HS5A - HS5M
Taiwan Semiconductor
5A, 50V - 1000V High Efficient Surface Mount Rectifier
FEATURES
KEY PARAMETERS
●
●
●
●
●
Glass passivated junction chip
Ideal for automated placement
Low forward voltage drop
Low profile package
Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
● Halogen-free according to IEC 61249-2-21
APPLICATIONS
PARAMETER
VALUE
UNIT
IF(AV)
5
A
VRRM
50 - 1000
V
IFSM
150
A
TJ MAX
150
°C
Package
DO-214AB (SMC)
Configuration
Single die
● High frequency rectification
● Freewheeling application
● Switching mode converters and inverters in computer, automotive and
telecommunication.
MECHANICAL DATA
●
●
●
●
Case: DO-214AB (SMC)
Molding compound meets UL 94V-0 flammability rating
Part no. with suffix "H" means AEC-Q101 qualified
Packing code with suffix "G" means green compound
(halogen-free)
● Moisture sensitivity level: level 1, per J-STD-020
● Terminal: Matte tin plated leads, solderable per J-STD-002
● Meet JESD 201 class 2 whisker test
DO-214AB (SMC)
● Polarity: As marked
● Weight: 0.21 g (approximately)
ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
PARAMETER
SYMBOL
Marking code on the device
HS5A HS5B HS5D HS5F HS5G HS5J HS5K HS5M UNIT
HS5A HS5B HS5D HS5F HS5G HS5J HS5K HS5M
Repetitive peak reverse voltage
VRRM
50
100
200
300
400
600
800
1000
V
Reverse voltage, total rms value
VR(RMS)
35
70
140
210
280
420
560
700
V
Maximum DC blocking voltage
VDC
50
100
200
300
400
600
800
1000
Forward current
Surge peak forward current, 8.3 ms
single half sine-wave uperimposed on
rated load per diode
Junction temperature
IF(AV)
5
A
IFSM
150
A
TJ
- 55 to +150
°C
Storage temperature
TSTG
- 55 to +150
°C
1
Version:J1903
HS5A - HS5M
Taiwan Semiconductor
THERMAL PERFORMANCE
PARAMETER
Junction-to-ambient thermal resistance
SYMBOL
TYP
UNIT
RӨJA
60
°C/W
ELECTRICAL SPECIFICATIONS (TA = 25°C unless otherwise noted)
PARAMETER
Forward voltage per diode
Forward voltage per diode
CONDITIONS
(1)
(1)
HS5A
HS5B
HS5D
HS5F
HS5G
HS5J
HS5K
HS5M
HS5A
HS5B
HS5D
HS5F
HS5G
HS5J
HS5K
HS5M
Reverse current @ rated VR per diode
Junction capacitance
Reverse recovery time
(2)
HS5A
HS5B
HS5D
HS5F
HS5G
HS5J
HS5K
HS5M
HS5A
HS5B
HS5D
HS5F
HS5G
HS5J
HS5K
HS5M
IF = 3A, TJ = 25°C
IF = 5A, TJ = 25°C
TJ = 25°C
SYMBOL
VF
VF
IR
TJ = 125°C
1 MHz, VR=4.0V
IF=0.5A , IR=1.0A
IRR=0.25A
TYP.
MAX.
UNIT
-
-
V
-
-
V
-
1.35
V
-
1.00
V
-
1.30
V
-
1.70
V
-
10
µA
-
250
µA
80
-
pF
50
-
pF
-
50
ns
-
75
ns
CJ
trr
Notes:
1. Pulse test with PW=0.3 ms
2. Pulse test with PW=30 ms
2
Version:J1903
HS5A - HS5M
Taiwan Semiconductor
ORDERING INFORMATION
PART NO.
PART
NO.
SUFFIX
HS5x
(Note 1,2)
PACKING
CODE
PACKING
CODE
SUFFIX
PACKAGE
PACKING
R7
SMC
850 / 7" Plastic reel
R6
SMC
3,000 / 13" Paper reel
SMC
3,000 / 13" Plastic reel
V7
Matrix SMC
850 / 7" Plastic reel
V6
Matrix SMC
`3,000 / 13" Plastic reel
M6
H
G
Note :
1. "x" defines voltage from 50V (HS5A) to 1000V (HS5M)
2. Only V6 and V7 are all green compound (halogen free)
EXAMPLE
EXAMPLE P/N
PART NO.
PART NO.
SUFFIX
PACKING
CODE
PACKING CODE
SUFFIX
DESCRIPTION
HS5AHR7G
HS5A
H
R7
G
AEC-Q101 qualified
Green compound
3
Version:J1903
HS5A - HS5M
Taiwan Semiconductor
CHARACTERISTICS CURVES
(TA = 25°C unless otherwise noted)
Fig.2 Typical Junction Capacitance
6
175
5
150
JUNCTION CAPACITANCE (pF)
AVERAGE FORWARD CURRENT (A)
Fig.1 Forward Current Derating Curve
4
3
2
1
RESISTIVE OR
INDUCTIVE LOAD
125
100
25
75
50
HS5J - HS5M
25
f=1.0MHz
Vsig=50mVp-p
0
0
0
HS5A - HS5G
50
75
100
125
0.1
150
1
AMBIENT TEMPERATURE (oC)
100
=100°C
TJ
10
TJ=25°C
1
40
60
80
100
120
100 10
10
TJ=125°C
HS5A - HS5D
0.1
TJ=25°C
HS5G
10.01
Pulse width
0.001
0.3
0.1
0.2
140
UF1DLW
1
(A)
INSTANTANEOUS FORWARD CURRENT (A)
INSTANTANEOUS REVERSE CURRENT (μA)
Fig.4 Typical Forward Characteristics
1000
20
100
REVERSE VOLTAGE (V)
Fig.3 Typical Reverse Characteristics
0
10
0.4
0.4
0.5
0.6
0.6
0.7
0.8
HS5J - HS5M
0.8
0.9
1
1
1.2
1.1
1.4
FORWARD VOLTAGE (V)
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
4
Version:J1903
1.2
HS5A - HS5M
Taiwan Semiconductor
CHARACTERISTICS CURVES
(TA = 25°C unless otherwise noted)
Fig.5 Maximum Non-repetitive Forward Surge Current
PEAK FORWARD SURGE CURRENT (A)
200
100
0
1
10
100
NUMBER OF CYCLES AT 60 Hz
Fig.6 Reverse Recovery Time Characteristic And Test Circuit Diagram
5
Version:J1903
HS5A - HS5M
Taiwan Semiconductor
PACKAGE OUTLINE DIMENSIONS
DO-214AB (SMC)
Unit (mm)
DIM.
Unit (inch)
Min.
Max.
Min.
Max.
A
2.90
3.20
0.114
0.126
B
6.60
7.11
0.260
0.280
C
5.59
6.22
0.220
0.245
D
2.00
2.62
0.079
0.103
E
1.00
1.60
0.039
0.063
F
7.75
8.13
0.305
0.320
G
0.10
0.20
0.004
0.008
H
0.15
0.31
0.006
0.012
SUGGESTED PAD LAYOUT
Symbol
Unit (mm)
Unit (inch)
A
3.30
0.130
B
2.50
0.098
C
6.80
0.268
D
4.40
0.173
E
9.40
0.370
MARKING DIAGRAM
Matrix SMC
SMC
P/N
=Marking Code
G
=Green Compound
YW
=Date Code
F
=Factory Code
6
Version:J1903
HS5A - HS5M
Taiwan Semiconductor
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied, to
any intellectual property rights is granted by this document. Except as provided in TSC’s terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or selling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
7
Version:J1903
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