2N7002 A K SOT-23
N-Channel Enhancement MOSFET
3
High Speed Switching Applications
ESD protected gate
2
Low ON-resistance
RDS(on) = 2.8 Ω (typ.) (@VGS = 10 V)
RDS(on) = 3.1 Ω (typ.) (@VGS = 5 V)
RDS(on) = 3.2 Ω (typ.) (@VGS = 4.5 V)
1
1.GATE
2.SOURCE
3.DRAIN
■ Simplified outline(SOT-23)
3
■ Marking Code:NJ
1
2
Equivalent Circuit (top view)
Absolute Maximum Ratings (Ta = 25°C)
Characteristic
Symbol
Rating
Unit
Drain–source voltage
VDSS
60
V
Gate–source voltage
VGSS
± 20
V
DC
ID
200
Pulse
IDP (Note 2)
760
PD (Note 3)
320
PD (Note 4)
1000
Channel temperature
Tch
150
°C
Storage temperature
Tstg
−55 to 150
°C
Drain current
(Note1)
Power dissipation
mA
mW
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: The channel temperature should not exceed 150°C during use.
Note 2: Pulse width ≤ 10 µs, Duty ≤ 1%
Note 3: Mounted on an FR4 board
2
(25.4 mm × 25.4 mm × 1.6 mm, Cu Pad: 0.42 mm x 3)
Note 4: Mounted on an FR4 board
2
(25.4 mm × 25.4 mm × 1.6 mm, Cu Pad: 645 mm )
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Dongguan YFW Electronics Co, Ltd.
2N7002 A K SOT-23
Electrical Characteristics (Ta = 25°C, Otherwise specified)
Characteristic
Drain-source breakdown voltage
Symbol
Min
Typ.
Max
Unit
ID = 250 µA, VGS = 0 V
60
―
―
V
VDS = 60 V, VGS = 0 V
―
―
1
VDS = 60 V, VGS = 0 V, Tj=150 °C
―
―
200
VGS = ±16 V, VDS = 0 V
―
―
±2
VGS = ±10 V, VDS = 0 V
―
―
±0.5
VGS = ±5 V, VDS = 0 V
―
―
±0.1
1.1
―
2.1
V
―
450
―
mS
ID = 100 mA, VGS = 10 V
―
2.8
3.9
RDS (ON)
ID = 100 mA, VGS = 10 V, Tj=150 °C
―
5.4
8.1
(Note 5)
ID = 100 mA, VGS = 5 V
―
3.1
4.4
ID = 100 mA, VGS = 4.5 V
―
3.2
4.7
―
0.27
0.35
―
0.08
―
―
0.08
―
―
11
17
―
3
―
V (BR) DSS
Drain cutoff current
IDSS
Gate leakage current
IGSS
Test Condition
Gate threshold voltage
Vth
ID = 250 µA, VDS = VGS
Forward transfer admittance
|Yfs|
VDS = 10 V, ID = 200 mA
Drain-source ON-resistance
Total Gate Charge
QG(tot)
(Note 5)
VDS = 30 V, ID = 200 mA
μA
Ω
Gate-Source Charge
QGS
Gate-Drain Charge
QGD
Input capacitance
Ciss
Output capacitance
Coss
Reverse transfer capacitance
Crss
―
0.7
―
td(on)
―
2
4
VDD = 40 V, ID = 160 mA
―
3
―
VGS = 0 V to 10 V, RG = 50 Ω
―
7
14
―
24
―
―
-0.87
-1.2
Turn-on delay time
Switching
Rise time
time
Turn-off delay time
tr
td(off)
Fall time
VGS = 4.5 V
VDS = 10 V, VGS = 0 V, f = 1 MHz
tf
Drain-source forward voltage
VDSF
ID = -115 mA, VGS = 0 V
(Note 5)
μA
nC
pF
ns
V
Note 5: Pulse test
(b) VIN
Switching Time Test Circuit
10 V
90 %
(a) Test Circuit
10 V
OUT
0
10 μs
RG
IN
RL
VDD = 40 V
RG = 50 Ω
D.U. ≤ 1%
VIN: tr, tf < 5 ns
Common Source
Ta = 25°C
VDD
10 %
0V
(c) VOUT
VDD
90 %
10 %
VDS (ON)
tr
tf
td(on)
td(off)
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Dongguan YFW Electronics Co, Ltd.
2N7002 A K SOT-23
ID – VDS
ID – VGS
1000
200
(mA)
Common Source
Ta = 25 °C
Pulse Test
3.0 V
10 V
3.5 V
150
Drain current ID
Drain current ID
(mA)
250
5.0 V
100
2.5V
50
Common Source
VDS = 5 V
Pulse Test
100
Ta = 150 °C
10
100 °C
25 °C
1
-25 °C
0
VGS = 2 V
0
2.0
1.0
3.0
Drain–source voltage VDS
Drain–source ON-resistance
RDS (ON) (Ω)
3.0V
3.5 V
4
VGS = 10 V
2
5.0 V
0
50
100
150
Drain current ID
6
5
4
ID = 100 mA / VGS = 10 V
2
1
0
−50
0
50
100
Ambient temperature Ta (°C)
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100 °C
4
25 °C
2
-25 °C
0
2
6
4
10
8
(V)
Vth – Ta
Common Source
VDS = VGS
ID = 0.25 mA
2.0
1.5
1.0
0.5
0
−50
150
(V)
Ta = 150 °C
2.5
100 mA / 4.5 V
3
6
Gate–source voltage VGS
100 mA / 5.0V
4.0
ID = 200 mA
Common Source
Pulse Test
(mA)
RDS (ON) – Ta
Common Source
Pulse Test
3.0
8
0
200
Gate threshold voltage Vth (V)
0
2.0
RDS (ON) – VGS
10
8
6
1.0
Gate–source voltage VGS
Common Source
Ta = 25°C
Pulse Test
2.5V
Drain–source ON-resistance
RDS (ON) (Ω)
(V)
RDS (ON) – ID
10
Drain–source ON-resistance
RDS (ON) (Ω)
0.1
0
4.0
0
50
100
150
Ambient temperature Ta (°C)
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Dongguan YFW Electronics Co, Ltd.
2N7002 A K SOT-23
C – VDS
IDR – VDS
200
Common Source
VGS = 0 V
Pulse Test
D
(mA)
Ciss
10
Drain reverse current IDR
Capacitance C (pF)
100
Coss
1
0.1
0.1
Crss
Common Source
Ta = 25°C
f = 1 MHz
VGS = 0 V
1
10
Drain–source voltage VDS
IDR
G
S
100
100 °C
50
25 °C
-25 °C
0
0
100
-0.4
-0.2
(V)
(V)
Common Source
ID = 0.2 A
Ta = 25°C
(V)
(ns)
VGS
4
Switching time t
Gate-source voltage
VDD = 15 V
VDD = 30 V
2
100
td(off)
10
tr
0
0.1
0.2
0.3
Total Gate Charge
0.4
0.5
1
0.6
100
10
Drain current ID
1000
(mA)
b
100
10
Single pulse
Mounted on FR4 board
0.1
1
10
100
t = 10 ms*
DC operation
10
1
1000
*Single Pulse Ta = 25 °C
Curves must be derated linearly
with increase in temperature.
Mounted on FR4 board
(25.4 mm × 25.4 mm × 1.6 mm,
Cu Pad: 645 mm2 )
0.1
Pulse width tw (s)
t = 1 ms*
This area
Limited by
RDS(ON)
100
a: 25.4 mm × 25.4 mm × 1.6 mm, Cu Pad: 0.42 mm2 x 3
b: 25.4 mm × 25.4 mm × 1.6 mm, Cu Pad: 645 mm2
0.01
(mA)
t = 100 µs*
a
1
0.001
1000
Safe Operating Area
Rth – tw
1000
td(on)
1
Qg (nC)
Drain current ID
Transient thermal impedance Rth (°C/W)
-1.2
Common Source
VDD = 40 V
VGS = 0 V to 10 V
Ta = 25 °C
tf
1000
6
0
-1.0
t – ID
10000
8
-0.8
-0.6
Drain–source voltage VDS
Dynamic Input Characteristic
10
Ta = 150 °C
150
1
VDSS max
10
Drain–source voltage VDS
100
(V)
Note: The above characteristics curves are presented for reference only and not guaranteed by production test.
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Dongguan YFW Electronics Co, Ltd.
2N7002 A K SOT-23
SOT-23
Package Outline
D
E
B
A
X
HE
v M A
3
Q
A
A1
1
2
e1
c
bp
w M B
Lp
e
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A1
max.
bp
c
D
E
e
e1
HE
Lp
Q
v
w
mm
1.1
0.9
0.1
0.48
0.38
0.15
0.09
3.0
2.8
1.4
1.2
1.9
0.95
2.5
2.1
0.45
0.15
0.55
0.45
0.2
0.1
Summary of Packing Options
Package
SOT-23
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Packing Description
Packing Quantity
Industry Standard
Tape/Reel,7”reel
3000
EIA-481-1
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Dongguan YFW Electronics Co, Ltd.
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