HCB1608KF-100T30

TAI-TECH TBM01-130100632 High Current Ferrite Chip Bead(Lead Free) P1. HCB1608KF-100T30 1.Features 1. Monolithic inorganic material construction. Halogen Pb Halogen-free Pb-free 2. Closed magnetic circuit avoids crosstalk. 3. Suitable for reflow soldering. 4. Shapes and dimensions follow E.I.A. spec. 5. Available in various sizes. 6. Excellent solder ability and heat resistance. 7. High reliability. 8.100% Lead(Pb) & Halogen-Free and RoHS compliant. 9. Low DC resistance structure of electrode to prevent wasteful electric power consumption. 2.Dimensions Chip Size A 1.60±0.15 B 0.80±0.15 C 0.80±0.15 D 0.30±0.20 Units: mm 3.Part Numbering HCB 1608 KF A B C A: Series B: Dimension C: Material D: Impedance E: Packaging F: Rated Current - 100 T 30 D E F LxW Lead Free Material 100=10Ω T=Taping and Reel, B=Bulk(Bags) 30=3000mA 4.Specification Tai-Tech Part Number Impedance (Ω) Test Frequency (Hz) DC Resistance (Ω) max. Rated Current (mA) max. HCB1608KF-100T30 10±25% 60mV/100M 0.04 3000 „ Impedance-Frequency Characteristics HCB1608KF-100T30 50 IMPEDANCE(Ohm) 40 30 20 Z 10 X R 0 1 10 100 FREQUENCY(MHz) www.tai-tech.com.tw 1000 TAI-TECH TBM01-130100632 P2. 5. Reliability and Test Condition Item Series No. Operating Temperature Performance FCB FCM HCI -- -40~+125℃ (Including self-temperature rise) -40~+105℃ (Including self-temperature rise) -- -40~+125℃ -40~+105℃ Transportation Storage Temperature HCB GHB FCA FCI Test Condition FHI FCH For long storage conditions, please see the Application Notice Agilent4291 Impedance (Z) Agilent E4991 Inductance (Ls) Agilent4287 Q Factor Refer to standard electrical characteristics list Agilent16192 DC Resistance Agilent 4338 Rated Current DC Power Supply Over Rated Current requirements, there will be some risk 1. Applied the allowed DC current. 2. Temperature measured by digital surface thermometer. Rated Current < 1A ∆T 20℃Max Temperature Rise Test Rated Current ≧ 1A ∆T 40℃Max Appearance: No significant abnormality. Solder heat Resistance Impedance change: Within ± 30%. Inductance change:：within±10% Preheat: 150℃,60sec. Solder: Sn-Cu0.5 Solder tamperature: 260±5℃ Flux for lead free: ROL0 Dip time: 10±0.5sec. No mechanical damage. Preheating Dipping Natural cooling Remaining terminal electrode:75% min. 260°C 150°C 60 second More than 95% of the terminal Solderability Preheat: 150℃,60sec. Solder: Sn-Cu0.5 Solder tamperature: 245±5℃ Flux for lead free: ROL0 Dip time: 4±1sec. Preheating Dipping Natural cooling 245° C electrode should be covered 150° C with solder. 4±1 second 60 second W The terminal electrode and the dielectric must Terminal strength not be damaged by the forces applied on the right conditions. 10±0.5 second W For FCB FCM HCB GHB FCI FHI FCH HCI: Size Force (Kgf) 1005 0.2 1608 0.5 2012 0.6 3216 1.0 3225 1.0 4516 1.0 4532 1.5 For FCA: Size 3216 Force (Kgf) 0.5 Time(sec) >30 Time(sec) >30 20(.787) Solder a chip on a test substrate, bend the The terminal electrode and the dielectric must Flexture strength not be damaged by the forces applied on the Bending 45(1.772) 45(1.772) right conditions. substrate by 2mm (0.079in)and return. The duration of the applied forces shall be 60 40(1.575) (+ 5) Sec. 100(3.937) R 0.5(0.02) Bending Strength The ferrite should not be damaged by Forces applied on the right condition. Appearance: Cracking, chipping and any other defects harmful to the characteristics should not be allowed. Random Vibration Test Impedance: within±30% Inductance change:：within±10%. www.tai-tech.com.tw Size mm(inches) P-Kgf 1608 2012 FCA3216 3216 3225 0.80(0.033) 1.40(0.055) 2.00(0.079) 0.3 1.0 1.5 2.00(0.079) 2.5 4516 4532 2.70(0.106) 2.5 Frequency: 10-55-10Hz for 15 min. Amplitude: 1.52mm Directions and times: X, Y, Z directions for 15 min.. This cycle shall be performed 12 times in each of three mutually perpendicular directions (Total 9hours). TAI-TECH TBM01-130100632 Item Performance Test Condition Temperature: 125±2℃(bead), 85±2℃(inductor) Applied current: rated current. Duration: 1000±12hrs. Measured at room temperature after placing for 2 to 3hrs. Life testing at High Appearance: no damage. Temperature Impedance: within±30%of initial value. Inductance: within±10%of initial value. Q: within±30%of initial value. (FCI FHI FCH) Q: within±20%of initial value. (HCI ) Humidity Appearance: no damage. Thermal shock Low temperature storage Phase Humidity: 90~95%RH. Temperature: 40±2℃. Temperature: 60±2℃.(HCI) Duration: 504±8hrs. Measured at room temperature after placing for 2 to 3hrs. Temperature(℃) Time(min.) 1 -40±2℃ Impedance: within±30%of initial value. 2 room temp. Inductance: within±10%of initial value. 3 +105±2℃ Q: within±30%of initial value. Measured: 500 times (FCI FHI FCH) Q: within±20%of initial value. (HCI) 30±5 ≦0.5 30±5 Condition for 1 cycle Step1: -40±2℃ 30±5 min. Step2: +105±2℃ 30±5min. Number of cycles: 500 Measured at room temperature after placing for 2 to 3 hrs. Temperature: -40±2℃. Duration: 500±8hrs. Measured at room temperature after placing for 2 to 3hrs. test No mechanical damage Drop 10 times on a concrete floor from a height of 75cm Impedance change: ±30% Drop P3. Inductance change:：within±10% Derating **Derating Curve Derated Current(A) 6 For the ferrite chip bead which withstanding current over 1.5A, as the operating temperature over 85℃, the derating current information is necessary to consider with. For the detail derating of current, please refer to the Derated Current vs. Operating Temperature curve. 5 4 3 2 1 6A 5A 4A 3A 2A 1.5A 1A 0 6.Soldering and Mounting 85 125 Environment Temperature+△Temperature(°C) 6-1. Recommended PC Board Pattern Land Patterns For Reflow Soldering Chip Size 0.6±0.03 0.30±0.03 0.30±0.03 0.15±0.05 0.80 0.30 0.30 1005 1.0±0.10 0.50±0.10 0.50±0.10 0.25±0.10 1.50 0.40 0.55 1608 1.6±0.15 0.80±0.15 0.80±0.15 0.30±0.20 2.60 0.60 0.80 2.0±0.20 1.25±0.20 0.85±0.20 0.50±0.30 GHB FCI 2.0±0.20 1.25±0.20 1.25±0.20 0.50±0.30 3.00 1.00 1.00 FHI 3216 3.2±0.20 1.60±0.20 1.10±0.20 0.50±0.30 4.40 2.20 1.40 3225 3.2±0.20 2.50±0.20 1.30±0.20 0.50±0.30 4.40 2.20 FCH 3.40 4516 4.5±0.20 1.60±0.20 1.60±0.20 0.50±0.30 5.70 2.70 HCI 1.40 4532 4.5±0.20 3.20±0.20 1.50±0.20 0.50±0.30 5.90 2.57 4.22 2012 Land Solder Resist 2.8 0.8 0603 HCB FCA3216 A(mm) B(mm) C(mm) D(mm) L(mm) G(mm) H(mm) 2.2-2.6 FCB FCM Type 0.8 Pitch 0.4 L H Series PC board should be designed so that products can prevent damage from mechanical stress when warping the board. Products shall be positioned in the sideway direction against the mechanical stress to prevent failure. G www.tai-tech.com.tw TAI-TECH P4. TBM01-130100632 6-2. Soldering Mildly activated rosin fluxes are preferred. The terminations are suitable for re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. Note. If wave soldering is used ,there will be some risk. Re-flow soldering temperatures below 240 degrees, there will be non-wetting risk 6-2.1 Lead Free Solder re-flow: Recommended temperature profiles for lead free re-flow soldering in Figure 1. 6-2.2 Soldering Iron: Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. for Iron Soldering in Figure 2. •Preheat circuit and products to 150℃ •350℃ tip temperature (max) •Never contact the ceramic with the iron tip •1.0mm tip diameter (max) •Use a 20 watt soldering iron with tip diameter of 1.0mm •Limit soldering time to 4~5sec. Iron Soldering Reflow Soldering PRE-HEATING SOLDERING within 4~5s TEMPERATURE(° C) ( ) TP(260° C / 40s max.) 217 60~150s 200 150 NATURAL COOLING SOLDERING PRE-HEATING NATURAL COOLING 20~40s 60~180s 350 150 Gradual cooling Over 60s 480s max. 25 TIME(sec.) TIME( sec.) Reflow times: 3 times max Fig.1 Iron Soldering times：1 times max Fig.2 6-2.3 Solder Volume: Upper limit Recommendable Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. Solder shall be used not to be exceed as shown in right side: Minimum fillet height = soldering thickness + 25% product height t 7.Packaging Information 7-1. Reel Dimension A ±0 . .5 13 C B 0 R1 .5 7"x8mm B(mm) C(mm) D(mm) 7”x8mm 9.0±0.5 60±2 13.5±0.5 178±2 7”x12mm 13.5±0.5 60±2 13.5±0.5 178±2 R0.5 120° 7"x12mm 7-2.1 Tape Dimension / 8mm ■Material of taping is paper .0 -0 .1 +0 .5 1 D: F:3.5±0.05 B0 t Size Bo(mm) Ao(mm) Ko(mm) P(mm) t(mm) D1(mm) 0.50max 2.0±0.05 0.50max none Size Bo(mm) Ao(mm) Ko(mm) P(mm) t(mm) D1(mm) 100505 1.12±0.03 0.62±0.03 0.60±0.03 2.0±0.10 0.60±0.03 none 160808 1.85±0.05 1.05±0.05 0.95±0.05 4.0±0.10 0.95±0.05 none 201209 2.30±0.05 1.50±0.05 0.95±0.05 4.0±0.10 0.95±0.05 none 060303 P P0:4±0.1 05 0. 10. + 56 1. D: t B0 P 0.68±0.05 0.38±0.05 Ko A0 A0 W:8.0±0.1 P2:2±0.1 F:3.5±0.1 W:8.0±0.3 E:1.75±0.1 P0:4±0.1 E:1.75±0.1 D R1 .9 A(mm) 5 Type 2±0.5 Ko www.tai-tech.com.tw TAI-TECH TBM01-130100632 P5. ■Material of taping is plastic Po:4±0.1 1 0. 5+ 1. : D t A P ± :1 D1 F:3.5±0.05 A Bo W:8.0±0.1 E:1.75±0.1 P2:2±0.05 Ko 1 0. Ao SECTION A-A Size Bo(mm) Ao(mm) Ko(mm) P(mm) t(mm) D1(mm) 160808 1.95±0.10 1.05±0.10 1.05±0.10 4.0±0.10 0.23±0.05 none 201209 2.25±0.10 1.42±0.10 1.04±0.10 4.0±0.10 0.22±0.05 1.0±0.10 201212 2.35±0.10 1.50±0.10 1.45±0.10 4.0±0.10 0.22±0.05 1.0±0.10 321611 3.50±0.10 1.88±0.10 1.27±0.10 4.0±0.10 0.22±0.05 1.0±0.10 322513 3.42±0.10 2.77±0.10 1.55±0.10 4.0±0.10 0.22±0.05 1.0±0.10 321609 3.40±0.10 1.77±0.10 1.04±0.10 4.0±0.10 0.22±0.05 1.0±0.10 Size Bo(mm) Ao(mm) Ko(mm) P(mm) 7-2.2 Tape Dimension / 12mm 1.75±0.1 Po:4±0.1 P2:2.0±0.05 t D1:1.5±0.1 Bo W:12.0±0.1 5.5±0.05 D:1.5+0.1 t(mm) D1(mm) 451616 4.95±0.1 1.93±0.1 1.93±0.1 4.0±0.1 0.24±0.05 1.5±0.1 453215 4.95±0.1 3.66±0.1 1.85±0.1 8.0±0.1 0.24±0.05 1.5±0.1 Ko P Ao 7-3. Packaging Quantity Chip Size 453215 451616 322513 321611 321609 201212 201209 160808 100505 060303 Chip / Reel 1000 2000 2500 3000 3000 2000 4000 4000 10000 15000 Inner box 4000 8000 12500 15000 15000 10000 20000 20000 50000 75000 Middle box 20000 40000 62500 75000 75000 50000 100000 100000 250000 375000 Carton 40000 80000 125000 150000 150000 100000 200000 200000 500000 750000 Bulk (Bags) 12000 20000 30000 50000 50000 100000 150000 200000 300000 -- 7-4. Tearing Off Force F Top cover tape The force for tearing off cover tape is 15 to 60 grams in the arrow direction under the following conditions. 165° to180° Base tape Room Temp. Room Humidity Room atm Tearing Speed (℃) (%) (hPa) mm/min 5~35 45~85 860~1060 300 Application Notice •Storage Conditions To maintain the solder ability of terminal electrodes: 1. TAI-TECH products meet IPC/JEDEC J-STD-020D standard-MSL, level 1. 2. Temperature and humidity conditions: Less than 40℃ and 60% RH. 3. Recommended products should be used within 12 months from the time of delivery. 4. The packaging material should be kept where no chlorine or sulfur exists in the air. •Transportation 1.Products should be handled with care to avoid damage or contamination from perspiration and skin oils. 2. The use of tweezers or vacuum pick up is strongly recommended for individual components. 3. Bulk handling should ensure that abrasion and mechanical shock are minimized. www.tai-tech.com.tw