TB67S109A or other components will be damaged
or fail due to the motor back-EMF.
Cautions on Overcurrent Shutdown (ISD) and Thermal Shutdown (TSD)
The ISD and TSD circuits are only intended to provide temporary protection against irregular conditions such as an
output short-circuit; they do not necessarily guarantee the complete IC safety.
If the device is used beyond the specified operating ranges, these circuits may not operate properly: then the device
may be damaged due to an output short-circuit.
The ISD circuit is only intended to provide a temporary protection against an output short-circuit. If such a condition
persists for a long time, the device may be damaged due to overstress. Overcurrent conditions must be
removed immediately by external hardware.
IC Mounting
Do not mount devices incorrectly or in the wrong orientation. Otherwise, it may cause breakdown, damage and/or
deterioration of the device.
25
2020-2-4
TB67S109AFTG/FNG
AC Electrical Specification (Ta = 25°C, VM = 24 V, 6.8 mH/5.7Ω)
Characteristics
Symbol
Test condition
Min
Typ.
Max
Unit
Inside filter of CLK input minimum
High width
tCLK(H)
The CLK(H) minimum pulse
width
300
―
―
ns
Inside filter of CLK input minimum
Low width
tCLK(L)
The CLK(L) minimum pulse
width
250
―
―
ns
tr
―
30
80
130
ns
Output transistor
tf
―
40
90
140
ns
switching specific
tpLH(CLK)
CLK-Output
―
1000
―
ns
tpHL(CLK)
CLK-Output
―
1500
―
ns
Analog noise blanking time
AtBLK
VM=24V,Iout=1.5A
250
400
550
ns
Oscillator frequency accuracy
ΔfOSCM
COSC=270pF, ROSC=5.1 kΩ
-15
―
+15
%
Oscillator reference frequency
fOSCM
COSC= 270 pF, ROSC =5.1 kΩ
952
1120
1288
kHz
Chopping frequency
fchop
Output:Active(Iout =1.5 A),
fOSCM = 1120 kHz
―
70
―
kHz
AC Electrical Specification Timing chart
1/fCLK
tCLK(L)
50%
50%
50%
tCLK(H)
[CLK]
tpHL(CLK)
tpLH(CLK)
90%
90%
50%
50%
[OUT]
10%
tr
tf
10%
Timing charts may be simplified for explanatory purpose.
26
2020-2-4
TB67S109AFTG/FNG
(Reference) About the relation between power dissipation and ambient temperature
Power dissipation
Power dissipation
PD (W) PD (W)
PD-Ta Graph
(1): Device alone
(2): Measured when mounted on the four-layer board.
θj-a=30.5°C/W. This value is dependent on a substrate pattern and mounting conditions.
Ambient temperature Ta (°C)
* This value is dependent on a substrate pattern and mounting conditions. Please be
careful. Moreover, power dissipation becomes small when ambient temperature is
high.
27
2020-2-4
TB67S109AFTG/FNG
Package Dimensions
P-WQFN48-0707-0.50-003
(Unit: mm)
Weight 0.10g (typ.)
28
2020-2-4
TB67S109AFTG/FNG
HTSSOP48-P-300-0.50
(Unit: mm)
Weight 0.21g (typ.)
29
2020-2-4
TB67S109AFTG/FNG
Notes on Contents
Block Diagrams
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory
purposes.
Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes.
Timing Charts
Timing charts may be simplified for explanatory purposes.
Application Circuits
The application circuits shown in this document are provided for reference purposes only. Thorough evaluation is
required, especially at the mass-production design stage.
Toshiba does not grant any license to any industrial property rights by providing these examples of application circuits.
Test Circuits
Components in the test circuits are used only to obtain and confirm the device characteristics. These components and
circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment.
IC Usage Considerations
Notes on handling of ICs
(1)
The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded,
even for a moment. Do not exceed any of these ratings.Exceeding the rating(s) may cause device
breakdown, damage or deterioration, and may result in injury by explosion or combustion.
(2)
Use an appropriate power supply fuse to ensure that a large current does not continuously flow in the
case of overcurrent and/or IC failure. The IC will fully break down when used under conditions that
exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse
noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can
lead to smoke or ignition. To minimize the effects of the flow of a large current in the case of breakdown,
appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required.
(3)
If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the
design to prevent device malfunction or breakdown caused by the current resulting from the inrush
current at power ON or the negative current resulting from the back electromotive force at power OFF. IC
breakdown may cause injury, smoke or ignition. Use a stable power supply with ICs with built-in
protection functions. If the power supply is unstable, the protection function may not operate, causing IC
breakdown. IC breakdown may cause injury, smoke or ignition.
(4)
Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative
terminals of power supplies are connected properly.
Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding
the rating(s) may cause device breakdown, damage or deterioration, and may result in injury by
explosion or combustion.
In addition, do not use any device inserted in the wrong orientation or incorrectly to which current is
applied even just once.
(5) Carefully select external components (such as inputs and negative feedback capacitors) and load
components (such as speakers), for example, power amp and regulator.
If there is a large amount of leakage current such as from input or negative feedback capacitor, the IC
output DC voltage will increase. If this output voltage is connected to a speaker with low input withstand
voltage, overcurrent or IC failure may cause smoke or ignition. (The overcurrent may cause smoke or
ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied Load (BTL)
connection-type IC that inputs output DC voltage to a speaker directly.
30
2020-2-4
TB67S109AFTG/FNG
Points to remember on handling of ICs
Overcurrent detection Circuit
Overcurrent detection circuits (referred to as current limiter circuits) do not necessarily protect ICs under all
circumstances. If the overcurrent detection circuits operate against the overcurrent, clear the overcurrent status
immediately.
Depending on the method of use and usage conditions, exceeding absolute maximum ratings may cause the
overcurrent detection circuit to operate improperly or IC breakdown may occur before operation. In addition,
depending on the method of use and usage conditions, if overcurrent continues to flow for a long time after operation,
the IC may generate heat resulting in breakdown.
Thermal Shutdown Circuit
Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the thermal shutdown circuits
operate against the over-temperature, clear the heat generation status immediately.
Depending on the method of use and usage conditions, exceeding absolute maximum ratings may cause the thermal
shutdown circuit to operate improperly or IC breakdown to occur before operation.
Heat Radiation Design
When using an IC with large current flow such as power amp, regulator or driver, design the device so that heat is
appropriately radiated, in order not to exceed the specified junction temperature (TJ) at any time or under any
condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to
decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, when designing the device, take
into consideration the effect of IC heat radiation with peripheral components.
Back-EMF
When a motor reverses the rotation direction, stops or slows abruptly, current flows back to the motor’s power supply
owing to the effect of back-EMF. If the current sink capability of the power supply is small, the device’s motor power
supply and output pins might be exposed to conditions beyond the absolute maximum ratings. To avoid this problem,
take the effect of back-EMF into consideration in system design.
31
2020-2-4
TB67S109AFTG/FNG
RESTRICTIONS ON PRODUCT USE
Toshiba Corporation and its subsidiaries and affiliates are collectively referred to as “TOSHIBA”.
Hardware, software and systems described in this document are collectively referred to as “Product”.
• TOSHIBA reserves the right to make changes to the information in this document and related Product without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's
written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury
or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or
incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant
TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product
and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the
application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or
applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b)
evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms,
sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and
applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
• PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY
CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT
("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without limitation,
equipment used in nuclear facilities, equipment used in the aerospace industry, lifesaving and/or life supporting medical equipment,
equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control
combustions or explosions, safety devices, elevators and escalators, and devices related to power plant. IF YOU USE PRODUCT FOR
UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your TOSHIBA sales
representative or contact us via our website.
• Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
• The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any
intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER,
INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING
WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND
(2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT,
OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR
PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
• Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation,
for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products
(mass destruction weapons). Product and related software and technology may be controlled under the applicable export laws and
regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration
Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all
applicable export laws and regulations.
• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING
AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
https://toshiba.semicon-storage.com/
32
2020-2-4
工商网监
湘ICP备2023018690号
