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MHCD252012A-4R7M-A8S

MHCD252012A-4R7M-A8S

  • 厂商:

    CHILISIN(奇力新)

  • 封装:

    IND-2P_2.5X2MM_SM

  • 描述:

    功率电感 SMD

  • 详情介绍
  • 数据手册
  • 价格&库存
MHCD252012A-4R7M-A8S 数据手册
RoHS & Halogen Free & REACH Compliance. SPECIFICATION FOR APPROVAL Customer: : Customer P/N: Drawing No: : Quantity: : 0 Pcs. Date : 2020/07/09 MHCD252012A-4R7M-A8S Chilisin P/N: : SPECIFICATION ACCEPTED BY: COMPONENT ENGINEER ELECTRICAL ENGINEER MECHANICAL ENGINEER APPROVED REJECTED 奇力新電子股份有限公司 Chilisin Electronic sCorp No. 29, Alley 301, Tehhsin Rd., Hukou,Hsinchu 303, Taiwan TEL +886-3- 599-2646 FAX +886-3- 599-9176 E-mail sales@chilisin.com.tw http //www.chilisin.com.tw : : : : 奇力新電子( 奇力新電子(河南) 河南)有限公司 Chilisin Electronics (Henan) Co., Ltd. XiuWu Xian, industry gathering area JiaoZuo, Henan China Postal Code:454350 TEL:+86-391-717-0682 FAX:+86-391-717-0666 Drawn by 陳瑞揚 ryan.chen 東莞奇力新電子有限公司 Chilisin Electronics (Dongguan) Co., Ltd. No. 78, Puxing Rd., Yuliangwei Administration Area, Qingxi Town, Dongguan City, Guangdong,China TEL +86-769-8773-0251~3 FAX +86-769-8773-0232 E-mail cect@chilisin.com.tw : : : 奇力新電子( 奇力新電子(蘇州) 蘇州)有限公司 Chilisin Electronics (Suzhou) Co., Ltd. No.143,Song Shan Rd., Suzhou New District, Suzhou,China Postal Code:215129 TEL:+86-512-6841-2350 FAX:+86-512-6841-2356 E-mail suzhou@chilisin.com.tw : Checked by 邱明傑 Joseph.Chiu Approved by 陳瑞揚 ryan.chen YG15501143 MHCD252012A Series Specification 1 Scope: This specification applies to Alloy Molding power inductors 2 Part Numbering: 3 Rating: Operating Temperature: -40℃~125℃(Including self - temperature rise) Storage Temperature: -40℃~125℃(after PCB) -5℃~35℃,Humidity 45%~85%(before PCB) 4 Marking: 5 Standard Testing Condition Temperature Humidity Unless otherwise specified Ordinary Temperature(15 to 35 ) Ordinary Humidity(25 to 85% RH) ℃ In case of doubt 20±2 60 to 70 % RH ℃ MHCD252012A Series Specification 6 Configuration and Dimensions: 7 Electrical Characteristics: Inductance (uH ) Test Freq. Irms(A) Max.(Typ) Isat(A) Max.(Typ) RDC(mΩ) Max.(Typ) SRF (MHz)Min. MHCD252012A-R33M-A8S 0.33 2MHz,0.2V 4.0(4.6) 6.8(8.5) 35(27) 125 20 MHCD252012A-R47M-A8S 0.47 2MHz,0.2V 3.7(4.4) 6.2(7.8) 39(29) 91 20 MHCD252012A-R68M-A8S 0.68 2MHz,0.2V 3.3(3.7) 5.5(6.5) 46(40) 75 20 MHCD252012A-1R0M-A8S 1 2MHz,0.2V 3.0(3.5) 4.0(5.0) 59(45) 50 20 MHCD252012A-1R5M-A8S 1.5 2MHz,0.2V 2.5(2.7) 3.4(4.0) 70(62) 40 20 MHCD252012A-2R2M-A8S 2.2 2MHz,0.2V 2.0(2.3) 3.3(3.8) 115(102) 32 20 MHCD252012A-3R3M-A8S 3.3 2MHz,0.2V 1.8(2.1) 2.5(2.8) 158(143) 28 20 MHCD252012A-4R7M-A8S 4.7 2MHz,0.2V 1.7(2.1) 2.1(2.7) 240(200) 23 20 NOTE: -40℃~125℃(Including self - temperature rise) Part No. 1.Operating temperature range 2.Isat for Inductance drop 30% from its value without current. ℃ temprature rise from 25℃ ambient. ℃ ambient 3.Irms for a 40 4.All test data is referenced to 25 Tolerance (±%) MHCD252012A Series Specification 8 MHCD252012A Series 8.1 Construction: 8.2 Material List: MHCD252012A Series Specification 9 Reliability Of Molding power inductors 1-1.Mechanical Performance No Item Specification Test Method 1-1-1 Flexure Strength The forces applied on the right Test device shall be soldered on the substrate conditions must not damage Substrate Dimension: 100x40x1.6mm the terminal electrode and the Deflection: 2.0mm metal body Keeping Time: 30sec 1-1-2 Vibration Appearance:No damage (for Test device shall be soldered on the substrate microscope of CASTOR MZ-45 20X) Oscillation Frequency: 10 to 55 to 10Hz for 1min Amplitude: 1.5mm Time: 2hrs for each axis (X, Y & Z), total 6hrs 1-1-3 Resistance to Soldering Heat Appearance: No damage Pre-heating: 150 , 1min More than 75% of the terminal. Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free) electrode should be covered Solder Temperature: 260±5 with solder. Immersion Time: 10±1sec Inductance: within ±20% of initial value 1-1-4 Solder ability The electrodes shall be at Pre-heating: 150 , 1min least 95% covered with new Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free) solder coating Solder Temperature: 245±5 Immersion Time: 4±1sec Inductance change shall be within ±20% ℃ ℃ ℃ ℃ 1-1-5 Terminal Strength Test No split termination Chip F Test device shall be soldered on the substrate, then apply a force in the direction of the arrow. Force : 5N Keeping Time: 10±1sec Mounting Pad 1-2.Environmental Performance No Item 1-2-1 Temperature Cycle 1-2-2 Humidity Resistance 1-2-3 High Temperature Resistance 1-2-4 Low Temperature Resistance Specification Appearance: No damage Inductance:within±20% of initial value Test Method One cycle: Step Time (min) Temperature ( ) 1 -40±3 30 2 25±2 3 3 125±3 30 4 25±2 3 Total: 100cycles Measured after exposure in the room condition for 24hrs Temperature: 60±2 Relative Humidity: 90 ~ 95% / Time: 500hrs Measured after exposure in the room condition for 24hrs Temperature: 85±3 Relative Humidity: 0% / Time: 500hrs Measured after exposure in the room condition for 24hrs Temperature: -40±3 Relative Humidity: 0% / Time: 500hrs Measured after exposure in the room condition for 24hrs ℃ ℃ ℃ ℃ MHCD252012A Series Specification MHCD252012A Series Specification 10 Test Data for Pre-production Samples Chilisin P/N: MHCD252012A-4R7M-A8S Measured Item L0 (uH) Spec Customer 4.7±20% Suggest L1 (uH)Max. L0*0.7 RDC SRF (mΩ)Max. (MHz)Min. A m/m B m/m C m/m D m/m 240(200typ) 23 2.5±0.2 2.0±0.2 1.2 Max. 0.6±0.3 Test Freq. Isat=0A 2MHz 0.2V Isat=2.1A 2MHz 0.2V 1 4.23 3.18 196.1 30 2.62 2.16 1.14 0.52 2 4.17 3.03 221.4 28.8 2.64 2.14 1.14 0.54 3 4.19 3.22 190 30 2.62 2.16 1.13 0.52 4 4.31 3.17 227 26.6 2.62 2.14 1.13 0.52 5 4.41 3.43 192 27.7 2.64 2.16 1.14 0.52 X 4.262 3.206 205.3 28.62 2.628 2.152 1.136 0.524 R 0.24 0.4 37 3.4 0.02 0.02 0.01 0.02 6 7 8 9 10 11 12 13 14 15 Customer Sample Test Instrument L : Agilent E4991A/HP4287A+16197A RDC : CHEN HWA 502BC / HP4338B Isat : Agilent E4980A+HP42841A Irms : Agilent 6641 SYSTEM DC POWER SUPPLY Appearance and Dimensions: SPEC : Refer to Item 6 Test Method : Visual Inspection and Measured with Slide Calipers. Test Conditions: Unless Otherwise Specified Temperature Ordinary Temperature (15 to 35 ) Humidity Ordinary Humidity (25 to 85 %RH) ℃ ln Case of Doubt ℃ 20 ± 2 60 to 70 %RH MHCD252012A Series Specification 11 Packaging: 11.1 Packaging -Cover Tape The force for tearing off cover tape is 10 to 100 grams in the arrow direction. 11.2 Packaging Quantity 11.3 Reel Dimensions MHCD252012A Series Specification 11 Packaging: 11.4 Tape Dimensions in mm 12 Recommended Land Pattern: 13 Note: 1. Please make sure that your product has been evaluated and confirmed against your specifications when our product is mounted to your product. 2. Do not knock nor drop. 3. All the items and parameters in this product specification have been prescribed on the premise that our product is used for the purpose,under the condition and in the environment agreed upon between you and us. You are requested not to use our product deviating from such agreement. 4. Please keep the distance between transformer/coil and other components (refer to the standard IEC 950) 5.After manufacturing process, there might be slight irregular shape on the edge of the products, and it's a normal phenomenon that can be neglectable. MHCD252012A Series Specification 14 Graph:
MHCD252012A-4R7M-A8S
物料型号为ATMEGA16A-AU,是一款低功耗、高性能的8位AVR微控制器,采用TQFP44封装。


器件简介:ATMEGA16A-AU具有16KB的系统内可编程Flash存储器,1KB的EEPROM,512B的SRAM,32个通用I/O引脚,支持通过SPI、TWI和UART进行通信。


引脚分配:共有44个引脚,包括电源引脚、地引脚、复位引脚、I/O引脚、编程引脚等。


参数特性:最高工作频率为16MHz,工作电压范围1.8-5.5V,具有低功耗睡眠模式。


功能详解:支持多种中断源,具有定时器/计数器、模数转换器、模拟比较器、看门狗定时器等。


应用信息:适用于需要高性能处理能力的嵌入式系统,如工业控制、消费电子、通信设备等。


封装信息:采用44引脚的薄型四方扁平封装(TQFP)。
MHCD252012A-4R7M-A8S 价格&库存

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