SPD5N50G
Sinai Power Technologies
www.sinai-power.com
N-channel Power MOSFET
PRODUCT SUMMARY
VDS (V) at TJ max.
RDS(on) max. at 25oC (Ω)
Qg max. (nC)
Qgs (nC)
Qgd (nC)
Configuration
Features
550
VGS=10V
1.5
42
12
6.5
single
ID=5A(Vgs=10V)
Ultra Low Gate Charge
Improved dv/dt Capability
100% Avalanche Tested
RoHS compliant
Applications
TO-252
Switching Mode Power Supplies (SMPS)
PWM Motor Controls
DC to DC Converters
LED Lighting
Bridge Circuits
ORDERING INFORMATION
Device
SPD5N50G
Device Package
TO-252
Marking
5N50G
ABSOLUTE MAXIMUM RATINGS (TC = 25oC, unless otherwise noted)
Parameter
Drain to Source Voltage
Symbol
Limit
Unit
VDSS
500(1)
V
5(1)
A
3.1
A
IDM
20
A
VGS
30
V
EAS
285
mJ
dv/dt
6
V/ns
112
W
0.88
W/oC
o
Continuous Drain Current (@TC=25 C)
ID
o
Continuous Drain Current (@TC=100 C)
Drain current pulsed (2)
Gate to Source Voltage
Single pulsed Avalanche Energy
Peak diode Recovery dv/dt
(3)
(4)
Total power dissipation (@TC=25oC)
PD
Derating Factor above 25 oC
Operating Junction Temperature & Storage Temperature
Maximum lead temperature for soldering purpose
TSTG, TJ
TL
-55 to + 150
o
260
o
C
C
Notes
1. Drain current is limited by maximum junction temperature.
2. Repetitive rating : pulse width limited by junction temperature.
3. L = 15mH, I AS = 5A, VDD = 50V, RG=25Ω, Starting at TJ = 25oC
4. ISD ≤ 5A, di/dt = 100A/us, VDD ≤ BVDSS, Starting at TJ =25oC
17-1018-Rev 01
1
Document Number: 17019
For technical questions, contact: Tech@Sinai-power.com.
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. © COPYRIGHT Sinai-Power Technologies. ALL RIGHTS RESERVED.
SPD5N50G
Sinai Power Technologies
www.sinai-power.com
THERMAL CHARACTERISTICS
Parameter
Value
Symbol
Thermal resistance, Junction to case
Rthjc
Thermal resistance, Junction to ambient
Rthja
Unit
0.75
o
62.5
o
C/W
C/W
ELECTRICAL CHARACTERISTICS ( TC = 25oC unless otherwise specified )
Parameter
Off Characteristics
Drain to source breakdown voltage
Breakdown voltage temperature coefficient
Drain to source leakage current
Gate to source leakage current, forward
Gate to source leakage current, reverse
On Characteristics
Gate threshold voltage
Drain to source on state resistance
Forward Transconductance
Symbol
Test conditions
BVDSS
IDSS
IGSS
VGS(TH)
RDS(ON)
Gfs
Ciss
Coss
Crss
td(on)
tr
td(off)
tf
Qg
Qgs
Gate-drain charge
Qgd
Typ.
Max.
Unit
500
--
--
V
ID=250uA, referenced to
25oC
--
0.5
--
V/oC
VDS=500V, VGS=0V
VDS=400V, TC=125oC
VGS=30V, VDS=0V
VGS=-30V, VDS=0V
-----
-----
1
50
100
-100
uA
uA
nA
nA
VDS=VGS, ID=250uA
VGS=10V, ID =2.5A
VDS = 30 V, ID =2.5A
2
---
-1.35
3.7
4
1.5
--
V
Ω
S
----------
1271
143
1
27.5
25
127
35
31.5
12
----------
--
6.5
--
VGS=0V, ID=250uA
ΔBVDSS /
ΔTJ
Dynamic Characteristics
Input capacitance
Output capacitance
Reverse transfer capacitance
Turn on delay time
Rising time
Turn off delay time
Fall time
Total gate charge
Gate-source charge
Min.
VGS=0V, VDS=25V, f=1MHz
VDS=250V, ID=5A,RG=25Ω
VDS=400V, VGS=10V, ID=5A
pF
ns
nC
SOURCE TO DRAIN DIODE RATINGS CHARACTERISTICS
Parameter
Continuous source current
Symbol
Test conditions
Min.
Typ.
Max.
Unit
IS
--
--
5
A
--
--
20
A
Pulsed source current
ISM
Integral reverse p-n Junction
diode in the MOSFET
Diode forward voltage drop.
VSD
IS=5A, VGS=0V
--
--
1.2
V
Reverse recovery time
Trr
--
567
--
ns
Reverse recovery Charge
Qrr
IS=5A, VGS=0V,
dIF/dt=100A/us
--
4
--
uC
17-1018-Rev 01
2
Document Number: 17019
For technical questions, contact: Tech@Sinai-power.com.
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. © COPYRIGHT Sinai-Power Technologies. ALL RIGHTS RESERVED.
SPD5N50G
Sinai Power Technologies
www.sinai-power.com
Fig1. Output characteristics
RDS(ON) (Ω)
ID (A)
Fig2. Drain-source on-state resistance
V DS (V)
ID (A)
Fig 4. Capacitance Characteristics
C (pF)
V GS (V)
Fig3. Gate charge characteristics
QG(nC)
V DS (V)
Fig 6. BVDSS vs junction temperature
RDS(ON) (Nomalized)
BV DSS (Nomalized)
Fig 5. RDS(ON) vs junction temperature
Tj (℃)
17-1018-Rev 01
Tj (℃)
3
Document Number: 17019
For technical questions, contact: Tech@Sinai-power.com.
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. © COPYRIGHT Sinai-Power Technologies. ALL RIGHTS RESERVED.
SPD5N50G
Sinai Power Technologies
www.sinai-power.com
Fig 8 . Transient thermal impedance
ID (A)
Z thjc (K/W)
Fig 7 . Safe operating area
Tp (Sec)
V DS (V)
ID (A)
Fig 9. Forward characteristics of reverse diode
V SD (V)
Fig 10. Gate charge test circuit & waveform
VGS
QG
QGS
QGD
10V
Charge
17-1018-Rev 01
4
nC
Document Number: 17019
For technical questions, contact: Tech@Sinai-power.com.
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. © COPYRIGHT Sinai-Power Technologies. ALL RIGHTS RESERVED.
SPD5N50G
Sinai Power Technologies
www.sinai-power.com
Fig 11. Switching time test circuit & waveform
VDS
RL
RGS
90%
VDS
VDD
VIN
10VIN
DUT
10%
10%
td(on)
tf
td(off)
tr
tON
tOFF
Fig 12. Unclamped Inductive switching test circuit & waveform
Fig 13. Peak diode recovery dv/dt test circuit & waveform
DUT
+ VDS
10V
VGS (DRIVER)
L
IS
di/dt
IS (DUT)
IRM
VDS
RG
10VGS
Diode reverse current
VDD
Diode recovery dv/dt
Same type
as DUT
VDS (DUT)
*. dv/dt controlled by RG
*. Is controlled by pulse period
17-1018-Rev 01
VF
VDD
Body diode forward voltage drop
5
Document Number: 17019
For technical questions, contact: Tech@Sinai-power.com.
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. © COPYRIGHT Sinai-Power Technologies. ALL RIGHTS RESERVED.
Sinai Power Technologies
SPD5N50G
www.sinai-power.com
Disclaimer
SINAI assumes no responsibility for equipment failures that result from using products at
values that exceed, even momentarily, rated values (such as maximum ratings, operating
condition ranges, or other parameters) listed in products specifications of any and all SINAI
products described or contained herein.
Specifications of any and all SINAI products described or contained herein stipulate the
performance, characteristics, and functions of the described products in the independent
state, and are not guarantees of the performance, characteristics, and functions of the
described products as mounted in the customer’s products or equipment. To verify symptoms
and states that cannot be evaluated in an independent device, the customer should always
evaluate and test devices mounted in the customer’s products or equipment.
In the event that any or all SINAI products(including technical data, services) described or
contained herein are controlled under any of applicable local export control laws and regulations,
such products must not be exported without obtaining the export license from the authorities
concerned in accordance with the above law.
This catalog provides information as of Oct. 2017. Specifications and information herein are
subject to change without notice.
17-1018-Rev 01
6
Document Number: 17019
For technical questions, contact: Tech@Sinai-power.com.
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. © COPYRIGHT Sinai-Power Technologies. ALL RIGHTS RESERVED.