SDWL1005C2N9SSTFM01

Sunlord Categories: general confidential Wire Wound Chip Ceramic Inductor Page 1 of 16 S P E C I F I C AT I O N S Customer Product Name Wire Wound Chip Ceramic Inductor Sunlord Part Number SDWL1005C STFM Customer Part Number [ New Released, Revised] SPEC No.:SDWL07160000 This SPEC is total 16 pages including specifications and appendix. ROHS Compliant Parts Approved By Checked By Issued By Shenzhen Sunlord Electronics Co., Ltd. Address: Sunlord Industrial Park, Dafuyuan Industrial Zone, Baoan, Shenzhen, China 518110 Tel: 0086-755-29832660 Fax: 0086-755-82269029 E-Mail: sunlord@sunlordinc.com For Customer approval Only Qualification Status: Full Approved By Comments: Verified By Date: Restricted Rejected Re-checked By Checked By Sunlord Categories: general confidential Wire Wound Chip Ceramic Inductor Page 2 of 16 Version change history Rev. Effective Date 01 / Changed Contents New release Change reasons / Approved By Jingxin Huang Sunlord Categories: general confidential Wire Wound Chip Ceramic Inductor Page 3 of 16 Precautions 1. Magnetic materials shall be far away from parts to avoid impacts on their electrical characteristics. 2. Parts could be damaged by external mechanical pressure or stacked heavy objects, as well as strong shaking & dropping. 3. Please do not store parts in bulk to prevent coils and parts being damaged. 4. Oversized external force to parts on PCB may lead to parts being damaged or slipped off. 5. Please do not use parts on edge or top of PCB board in your design to avoid parts being damaged during PCB is moved. 6. Please use flux contained with resin since the highly acidic (Chlorine content more than 0.2 wt%) or water-soluble one could damage the insulation film of wires, then causing short circuit of parts. 7. Please do not use the brush to clean product or its surroundings. If you use the brush to clean product or its surroundings on PCB,copper wire may be broke, causing the product open . Sunlord Categories: general confidential Wire Wound Chip Ceramic Inductor Page 4 of 16 Caution All products listed in this specification are developed, designed and intended for use in general electronics equipment. The products are not designed or warranted to meet the requirements of the applications listed below, whose performance and/or quality require especially high reliability, or whose failure, malfunction or trouble might directly cause damage to society, person, or property. Please understand that we are not responsible for any damage or liability caused by use of the products in any of the applications below. Please contact us for more details if you intend to use our products in the following applications. 1. Aircraft equipment 2. Aerospace equipment 3. Undersea equipment 4. nuclear control equipment 5. military equipment 6. Power plant equipment 7. Medical equipment 8. Transportation equipment (automobiles, trains, ships,etc.) 9. Traffic signal equipment 10. Disaster prevention / crime prevention equipment 11. Data-processing equipment 12. Applications of similar complexity or with reliability requirements comparable to the applications listed in the above Sunlord 1. Categories: general confidential STFM This specification applies to the SDWL1005C 2. Wire Wound Chip Ceramic Inductor Page 5 of 16 Scope series of Wire Wound Chip Ceramic Inductor. Product Description and Identification (Part Number) 1) Description Wire Wound Chip Ceramic Inductor, 1005, XXX nH± X% @XXXMHz, XXXΩ, XXX mA 2) Product Identification (Part Number) SDWL 1005 C S T F M External Dimensions [L X W] (mm) Type 1005 Wire Wound Chip Inductor SDWL Nominal Inductance (nH) Material Code C 1.0 X 0.5 Ceramic Inductance Tolerance B ±0.1nH C ±0.2nH D ±0.5nH G ±2% H ±3% J ±5% Example Nominal Value 1N0 1.0 10N 10 R10 100 Product Classification Code Sn Plating S Five-faces Coating HSF Products Hazardous Substance Free Products Packing 3. B Bulk Package T Tape & Reel Internal Code M01 Normal M11 High Q & Low DCR Electrical Characteristics Please refer to Appendix A. 4. 1) Operating and storage temperature range (individual chip without packing): -40 2) Storage temperature range (packaging conditions): -10 ~+40 to +125 and RH 70% (Max.) Shape and Dimensions 1) Dimensions: See the following. Unit: mm 2) A B C D REF. E F H REF. I REF. J REF. 1.1±0.1 0.6±0.1 0.6±0.1 0.20 0.5±0.1 0.2±0.1 0.65 0.35 0.50 Electrode Coplanarity:0.1mm Max. Sunlord 3) Categories: general confidential Wire Wound Chip Ceramic Inductor Page 6 of 16 Structure: See the following. No. Components Material A Coating Ultraviolet epoxy resin B Core Ceramic C Wire Polyurethane system enameled copper wire D Electrodes Mo-Mn with Ni and Sn plating 5. Test and Measurement Procedures 5.1 Test Conditions Unless otherwise specified, the standard atmospheric conditions for measurement/test as: a. Ambient Temperature: 20±15 b. Relative Humidity: 65%±20% c. Air Pressure: 86KPa to 106KPa If any doubt on the results, measurements/tests should be made within the following limits: a. Ambient Temperature: 20±2 b. Relative Humidity: 65%±5% c. Air Pressure: 86KPa to 106KPa 5.2 Visual Examination a. Inspection Equipment: 30 X magnifier 5.3 Electrical Test 5.3.1 DC Resistance (DCR) a. Refer to Item 3. b. Test equipment: Agilent34420A or equivalent 5.3.2 Inductance (L) a. Refer to Item 3. b. Test equipment: Agilent 4287A+Agilent 16197A or equivalent c. Test signal: -13dBm or 10mA d. Test frequency refers to Item 3. 5.3.3 Q Factor (Q) a. Refer to Item 4. b. Test equipment: Agilent 4287A+Agilent 16197A or equivalent c. Test signal: -13dBm or 10mA d. Test frequency refers to Item 3. 5.3.4 Self-Resonant Frequency (SRF) a. Refer to Item 3. b. Test equipment: Agilent E4991A+Agilent 16197A and HP 8753E or equivalent. c. Test signal: -20dBm or 50 mV 5.3.5 Rated Current a. Refer to Item 3. b. Test equipment (see Fig.5.3.5-1): Electric Power, Electric current meter, Thermometer. c. Measurement method (see Fig. 5.3.5-1): 1. d. Set test current to be 0mA. 2. Measure initial temperature of chip surface. 3. Gradually increase voltage and measure chip temperature for corresponding current. Definition of Rated Current (Ir): Ir is direct electric current as chip surface temperature rose just 20 against chip initial surface temperature (Ta) (see Fig. 5.3.5-2). Ta+20 Ta 0 Rated current Fig.5.3.5-1 Fig. 5.3.5-2 Ir (mA) Sunlord Categories: general confidential Wire Wound Chip Ceramic Inductor Page 7 of 16 5.4 Reliability Test Items Requirements Test Methods and Remarks 5.4.1 No removal or split of the termination or other Solder the inductor to the testing jig (glass Terminal defects shall occur. epoxy board) using eutectic solder. Then apply a force Strength in the direction of the arrow. 4N force. Keep time: 10±1s Speed: 1.0 mm/s. 5.4.2 Solder the inductor to the test jig. Using a eutectic No visible mechanical damage. Resistance to solder. Then apply a force in the direction shown as 20 Flexure Unit: mm 10 left. Flexure: 2mm R10 Pressurizing Speed: 0.5mm/sec. Keep time: 5 sec. 45 45 Flexure 5.4.3 No visible mechanical damage. Solder the inductor to the testing jig (glass epoxy Vibration Inductance change: within ±5% board) using eutectic solder. Q factor change: within ±20% The inductor shall be subjected to a simple harmonic motion having total amplitude of 1.5mm, the frequency Cu pad Solder mask being varied uniformly between the approximate limits of 10 and 55 Hz. The frequency range from 10 to 55 Hz and return to 10 Hz shall be traversed in approximately 1 minute. This motion shall be applied for a period of 2 hours in each 3 mutually perpendicular directions (total of 6 hours) Glass Epoxy Board 5.4.4 No visible mechanical damage. Drop chip inductor 10 times on a concrete floor from a height Dropping Inductance change: within ±5% of 100 cm. Q factor change: within ±20% 5.4.5 +50±100ppm/ Between -40 Temperature and +125 with a reference value of +20 coefficient 5.4.6 90% or more of electrode area shall be Electrode of the coil shall be immersed in flux for 5 to Solderability Coated by new solder. 10 Seconds. The coil shall be immersed in solder bath at a temperature of 240±5 , Duration for 3±0.5 seconds. Solder: Sn/3.0Ag/0.5Cu Flux: 25% Resin and 75% ethanol in weight. 5.4.7 No visible mechanical damage. Resistance to Inductance change: within ±5% Soldering Heat Q factor change: within ±20% Re-flowing Profile: Max: 260 260 200 240 190 150 /10sec 90 30sec. 20~40sec. Sunlord Categories: general confidential Wire Wound Chip Ceramic Inductor Page 8 of 16 5.4.8 No visible mechanical damage. Thermal Shock Inductance change: within ±5% -40 Q factor change: within ±20% Transforming interval: 20 sec. (max.) Temperature, Time: for 30±3 min →+125 for 30±3min Tested cycle: 100 cycles The chip shall be stabilized at normal condition for 1~2 hours before measuring. +125 30 min. 30 min. Ambient Temperature -40 30 min. 20s (max.) 5.4.9 No visible mechanical damage. Temperature: -40±2 Resistance to Inductance change: within ±5% Duration: 1000 Low Q factor change: within ±20% The chip shall be stabilized at normal condition for 1~2 +24 hours hours before measuring. Temperature 5.4.10 No mechanical damage. Temperature: 125±2 Resistance to Inductance change: within ±5% Duration: 1000 High Q factor change: within ±20% The chip shall be stabilized at normal condition for 1~2 +24 hours hours before measuring. Temperature 5.4.11 No mechanical damage. Temperature: 60±2 Damp Heat Inductance change: within ±5% Duration:1000 (Steady States) Q factor change: within ±20% The chip shall be stabilized at normal condition for 1~2 +24 , Humidity: 90% to 95% RH hours hours before measuring. 5.4.12 No mechanical damage. Temperature: 60±2 Loading Under Inductance change: within ±5% Duration: 1000 Damp Heat Q factor change: within ±20% Applied current: Rated current. +24 , Humidity: 90% to 95% RH hours The chip shall be stabilized at normal condition for 1~2 hours before measuring. 5.4.13 No mechanical damage. Temperature: 125±2 Loading at High Inductance change: within ±5% Duration: 1000 Temperature Q factor change: within ±20% Applied current: Rated current. +24 hours The chip shall be stabilized at normal condition for 1~2 (Life Test) hours before measuring. 6. Packaging and Storage 6.1 Packaging There are two types of packaging for the chip inductors. Please specify the packing code when ordering. 6.1.1 Bulk Packaging: Packaging code: B, The quantity of each bag is integral multiple of 1000. Remark: The actual quantity in a package may change sometimes. 6.1.2 Tape Carrier Packaging: Packaging code: T i. Tape carrier packaging are specified in attached figure Fig.6.1-1~4 ii. Tape carrier packaging quantity please see the following table: Type 1005 Tape Paper Tape Quantity Standard 10K Minimum 5K Sunlord Categories: general confidential Wire Wound Chip Ceramic Inductor Page 9 of 16 (1) Taping Drawings (Unit: mm) Punched Tape Top Tape Paper Tape Sprocket Hole Chip Cavity Fig. 6.1-1 Remark: The sprocket holes are to the right as the tape is pulled toward the user. B A T 8.0±0.3 2.0±0.1 4.0±0.1 3.5±0.1 Φ1.5(+0.1/-0) 1.75±0.1 (2) Taping Dimensions (Unit: mm) P K Fig. 6.1-2 Type A B P K T 1005 0.75±0.05 1.32±0.05 2.0±0.1 0.75±0.05 0.8±0.1 (3) Leader and blank portion Fig. 6.1-3 (4) Reel Dimensions (Unit: mm) 10.±1.5 3.0±0.1 Fig. 6.1-4 (5) Peeling off force: 10gf to 70gf in the direction show below. 178±2 5.0±0.1 58±2 4.0±0.1 13.5±0.2 2.45±0.2 Sunlord Categories: general confidential Wire Wound Chip Ceramic Inductor Page 10 of 16 Top tape or cover tape 165 ~ 180 Fig. 6.1-5 Base tape 6.2 Storage a. The solderability of the external electrode may be deteriorated if packages are stored where they are exposed to high humidity. Package must be stored at 40 or less and 70% RH or less. b. The solderability of the external electrode may be deteriorated if packages are stored where they are exposed to dust of harmful gas c. Packaging material may be deformed if package are stored where they are exposed to heat of direct sunlight. (e.g. HCl, sulfurous gas of H2S) d. Minimum packages, such as polyvinyl heat-seal packages shall not be opened until they are used. If opened, use the reels as soon as possible. e. Solderability shall be guaranteed for 12 months from the date of delivery on condition that they are stored at the environment specified in specification. For those parts, which passed more than 12 months shall be checked solder-ability before use. 7. Warning and Attentions 7.1 Precautions on Use a. Always wear static control bands to protect against ESD. b. Any devices used (soldering iron, measuring instruments) should be properly grounded. c. Use non-magnetic tweezers when handing the chips. d. Pre-heating when soldering, and refer to the recommended condition specified in specification. e. Don’t apply current in excess of the rated current value. It may cause damage to components due to over-current. f. Keep clear of anything that may generate magnetic fields such as speakers, coils. g. When soldering, the electrical characteristics may be varied due to hot energy and mechanical stress. h. When coating products with resin, the relatively high resin curing stress may change the electrical characteristics. For exterior coating, select resin carefully so that electrical and mechanical performance of the product is not affected. Before using, please evaluate reliability with the product mounted in your application set. i. When mount chips with adhesive in preliminary assembly, do appropriate check before the soldering stage, i.e., the size of land j. Mounting density: Add special attention to radiating heat of products when mounting other components nearby. The excessive heat k. Since some products are constructed like an open magnetic circuit, narrow spacing between components may cause magnetic l. Please do not give the product any excessive mechanical shocks in transportation. m. Please do not touch wires by sharp terminals such as tweezers to avoid causing any damage to wires. n. Please do not add any shock and power to the soldered product to avoid causing any damage to chip body. pattern, type of adhesive, amount applied, hardening of the adhesive on proper usage and amounts of adhesive to use. by other products may cause deterioration at joint of this product with substrate. coupling. o. Please do not touch the electrodes by naked hand as the solderability of the external electrodes may deteriorate by grease or oil on the skin. 7.2 PCB Bending Design The following shall be considered when designing and laying out PCB’s. a. PCB shall be designed so that products are not subjected to the mechanical stress from board warp or deflection. Products shall be located in the sideways direction to the (Poor example) b. (Good example) mechanical stress. Products location on PCB separation. C Separation B Product shall be located carefully because they may be subjected to the mechanical stress in order of A>C=B>D. A c. D When splitting the PCB board, or insert (remove) connector, or fasten thread after mounting components, care is required so as not Sunlord Categories: general confidential Wire Wound Chip Ceramic Inductor Page 11 of 16 to give any stress of deflection or twisting to the board. Because mechanical force may cause deterioration of the bonding strength of electrode and solder, even crack of product body. Board separation should not be done manually, but by using appropriate devices. 7.3 Recommended PCB Design for SMT Land-Patterns When chips are mounted on a PCB, the amount of solder used (size of fillet) and the size of PCB Land-Patterns can directly affect chip performance (such as Q). And they can also cause other soldering question (such as offset and side lap). Therefore, the following items must be carefully considered in the design of solder land patterns. a. b. Please use the PCB pad and solder paste we recommend, and contact us in advance if they need to be changed. Please use flux contained with resin since the highly acidic (Chlorine content more than 0.2 wt%) or water-soluble one could damage the insulation film of wires, then causing short circuit of parts. c. The amount of solder applied can affect the ability of chips to withstand mechanical stresses which may lead to breaking or cracking. Therefore, when designing land-patterns it is necessary to consider the appropriate size and configuration of the solder pads which in turn determines the amount of solder necessary to form the fillets. d. When more than one part is jointly soldered onto the same land or pad, the pad must be designed that each component’s soldering point is separated by solder-resist. Recommended land dimensions please refer to product specification. 8. Recommended Soldering Technologies This product is only for reflow soldering and iron soldering. Peak 260 max 260 8.1 Re-flowing Profile Preheat condition: 150~200 /60~120sec. Allowed time above 217C: 60~90sec. Max temp: 260 217 Max time at max temp: 10sec. Solder paste: Sn/3.0Ag/0.5Cu 200 Allowed Reflow time: 2 times max. 150 Max Ramp Up Rate=3 /sec. Max Ramp Down Rate =6 /sec. 60 90sec. 60 120sec. 25 Time 25 to Peak= 8 min Max [Note: The reflow profile in the above table is only for qualification and is not meant to specify board assembly profiles. Actual board assembly profiles must be based on the customer's specific board design, solder paste and process, and should not exceed the parameters as the Reflow profile shows.] 8.2 Iron Soldering Profile Iron soldering power: 30W Max. Preheat condition: 150 3sec. Max. /60sec. Soldering tip temperature: 350 Max. Soldering time: 3sec. Max. 350 Solder paste: Sn/3.0Ag/0.5Cu Soldering Iron Power Max.30W Iron Soldering time: 1 time max. Diameter of Soldering Iron 1.0mm max. Tc [Note: Take care not to apply the tip of the soldering iron to the terminal electrodes.] 8.3 Maintenance of heat gun (for your reference) Power output: 30W Temperature: 350 Max Heat time: More than 5 seconds heating may cause short circuit of parts. 9. Solder Volume Solder shall be used not to exceed as shown below. a. Accordingly increasing the solder volume, the mechanical stress to chip is also increased.Exceeding solder volume may cause the Sunlord Categories: general confidential Wire Wound Chip Ceramic Inductor Page 12 of 16 failure of mechanical or electrical performance. b. Before soldering, please ensure that the solder should not adhere to the wire part of chip. c. Please pay particular attention to whether there is flux remaining on surface of the wire part of chip after subjected to reflow soldering since this may causing short circuit of parts. 10. Cleaning Products shall be cleaned on the following conditions: a. Cleaning temperature shall be limited to 60 b. Ultrasonic cleaning shall comply with the following conditions, avoiding the resonance phenomenon at the mounted products and Max. (40 Max. for fluoride and alcohol type cleaner.) PCB. Power: 20W/l Max. Frequency: 28 KHz to 40 KHz Time: 5 minutes Max c. Cleaner i. Alternative cleaner z Isopropyl alcohol (IPA) z HCFC-225 ii. Aqueous agent z Surface Active Agent Type (Clean through-750H) z Hydrocarbon Type (Techno Cleaner-335) z Higher Alcohol Type (Pine Alpha ST-100S) z Alkali saponifier Type ( Aqua Cleaner 240) Alkali saponification shall be diluted to 20% volume with de-ionized water. Please contact our technical service department before using other cleaner. d. There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent, product shall be dried completely after rinse with de-ionized water in order to remove the cleaner. e. Some products may become slightly whitened. However, product performance or usage is not affected. f. Please take care of winding part while cleaning. g. After cleaning, parts could be subjected to the next reflow soldering till the solvent remaining on surface of parts being volatilized. 11. Others a. We will not inform you of the improvement on specification of parts in advance. b. We will not inform you of the change on specification of parts during design in advance. c. Please contact us for the date to realize mass production of parts being designed. 12. Supplier Information a. Supplier: Shenzhen Sunlord Electronics Co., Ltd. b. Manufacturer: c. Manufacturing Address: Shenzhen Sunlord Electronics Co., Ltd. Sunlord Industrial Park, Dafuyuan Industrial Zone, Guanlan, Shenzhen, China Zip: 518110 13. Measuring Method of Inductance a. Residual elements and stray elements of test fixture can be described by F-parameter as shown in the following: ⎡V1 ⎤ ⎡ A B ⎤ ⎡V2 ⎤ ⎢ I ⎥ = ⎢C D ⎥ ⎢ I ⎥ ⎦⎣ 2 ⎦ ⎣ 1⎦ ⎣ ⎡V1 ⎤ ⎡ AV2 + BI 2 ⎤ ⎢ I ⎥ = ⎢CV + DI ⎥ 2⎦ ⎣ 1⎦ ⎣ 2 Measured open impedance: Zom = A C Measured short impedance: Zsm = B ≈ − Zsc (when uses short chip to short) D Sunlord Categories: general confidential Measured short ship impedance: Measured value: Wire Wound Chip Ceramic Inductor Zsc Zxm=V1/I1 Impedance of DUT: Zx=V2/I2 b. The relation between Zx and Zom, Zsm, Zxm is shown in the following: V1 B B − Zxm − V2 D I1 D D D Zxm − Zsm D Zx = = * = * = * V C C I2 A A A 1 − Zxm / Zom 1 − Zxm * 1− 1 * A I1 A c. Lx should be calculated with the following equation: Lx = Lxm Lsc Im(Zx) Im(Zxm + Zsc) Im(Zxm) Im(Zsc) = = + = Lxm + Lsc 2πf 2πf 2πf 2πf measured chip inductor inductance measured short chip inductance Lx Inductance of chip inductor d. Compensation Value Lsc of short chip Series Compensation Value SDWL1005C-M 0.68nH Page 13 of 16 Sunlord Categories: general confidential Wire Wound Chip Ceramic Inductor Page 14 of 16 Appendix A: Electrical Characteristics STFM I. SDWL1005C Series STFM01 Series 1) SDWL1005C Min. Part Number Inductance Tolerance Quality Factor Units nH Symbol - L/Q Test Max. DC Max. Rated Freq. Resistance Current MHz Ω mA Min. Selfresonant Frequency MHz L - Q Freq. DCR Ir S.R.F SDWL1005C1N5 STFM01 1.5 B, C, D 10 100/250 0.03 1000 > 6000 SDWL1005C1N6 STFM01 1.6 C, D 10 100/250 0.07 750 > 6000 SDWL1005C1N7 STFM01 1.7 C, D 10 100/250 0.10 640 > 6000 SDWL1005C1N8 STFM01 1.8 C, D 10 100/250 0.16 460 > 6000 SDWL1005C2N4 STFM01 2.4 B, C, D 20 100/250 0.05 850 > 6000 SDWL1005C2N5 STFM01 2.5 B, C, D 20 100/250 0.05 850 > 6000 SDWL1005C2N6 STFM01 2.6 B, C, D 20 100/250 0.05 850 > 6000 SDWL1005C2N7 STFM01 2.7 B, C, D 20 100/250 0.05 850 > 6000 SDWL1005C2N8 STFM01 2.8 B, C, D 20 100/250 0.05 850 > 6000 SDWL1005C2N9 STFM01 2.9 B, C, D 20 100/250 0.07 750 > 6000 SDWL1005C3N0 STFM01 3.0 B, C, D 20 100/250 0.07 750 > 6000 SDWL1005C3N1 STFM01 3.1 B, C, D 20 100/250 0.13 570 > 6000 SDWL1005C3N2 STFM01 3.2 B, C, D 15 100/250 0.17 500 > 6000 SDWL1005C3N9 STFM01 3.9 C, D 25 100/250 0.07 750 > 6000 SDWL1005C4N1 STFM01 4.1 B, C, D 25 100/250 0.07 750 > 6000 SDWL1005C4N3 STFM01 4.3 B, C, D 25 100/250 0.07 750 > 6000 SDWL1005C4N4 STFM01 4.4 B, C, D 25 100/250 0.07 750 > 6000 SDWL1005C4N5 STFM01 4.5 B, C, D 25 100/250 0.07 750 > 6000 SDWL1005C4N6 STFM01 4.6 B, C, D 25 100/250 0.07 750 > 6000 SDWL1005C4N7 STFM01 4.7 B, C, D 25 100/250 0.07 750 > 6000 SDWL1005C4N8 STFM01 4.8 B, C, D 25 100/250 0.07 750 > 6000 SDWL1005C4N9 STFM01 4.9 B, C, D 25 100/250 0.12 600 > 6000 SDWL1005C5N0 STFM01 5.0 B, C, D 25 100/250 0.12 600 > 6000 SDWL1005C5N1 STFM01 5.1 B, C, D 25 100/250 0.12 600 > 6000 SDWL1005C5N8 STFM01 5.8 B, C, D 25 100/250 0.12 700 > 6000 SDWL1005C6N2 STFM01 6.2 B, C, D 25 100/250 0.09 700 > 6000 SDWL1005C6N3 STFM01 6.3 B, C, D 25 100/250 0.09 700 6000 SDWL1005C6N4 STFM01 6.4 B, C, D 25 100/250 0.09 700 6000 SDWL1005C6N5 STFM01 6.5 B, C, D 25 100/250 0.09 700 6000 SDWL1005C6N6 STFM01 6.6 B, C, D 25 100/250 0.09 700 6000 SDWL1005C6N7 STFM01 6.7 B, C, D 25 100/250 0.09 700 6000 SDWL1005C6N8 STFM01 6.8 G, H, J 25 100/250 0.09 700 6000 SDWL1005C6N9 STFM01 6.9 G, H, J 25 100/250 0.13 570 6000 SDWL1005C7N0 STFM01 7.0 G, H, J 25 100/250 0.13 570 6000 SDWL1005C7N1 STFM01 7.1 G, H, J 25 100/250 0.13 570 6000 SDWL1005C7N2 STFM01 7.2 G, H, J 25 100/250 0.13 570 6000 SDWL1005C7N3 STFM01 7.3 G, H, J 25 100/250 0.13 570 6000 SDWL1005C7N5 STFM01 7.5 G, H, J 25 100/250 0.13 570 6000 SDWL1005C8N2 STFM01 8.2 G, H, J 25 100/250 0.14 540 5500 SDWL1005C8N6 STFM01 8.6 G, H, J 25 100/250 0.14 540 5500 SDWL1005C8N7 STFM01 8.7 G, H, J 25 100/250 0.14 540 5500 SDWL1005C8N8 STFM01 8.8 G, H, J 25 100/250 0.14 540 5500 SDWL1005C8N9 STFM01 8.9 G, H, J 25 100/250 0.14 540 5500 SDWL1005C9N0 STFM01 9.0 G, H, J 25 100/250 0.14 540 5500 SDWL1005C9N1 STFM01 9.1 G, H, J 25 100/250 0.14 540 5500 SDWL1005C9N2 STFM01 9.2 G, H, J 25 100/250 0.14 540 5500 SDWL1005C9N3 STFM01 9.3 G, H, J 25 100/250 0.14 540 5500 SDWL1005C9N4 STFM01 9.4 G, H, J 25 100/250 0.14 540 5500 SDWL1005C9N5 STFM01 9.5 G, H, J 25 100/250 0.14 540 5500 SDWL1005C9N6 STFM01 9.6 G, H, J 25 100/250 0.14 540 5500 SDWL1005C9N7 STFM01 9.7 G, H, J 25 100/250 0.14 540 5500 SDWL1005C9N8 STFM01 9.8 G, H, J 25 100/250 0.14 540 5500 SDWL1005C9N9 STFM01 9.9 G, H, J 25 100/250 0.14 540 5500 Sunlord Categories: general confidential Wire Wound Chip Ceramic Inductor Min. Part Number Inductance Tolerance Quality Factor Units nH Symbol - Page 15 of 16 Min. Self- L/Q Test Max. DC Max. Rated Freq. Resistance Current MHz Ω mA MHz S.R.F resonant Frequency L - Q Freq. DCR Ir SDWL1005C10N STFM01 10 G, H, J 25 100/250 0.17 500 5500 SDWL1005C11N STFM01 11 G, H, J 30 100/250 0.14 500 5500 SDWL1005C12N STFM01 12 G, H, J 30 100/250 0.14 500 5500 SDWL1005C13N STFM01 13 G, H, J 25 100/250 0.21 430 5000 SDWL1005C15N STFM01 15 G, H, J 30 100/250 0.16 460 5000 SDWL1005C16N STFM01 16 G, H, J 25 100/250 0.24 370 4500 SDWL1005C18N STFM01 18 G, H, J 25 100/250 0.27 370 4500 SDWL1005C19N STFM01 19 G, H, J 25 100/250 0.27 370 4500 SDWL1005C20N STFM01 20 G, H, J 25 100/250 0.27 370 4000 SDWL1005C22N STFM01 22 G, H, J 25 100/250 0.30 310 4000 SDWL1005C23N STFM01 23 G, H, J 25 100/250 0.30 310 3800 SDWL1005C24N STFM01 24 G, H, J 25 100/250 0.52 280 3500 SDWL1005C27N STFM01 27 G, H, J 25 100/250 0.52 280 3500 SDWL1005C30N STFM01 30 G, H, J 25 100/250 0.58 270 3300 SDWL1005C33N STFM01 33 G, H, J 25 100/250 0.63 260 3200 SDWL1005C36N STFM01 36 G, H, J 25 100/250 0.63 260 3100 SDWL1005C39N STFM01 39 G, H, J 25 100/250 0.70 250 3000 SDWL1005C40N STFM01 40 G, H, J 25 100/250 0.70 250 3000 SDWL1005C43N STFM01 43 G, H, J 25 250 3000 SDWL1005C47N STFM01 47 G, H, J 25 100/250 100/200 0.70 1.08 210 2900 SDWL1005C51N STFM01 51 G, H, J 25 100/200 1.08 210 2850 SDWL1005C56N STFM01 56 G, H, J 25 100/200 1.17 200 2800 SDWL1005C62N STFM01 62 G, H, J 20 1.82 145 2600 SDWL1005C68N STFM01 68 G, H, J 20 100/200 100/200 1.96 140 2500 SDWL1005C72N STFM01 72 G, H, J 20 100/150 2.10 135 2500 SDWL1005C75N STFM01 75 G, H, J 20 100/150 2.10 135 2400 SDWL1005C82N STFM01 82 G, H, J 20 100/150 2.24 130 2300 SDWL1005C91N STFM01 91 G, H, J 20 100/150 2.38 125 2100 SDWL1005CR10 STFM01 100 G, H, J 20 100/150 2.52 120 1500 SDWL1005CR12 STFM01 120 G, H, J 20 100/150 2.66 110 1000 Tolerance Quality L/Q Test Max. DC Max. Rated Freq. Resistance Current 2) SDWL1005C STFM11 Series Min. Part Number Inductance Factor Min. Selfresonant Frequency Units nH - MHz Ω mA MHz Symbol L - Q Freq. DCR Ir S.R.F SDWL1005C1N3 STFM11 1.3 C, D 20 100/250 0.017 1200 > 6000 SDWL1005C2N2 STFM11 2.2 C, D 25 100/250 0.027 1000 > 6000 SDWL1005C2N4 STFM11 2.4 C, D 25 100/250 0.027 1000 > 6000 SDWL1005C3N3 STFM11 3.3 C, D 30 100/250 0.040 900 > 6000 SDWL1005C3N4 STFM11 3.4 C, D 30 100/250 0.040 900 > 6000 SDWL1005C3N6 STFM11 3.6 C, D 30 100/250 0.040 900 > 6000 SDWL1005C3N9 STFM11 3.9 C, D 30 100/250 0.040 900 > 6000 SDWL1005C4N7 STFM11 4.7 C, D 30 100/250 0.051 800 > 6000 SDWL1005C5N1 STFM11 5.1 D 30 100/250 0.051 800 > 6000 SDWL1005C5N6 STFM11 5.6 C, D 30 100/250 0.051 800 > 6000 Sunlord Categories: general confidential Wire Wound Chip Ceramic Inductor Page 16 of 16 II. Typical Electrical Characteristics Q vs. Frequency Characteristics Inductance vs. Frequency Characteristics 140 1000 SDWL1005CS3N9 SDWL1005C3N9 STFM01 SDWL1005C47N STFM01 SDWL1005CS47N SDWL1005CR10 STFM01 SDWL1005CSR10 SDWL1005C3N9 STFM01 SDWL1005CS3N9 3.9nH SDWL1005CS47N SDWL1005C47N STFM01 SDWL1005CSR10 SDWL1005CR10 STFM01 120 100nH Inductance (μH) 47nH 80 47nH Q Inductance(nH) 100 100 60 10 3.9nH 40 100nH 20 0 1 10 100 1000 100Frequency(MHz)1000 10000 10 100 Frequency(MHz) 1000 100 1000 Frequency (MHz) Frequency (MHz) Appendix B: Appearance standard File No: Applied to Wire Wound Ceramic Inductor Series Effective date: No. Defect Item Graphic Rejection identification Item Schematic Drawing Criteria Wire off/ 1 Welding Spot Off 2 Solder misplace The solder joint Welding Spot of wire break away from electrodes, or over the electrodes. Solder joints are not at electrode side but at the coating side or flank. Coating side(Non-A region): if B B: Resin starved diameter ; A: electrode region, A=0.32mm 3 Starvation Flank: don’t control. Coating at flank 4 Coating misplace Coating at electrodes side 0.20mm, NG. 10000