CSCB2512D-2R2M-LRH

SPECIFICATION FOR APPROVAL ※This is a RoHS and REACH compliant product whose related documents are available on request. ※Graphic is only for dimensionally application. 1. Range of application: This specifications are applied to SMD Power Inductor,CSMB2512D. 2. Ordering code: Example: CSCB 2512 (1) (2) (1) Product Type (2) External dimensions (3) Solder Type (4) Inductance (5) Inductance tolerance (6) ROHS+HF D – XXX X-□□□ .(3) (5) (4) (6) 3. Mechanical Dimension: M1 M3 UNIT : mm DIM. M2 TOL. ±0.2 M1 2.5 M2 1.2 M3 2.0 MAX ±0.2 M4 0.5 ±0.2 M4 4. Recommended Land-Pattern: (Unit: mm) Rev.A P3 Prosperity Dielectrics Co., Ltd. SPECIFICATION FOR APPROVAL 5. Electrical Characteristics: Part Number. Nominal Inductance (uH) D.C. Resistance (Ω) Typ Current (mA) Reted Current (mA) Typ Max Inductance Tolerance Typ Measuring Frequency (MHz) Max Idc 1 Idc 2 Idc 1 Idc 2 CSCB2512D-R24N-LRH 0.24 ±30% 0.020 0.026 5200 3900 4750 3500 1 CSCB2512D-R47N-LRH 0.47 ±30% 0.035 0.042 4250 2900 3900 2600 1 CSCB2512D-R68N-LRH 0.68 ±30% 0.048 0.058 3550 2400 3150 2150 1 CSCB2512D-1R0M-LRH 1.0 ±20% 0.060 0.072 2600 2050 2350 1850 1 CSCB2512D-1R5M-LRH 1.5 ±20% 0.092 0.106 2250 1700 2050 1500 1 CSCB2512D-2R2M-LRH 2.2 ±20% 0.138 0.159 1950 1400 1800 1250 1 CSCB2512D-3R3M-LRH 3.3 ±20% 0.225 0.260 1600 1050 1400 970 1 CSCB2512D-4R7M-LRH 4.7 ±20% 0.330 0.380 1300 900 1150 800 1 Maximum rated voltage: DC25V *)The saturation current value (Idc1) is the maximum DC current value having inductance decrease down to 30% (at 20degC) *)The temperature rise current value (Idc2) is the maximum DC current value having temperature increase by 40degC. (at 20degC) *)The rated current value is following either Idc1 or Idc2. which is the lower one. ※Caution for Temperature Rise. Temperature rise of this inductor depends on the installed board condition. It shall be confirmed in the actual end product that. temperature rise of inductor is within operating temperature. 6. Structural Drawing: Rev.A P4 Prosperity Dielectrics Co., Ltd. SPECIFICATION FOR APPROVAL 7. Appearance Criteria for Chip-off Mode : Rev.A P5 Prosperity Dielectrics Co., Ltd. SPECIFICATION FOR APPROVAL 8. Reflow Profile Chart (Reference): *Temperature on surface of circuit board The products may be exposed to reflow soldering process of above profile up to two times. Rev.A P6 Prosperity Dielectrics Co., Ltd. SPECIFICATION FOR APPROVAL 9. Mechanical Performance /Environmental Test Performance Specifications: Test Item MECHANICAL CHARACTERISTICS Resistance to Flexure substrate Test method No damage. The test samples shall be soldered to the testing board and by reflow soldering conditions as show in Page5 Reflow Profile Chart. Apply pressure in the direction of the arrow until bent width reaches 2 mm. Substrate size:100*40*1.0 Substrate material:glass epoxy-resin Solder cream thickness :0.1 (Land size refer to recommended Land Pattern Dimensions of “Precaution:) Adhesion of Terminal Electrode No abnormality The test samples shall be soldered to the testing board and by reflow soldering conditions as shown Page5 Reflow Profile Chart. 10 N, 5 s Body strength Rev.A Standard No damage Applied force:10 N to X and Y directions Duration:5 s. Solder cream thickness:0.1mm (Land size refer to recommended Land Pattem Defined in “Precaution”) Applied force :10 N Duration :10 s P7 Prosperity Dielectrics Co., Ltd. SPECIFICATION FOR APPROVAL Test Item Standard Resistance to Inductance change. vibration Within±10% Test method The test samples shall be soldered to testing jip as shown in under table. Frequency range 10Hz~55Hz 1.5mm(Shall not exceed acceleration 196 Overall Amplitude m/S2) Sweeping Method 10 to 55 to 10 Hz for 1 min. 2 hours each in X,Y, and Z Time Direction. 3 time of reflow oven at 230 degC min for 40 sec max. With peak temperature at 260+0/-5 degC for 5 sec max. Substrate thickness. 1.0mm Substrate material:glass epoxy-resin No abnormality observed in appearance. Resistance to Soldering Inductance change. Within±10% No abnormality observed in appearance. Solder ability At least 90% of Terminal electrode is covered by new Solder.. Temperature Characteristics Thermal shock Low Temperature life Test Rev.A Inductance change. Within±15% No abnormality. Observed in appearance. Inductance change. Within±10% No abnormality observed in appearance. Inductance change. Within±10% No abnormality observed in appearance. The test samples shall be submerged molten solder as shown in under table. Flux. methanol solution with 25% of rosin or equivalent. { Pb free solder: Sn-3Ag-0.5Cu} Solder Temperature 245±deg C Time 5±0.5 s. Immersing Speed 25 mm/s Measurement shall be taken in a temperature range of -40 degC to +105 degC and the value at +20 degC was used as the standard value. The test samples shall be soldered to testing jip and by reflow soldering conditions as shown in Page5 Reflow Profile Chart. The test samples shall be left for the specified time at each of temperature in steps from 1 to 4. as shown in under table in sequence. The temperature cycles shall be repeated 100 cycled in the Method. Conditions for 1 cycle. Step 1 Temperature -40±3 deg C Time(min) 30±3 2 Room Temp Within 3 3 85±2 deg C 30±3 4 Room Temp Within 3 The test samples shall be soldered to testing jip and by reflow soldering conditions as shown in Page5 Reflow Profile Chart. And after that proceed the test as shown condition under table. Temperature -40±2 deg C Time 1000+24h P8 Prosperity Dielectrics Co., Ltd. SPECIFICATION FOR APPROVAL Test ltem Standard ENVIRONMENT TESTS Hihg Temperature life Test Damp heat life test Test method Inductance change. Within±10% No abnormality observed in appearance. The test samples shall be soldered to testing jip and by reflow soldering conditions as shown in Page5 Reflow Profile Chart. And after that proceed the test as shown condition under table. Inductance change. Within±10% No abnormality observed in appearance. The test samples shall be soldered to the testing jip and by reflow soldering conditions as shown in Page5 Reflow Profile Chart. The test samples shall be put in thermostatic oven set at temperature with humidity as shown in under table. Temperature 85±2 deg C Time 1000+24h Temperature Loading under Damp heat life test Inductance change. Within±10% No abnormality observed in appearance. Humidity 60±2 deg C 90~95%RH Time 1000+24 h The test samples shall be soldered to testing jip and by reflow soldering conditions as shown in Page5 Reflow Profile Chart. The test samples shall be put in thermostatic oven set at temperature with humidity , as shown in under table and with the rated current continuously applied. Temperature Humidity Applied current Time Standard measuring condition Rev.A 60±2 deg C 90~95%RH Refer to Table 1 1000+24 h Unless otherwise specified,at least 2 hrs of recovery under the room Temperature and normal humidity after the test. Followed by the measurement. Within-48 hrs P9 Prosperity Dielectrics Co., Ltd. SPECIFICATION FOR APPROVAL 10. Tape & Reel Packaging Dimensions: 10-1 Dimensions Unit: mm A0 B0 W F E P1 P2 P0 2.30 2.80 8.0 ±0.3 3.5 ±0.05 1.75 ±0.1 4.0 ±0.1 2.0 ±0.1 4.0 ±0.1 10-2 Direction of rolling Rev.A P10 Prosperity Dielectrics Co., Ltd. D0 Φ1.5 +0.1 -0 T K 0.3 ±0.05 1.45 MAX SPECIFICATION FOR APPROVAL 10-3 Reel 10-4 Top tape strength Peel-off strength: 0.2N~0.7N Peel-off angle:165°~180° Peel-off speed: 300mm/min Rev.A P11 Prosperity Dielectrics Co., Ltd. SPECIFICATION FOR APPROVAL 10-5 Dimensions of packing box (for Tape & Reel package) Rev.A P12 Prosperity Dielectrics Co., Ltd.