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TAI-TECH
Wire Wound Type Common Mode Filter
WCM2012F2SF-SERIES
ECN HISTORY LIST
REV
DATE
DESCRIPTION
APPROVED
CHECKED
DRAWN
1.0
13/05/29
新 發 行
楊祥忠
林志鴻
林宜蕰
楊祥忠
林志鴻
林宜蕰
1.修改第 2 項破損面積從 0.3 mm2 改為<5%
2.修改第 7 項可靠度
1.1
15/01/07
3.修改 8-2.2Reflow Soldering 圖
4.修改第 9 項 Application Notice:Storage Conditions
加入 component level
備
註
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TAI-TECH
Wire Wound Type Common Mode Filter
WCM2012F2SF-SERIES
1.Features
Halogen
Pb
Halogen-free
Pb-free
1. High common mode impedance at high frequency cause excellent noise
suppression performance.
2. WCM2012F2SF series realizes small size and low profile. 2.0x1.2x1.2 mm.
3. 100% Lead(Pb) & Halogen-Free and RoHS compliant.
2.Dimension
C
A
當破損面積<5%,產品列入允收品範圍
E
W
B
產品破損寬度
A(mm)
B(mm)
C(mm)
D1(mm)
D2(mm)
E(mm)
2012F2SF
2.0±0.2
1.2±0.2
1.2±0.2
0.55±0.1
0.46±0.1
0.15±0.1
D
D
Series
3.Part Numbering
WCM 2012
A
B
F
2
S
F
C
D
E
F
-
900
T
04
G
H
I
A: Series
B: Dimension
C: Material
Ferrite Core
D: Number of Lines
2=2 lines
E: Type
S=Shielded , N=Unshielded
F: Lead free
G: Impedance
900=90Ω
H: Packaging
I: Rated Current
T=Taping and Reel
04=400mA
4.Specification
TAI-TECH
Part Number
DC
Common mode Test Frequency
Impedance
Resistance
(MHz)
(Ω)
(Ω) max.
Rated Current
(mA)max.
Withstand
Rated Volt.
IR
Volt. (Vdc) (Ω) min.
(Vdc)max.
max.
WCM2012F2SF-670T04
67±25%
100
0.25
400
50
125
10M
WCM2012F2SF-900T04
90±25%
100
0.30
400
50
125
10M
WCM2012F2SF-121T04
120±25%
100
0.30
400
50
125
10M
WCM2012F2SF-161T03
160±25%
100
0.35
350
50
125
10M
WCM2012F2SF-181T03
180±25%
100
0.35
350
50
125
10M
WCM2012F2SF-201T03
200±25%
100
0.40
300
50
125
10M
WCM2012F2SF-221T03
220±25%
100
0.40
300
50
125
10M
WCM2012F2SF-261T03
260±25%
100
0.40
300
50
125
10M
WCM2012F2SF-361T03
360±25%
100
0.50
300
50
125
10M
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TAI-TECH
Typical Impedance v.s. Frequency Curve
WCM2012F2SF-900
WCM2012F2SF-670
1000
Common Mode
100
IMPEDANCE(Ohm)
IMPEDANCE(Ohm)
1000
10
Normal Mode
1
0.1
Common Mode
100
10
Normal Mode
1
0.1
1
10
100
1000
10000
1
10
100
FREQUENCY(MHz)
WCM2012F2SF-121
Common Mode
10
Normal Mode
1
Common Mode
100
10
Normal Mode
1
0.1
0.1
1
10
100
1000
1
10000
10
FREQUENCY(MHz)
WCM2012F2SF-181
IMPEDANCE(Ohm)
IMPEDANCE(Ohm)
Common Mode
10
Normal Mode
1
1000
10000
WCM2012F2SF-201
1000
100
100
FREQUENCY(MHz)
1000
Common Mode
100
10
Normal Mode
1
0.1
0.1
1
10
100
1000
1
10000
10
FREQUENCY(MHz)
WCM2012F2SF-221
IMPEDANCE(Ohm)
Common Mode
10
Normal Mode
1
1000
10000
WCM2012F2SF-261
1000
100
100
FREQUENCY(MHz)
1000
IMPEDANCE(Ohm)
10000
WCM2012F2SF-161
1000
IMPEDANCE(Ohm)
IMPEDANCE(Ohm)
1000
100
1000
FREQUENCY(MHz)
Common Mode
100
10
Normal Mode
1
0.1
0.1
1
10
100
1000
10000
1
FREQUENCY(MHz)
10
100
FREQUENCY(MHz)
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1000
10000
P4
TAI-TECH
WCM2012F2SF-361
10000
IMPEDANCE(Ohm)
1000
Common Mode
100
10
Normal Mode
1
0.1
1
10
100
1000
10000
FREQUENCY(MHz)
5.Schematic Diagram
6. Materials
No.
Description
Specification
a.
Upper Plate
Ferrite
b.
Core
Ferrite Core
c
Termination
Tin (Pb Free)
d
Wire
Enameled Copper Wire
7.Reliability and Test Condition
Item
Performance
Test Condition
Electrical Characteristics Test
Agilent-4291A+ Agilent -16197A
Z(common mode)
DCR
Refer to standard electrical characteristics list.
Agilent-4338B
Agilent4339
I.R.
Operating Temperature
-40℃~+125℃
Storage Temperature(on board)
Temperature Rise Test
Rated Current < 1A
ΔT 20℃Max
Rated Current ≧ 1A ΔT 40℃Max
1.Applied the allowed DC current.
2.Temperature measured by digital surface
thermometer
Mechanical Performance Test
Solderability Test
More than 95% of terminal electrode should be covered with solder.
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Preheat: 150℃,60sec.。
Solder: Sn99.5%-Cu0. 5%。
Temperature: 245±5℃。
Flux for lead free: Rosin. 9.5%。
Dip time: 4±1sec。
Depth: completely cover the termination
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TAI-TECH
Item
Performance
Test Condition
Temperature
(°C)
Time
(s)
Temperature
ramp/immersion
and emersion rate
Number
of heat
cycles
260 ±5
(solder temp)
10 ±1
25mm/s ±6 mm/s
1
Solder Heat Resistance
Depth: completely cover the termination
Appearance:No damage.
Impedance:within±15% of initial value
RDC:within ±15% of initial value and shall not exceed the specification value
Preconditioning:Run through IR reflow for 2 times.( IPC/JEDEC
J-STD-020DClassification Reflow Profiles
With the component mounted on a PCB with the device to be tested,
apply a force (>0805:1kg ,
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