ZTP7001-00

ZTP7001 High PSRR, 600mA LDO Regulator FEATURES DESCRIPTION ● Wide Input Voltage Range, 2.2V to 6.0V Current ● Small Output Capacitor, 1uF ● Typical 65uA Quiescent Current ● Less Than 1uA Shutdown Current ● Dedicated Chip Enable Pin ● Soft Start 100us ● Over Current Limitation ● Thermal Protection ● RoHS Compliant and Halogen Free The ZTP7001 is a high performance LDO regulator specifically designed to deliver adjustable output voltage with high PSRR and fast transient response. Internal 700mohm PMOS pass transistor yields typical 420mV dropout voltage at 600mA output current. Typical quiescent current is only 65uA. A logic low on the enable input, EN, shuts down the output and reduces the supply current to less than 1uA. The ZTP7001 works stably with as low as 1uF ceramic output capacitor, minimizing board space requirement. Other features include soft start, high output accuracy, output current limiting, and thermal protection. The ZTP7001 is available in the TSOT23-5 package. APPLICATIONS Pins Configuration ● Adjustable Output Voltage ● Fast Transient Response ● Typical 420mV Dropout Voltage at 600mA Output ● Battery-Powered Equipment’s ● Hand-Held Electrical Appliances TSOT23-5 ● Portable Communication Equipment’s ORDERING INFORMATION PART PACKAGE ZTP7001 TSOT-23-5L RoHS Ship, Quantity Yes Tape and Reel Typical Application Circuits VIN VIN 1 GND 2 EN 3 5 VOUT 4 FB ZTP7001 VOUT VIN VOUT R1 CIN EN C1 COUT FB R2 GND ZTP7001 DS-11 Copyright © ZillTek Technology Corp. -1- 4F-3, No.5, Technology Rd., Science-Based Industrial Park, Hsinchu 30078, Taiwan Tel: (886) 3577 7509; Fax: (886) 3577 7390 Email: sales@zilltek.com ZTP7001 Absolute Maximum Ratings Electro-Static Discharge Sensitivity Input Supply Voltage VIN ……………………… –0.3V to +6.5V Voltage at EN ………………………………………… –0.3V to +6.5V Others ……………………………………….... –0.3V to (VIN + 0.3V) Maximum Power Dissipation PD@TA = 25°C ………. 0.4W ESD (Human Body Mode) ……...………………………………. 2kV ESD (Machine Mode) ……...…………………………………… 200V This integrated circuit can be damaged by ESD. It is recommended that all integrated circuits be handled with proper precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Pins Description Package Thermal Characteristics Pin Symbol Description 1 VIN Input Voltage. 2 GND Ground. 3 4 5 EN FB VOUT Active High Chip Enable. Output Voltage Feedback. Output Voltage. Thermal Resistance, θJA ……………………….………… 250°C /W Thermal Resistance, θJC ……………………………………. 25°C/W Functional Block Diagram VIN EN VOUT Current Limit & Thermal Protection 1uA FB GND VREF & Soft Start DS-11 Copyright © ZillTek Technology Corp. -2- 4F-3, No.5, Technology Rd., Science-Based Industrial Park, Hsinchu 30078, Taiwan Tel: (886) 3577 7509; Fax: (886) 3577 7390 Email: sales@zilltek.com ZTP7001 Recommended Operation Conditions PARAMETER MIN TYP Max Unit Continuous Junction Temperature –40 -- 125 °C Ambient Temperature Range –40 -- 85 °C Input Voltage Range 2.2 -- 6.0 V Electrical Specifications VIN = VEN = 3.3V and TA = 25°C unless otherwise specified PARAMETER Symbol Input Supply Voltage VIN Under Voltage Lockout TEST CONDITIONS MIN TYP Max Unit VIN 2.2 -- 6.0 V VUVLO -- 2 2.1 V Shutdown Current ISD VEN = 0V -- -- 1 uA Quiescent Current IQ IOUT = 0mA -- 65 -- uA FB Pin Voltage VFB IOUT = 10mA 792 800 808 mV Maximum Output Current IOUT 600 800 -- mA -- 30 50 mV -- 700 -- mΩ IOUT = 600mA -- 420 -- mV ∆VOUT/∆VIN VOUT + 0.42V < VIN < 6.0V -- 0.02 -- %/V BW = 10Hz to 100kHz, IOUT = 10mA -- 70 -- uVrms IOUT = 10mA, f = 1kHz -- -70 -- dB IOUT = 10mA, f = 10kHz -- -60 -- dB VOUT = 0V -- 100 -- mA VEN = 3.3V -- 1 -- uA Load Regulation ∆VOUT/∆IOUT 1mA < IOUT < 600mA On-Resistance of Pass Element RDS(ON) Dropout Voltage Line Regulation VDP Output Noise Power Supply Ripple Rejection PSRR Short Circuit Limit EN Pull-Down Constant Current IEN EN Input High Threshold VIH 1.6 -- -- V EN Input Low Threshold VIL -- -- 0.4 V Soft Start Time tSS -- 100 -- uS Thermal Shutdown Temperature TSD -- 160 -- °C Thermal Shutdown Hysteresis ∆TSD -- 30 -- °C DS-11 Copyright © ZillTek Technology Corp. -3- 4F-3, No.5, Technology Rd., Science-Based Industrial Park, Hsinchu 30078, Taiwan Tel: (886) 3577 7509; Fax: (886) 3577 7390 Email: sales@zilltek.com ZTP7001 Typical Characteristics On-Resistance vs. Input Voltage Quiescent Current vs. Input Voltage 80 1200 70 Quiescent Current (uA) On-Resistance (mΩ) 1000 800 600 400 200 60 50 40 30 20 10 0 0 0 1 2 3 4 5 6 0 7 1 2 Line Regulation 4 5 6 7 Enable Disable Threshold vs. Input Voltage 1.83 1.4 1.2 Enable/Disable Threshold (V) 1.81 Output Voltage (V) 3 Input Voltage (V) Input Voltage (V) 1.79 VOUT = 1.8V 1.77 1.75 Enable 1 0.8 Disable 0.6 0.4 0.2 0 1.73 0 1 2 3 4 5 6 0 7 1 2 3 4 5 Input Voltage (V) Input Voltage (V) Output Current Limit Power Off Waveforms 6 VOUT 1V/Div Output Voltage (V) 2.5V 2.0V VSS 0.5V/Div 1.5V 1.0V VIN 2V/Div 0.5V 0V 0mA 400mA 800mA Output Current (mA) DS-11 Copyright © ZillTek Technology Corp. Time (2ms/Div) -4- 4F-3, No.5, Technology Rd., Science-Based Industrial Park, Hsinchu 30078, Taiwan Tel: (886) 3577 7509; Fax: (886) 3577 7390 Email: sales@zilltek.com 7 ZTP7001 Power On Waveforms Load Transient Response VOUT 50m/Div VOUT 1V/Div VOUT = 2.5V COUT = 1uF VSS 0.5V/Div IOUT 0.2A/Div VIN 2V/Div Time (2ms/Div) Time (20us/Div) Turn On/Off Waveforms Output Short Circuit Response VOUT 2V/Div VOUT 1V/Div VSS 0.5V/Div VEN 2V/Div IOUT 0.5A/Div Time (400us/Div) Time (200ms/Div) PSRR Noise Level VIN = 3.3V, VOUT = 1.6V, IOUT = 100mA VIN =VIN 3.3V, VOUT = =1.6V, = 100mA = 3.3V, VOUT 1.6V, IIOUT OUT = 100mA ZTP7001 DS-11 Copyright © ZillTek Technology Corp. -5- 4F-3, No.5, Technology Rd., Science-Based Industrial Park, Hsinchu 30078, Taiwan Tel: (886) 3577 7509; Fax: (886) 3577 7390 Email: sales@zilltek.com ZTP7001 Functional Pin Description The output voltage of the ZTP7001 adjustable regulator is programmed using an external resistive divider as shown in the typical application circuit. The output voltage is calculated as: VIN: Input Voltage. Connect a minimum 1uF ceramic capacitor to this pin for stable operation. GND: Ground. VOUT = VREF × EN: Active High Chip Enable. This pin is internally pulled down by a 1uA current source. R1 + R2 R2 Where VREF = 0.8V typ (the internal reference voltage.) FB: Output Voltage Feedback. The FB voltage is regulated to 0.8V. Connect a resistive voltage divider to set the output voltage. Resistors R1 and R2 should be chosen for approximately 10uA divider current. Lower value resistors can be used but offer no inherent advantage and waste more power. Higher values should be avoided as leakage currents at FB increase the output voltage error. VOUT: Output Voltage. Connect a minimum 1uF ceramic capacitor to this pin for stable operation. Current Limit and Thermal Protection OPERATION PRINCIPLES Current limiting and thermal protection prevent damage by excessive output current and/or power dissipation. The device switches into a constant-current mode at approximately 800mA. Further load reduces the output voltage instead of increasing the output current. The thermal protection shuts the regulator off if the junction temperature rises above 160°C. Recovery is automatic when the junction temperature drops approximately 30°C below the high temperature trip point. The ZTP7001 low dropout regulator (LDO) operates with a very low input voltage (>2.2V). The ZTP7001 can operate at low input voltage due to low voltage circuit design techniques and a PMOS pass element that exhibits low dropout. The dropout voltage is typically 420mV at 600mA output current. Chip Enable Typical quiescent current is only 65uA. A logic low on the enable input, EN, shuts down the output and reduces the supply current to less than 1uA. The EN pin is internally pulled down by a 1uA current source and may be tied to VIN in applications where the shutdown feature is not used. Pass Element The ZTP7001 integrates a 700mΩ PMOS pass element that enables very low dropout voltage. The PMOS pass element includes a back diode that safely conducts reverse current when the input voltage level drops below the output voltage level. Output Discharging Resistor Application Information An internal 100Ω MOSFET is connected to VOUT pin and discharges the output voltage to ground when the chip is disabled or thermal protection is triggered. Capacitors Selection Select carefully the external capacitors carefully to ensure stability and performance. Place the externally capacitors close to the IC with a distance no longer than 0.5 inches. The input capacitor CIN with larger value and lower ESR (equivalent series resistance) provides better PSRR and line-transient response. Soft Start The ZTP7001 features soft start and the soft start time is fixed as 100us. Output Voltage Programming DS-11 Copyright © ZillTek Technology Corp. 6 4F-3, No.5, Technology Rd., Science-Based Industrial Park, Hsinchu 30078, Taiwan Tel: (886) 3577 7509; Fax: (886) 3577 7390 Email: sales@zilltek.com ZTP7001 The ZTP7001 is specifically designed to work with low ESR ceramic output capacitor in space-saving and performance consideration. A 1uF ceramic capacitor is adequate for stable operation. However, for best load and line transient response, output capacitor larger than 4.7uF is recommended. very important to use a good thermal PC board layout to maximize the allowable power dissipation. The thermal path for the heat generated by the IC is from the die to the copper lead frame, through the package (especially the ground lead), to the PCB board cooper. The PC board copper. The PCB board copper is the heat sink. The footprint copper pads should be as wide as possible and expand out to larger copper areas to spread and dissipate the heat to the surrounding ambient. Feed through via to inner or backside copper layer are also useful in improving the overall thermal performance of the LDO regulator. Other heat sources on the board, not related to the LDO regulator, must also be considered when designing a PC board layout because they will affect overall temperature rise and the maximum allowable power dissipation. The following table lists thermal resistance for several different board sizes and copper areas. All measurements were taken in still air on 3/32" FR-4 board with the device mounted on topside. Power Supply Rejection Ration (PSRR) PSRR is a measure of how well a circuit rejects ripple coming from the input power supply at various frequencies and is very critical in many RF and wireless applications. PSRR is defined as the gain from the input ripple to output ripple over a wide frequency range (10Hz to 10MHz), Note that at heavy load measuring, ∆VIN will cause temperature deviation. Temperature will cause ∆VOUT voltage. So the heavy load PSRR measuring includes temperature effect. Thermal Consideration Table 1. Measured Thermal Resistance (2-Layer Board) The maximum power dissipation is specified as: PD(MAX) = Copper Area(mm2) Top Side Back Side 2500 2500 1000 2500 225 2500 100 2500 50 2500 (125C - TA)  JA where TJ(MAX) is the maximum operation junction temperature, TA is the ambient temperature and θJA is the junction to ambient thermal resistance. The ZTP7001 features thermal protection that shuts down the IC if the junction temperature is higher than 160°C. However, the power dissipation should be well designed to keep the continuous junction temperature below 125°C for maximum reliability. θJA depends on the thermal resistance of the package, PCB layout, surrounding airflow. For SOT-23-5 package, the thermal resistance θJA is 250°C /W on the standard JEDEC 51-3 single layer thermal test board. The maximum power dissipation at TA = 25°C can be calculated as: PD(MAX) = Board Area (mm2) 2500, 2-Layer 2500, 2-Layer 2500, 2-Layer 2500, 2-Layer 2500, 2-Layer θJA (°C/W) 125 125 130 135 150 Layout Considerations Careful PCB Layout is necessary for better performance. The following guidelines should be followed for good PCB layout. ■ Place the input and output capacitors as close as possible to the IC. ■ Keep VIN and VOUT trace as possible as short and wide. ■ Use a large PCB ground plane for maximum thermal dissipation. (125C - 25C)  0.4W 250C/W Because of the small size of the TSOT23-5 package, it is DS-11 Copyright © ZillTek Technology Corp. 7 4F-3, No.5, Technology Rd., Science-Based Industrial Park, Hsinchu 30078, Taiwan Tel: (886) 3577 7509; Fax: (886) 3577 7390 Email: sales@zilltek.com ZTP7001 PACKAGE DIMENSIONS TSOT23-5 D C B e b A H A1 L Symbol Dimensions in mm A Min 0.700 Max 0.900 A1 0.000 0.130 B 1.500 1.700 b 0.300 0.559 C 2.500 3.100 D 2.800 3.100 e 0.950 BSC H 0.080 0.200 L 0.200 0.800 DS-11 Copyright © ZillTek Technology Corp. -8- 4F-3, No.5, Technology Rd., Science-Based Industrial Park, Hsinchu 30078, Taiwan Tel: (886) 3577 7509; Fax: (886) 3577 7390 Email: sales@zilltek.com