TAI-TECH
P1
Wire Wound Type Common Mode Filter
ACM3225F2SF-102T15
ECN HISTORY LIST
REV
DATE
DESCRIPTION
APPROVED
CHECKED
DRAWN
1.0
18/03/21
新發行
楊祥忠
林志鴻
張嘉玲
備
註
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TAI-TECH
P2
Wire Wound Type Common Mode Filter
ACM3225F2SF-102T15
1. Features
1. High common mode impedance at high frequency effects excellent noise
Halogen
Pb
Halogen-free
Pb-free
suppression performance.
2. ACM3225F2SF series realizes small size and low profile 3.2x2.5x2.2 mm
3. 100% Lead(Pb) & Halogen-Free and RoHS compliant.
2. Dimension
A
C
Recommended PC Board Pattern
D
D
B
D
D
Series
A(mm)
B(mm)
C(mm)
D1(mm)
D2(mm)
L(mm)
H(mm)
G1(mm)
G2(mm)
3225F2SF
3.2±0.2
2.5±0.2
2.2±0.2
0.65±0.1
1.0±0.1
4.4
3.5
2.3
0.8
Units: mm
3. Part Numbering
ACM 3225
A
B
F
2
S
F
C
D
E
F
-
102
T
15
G
H
I
A: Series
B: Dimension
C: Material
Ferrite Core
D: Number of Lines
2=2 lines
E: Type
S=Shielded , N=Unshielded
F: Lead free
G: Impedance
102=1000Ω
H: Packaging
T=Taping and Reel
I: Rated Current
15=1500mA
4. Specification
TAI-TECH
Part Number
ACM3225F2SF-102T15
Common mode
Impedance (Ω)
Test
Frequency
(MHz)
1000±25%
100
DC
Rated
Resistance Current
(Ω) max. (mA)max.
Note:
1. Test Frequency:Impedance:100MHz
2. Testing Instrument : L:Agilent-4291A,Agilent-16197A
DCR: Agilent-4338B
3. Operating temperature -40℃ ~ +85℃
4. All test data is referenced to 25℃ ambient.
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0.10
1500
Rated Volt.
(Vdc)max.
IR
(MΩ) min.
60
10
TAI-TECH
P3
ACM3225F2SF-102
10000
Common Mode
IMPEDANCE(Ohm)
1000
100
10
Normal Mode
1
0.1
1
10
100
1000
FREQUENCY(MHz)
5. Schematic Diagram
6. MEASURING CIRCUITS 2LINE
7. Materials
No.
Description
Specification
a.
Upper Plate
Ferrite
b.
Core
Ferrite Core
c
Termination
Tin (Pb Free)
d
Wire
Enameled Copper Wire
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10000
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P4
8. Reliability and Test Condition
Item
Performance
Operating temperature
-40~+85℃ (Including self - temperature rise)
Storage temperature
-40~+85℃ (on board)
Test Condition
Electrical Performance Test
Z(common mode)
DCR
Agilent-4291A+ Agilent -16197A
Refer to standard electrical characteristics list.
I.R.
Temperature Rise Test
Agilent-4338B
Agilent4339
Rated Current < 1A
∆T 20℃Max
1.Applied the allowed DC current.
2.Temperature measured by digital surface thermometer
Rated Current ≧ 1A ∆T 40℃Max
Reliability Test
Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC
J-STD-020DClassification Reflow Profiles)
Temperature:85±2℃
Life Test
Applied current:rated current
Duration:1000±12hrs
Measured at room temperature after placing for 24±2 hrs
Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC
J-STD-020DClassification Reflow Profiles
Humidity:85±2﹪R.H,
Load Humidity
Temperature:85℃±2℃
Duration:1000hrs Min. with 100% rated current
Measured at room temperature after placing for 24±2 hrs
Moisture Resistance
Appearance:No damage.
Inductance:within±10% of initial value
Impedance:within±15% of initial value
RDC:within ±15% of initial value and shall not
exceed the specification value
Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC
J-STD-020DClassification Reflow
Profiles
1. Baked at50℃ for 25hrs, measured at room temperature after
placing for 4 hrs.
2. Raise temperature to 65±2℃ 90-100%RH in 2.5hrs, and
keep 3 hours, cool down to 25℃ in 2.5hrs.
3. Raise temperature to 65±2℃ 90-100%RH in 2.5hrs, and
keep 3 hours, cool down to 25℃ in
2.5hrs,keep at 25℃ for 2 hrs then keep at -10℃ for 3 hrs
4. Keep at 25℃ 80-100%RH for 15min and vibrate at the
frequency of 10 to 55 Hz to 10 Hz, measure at
room temperature after placing for 1~2 hrs.
Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC
J-STD-020DClassification
Reflow Profiles
Condition for 1 cycle
Step1:-40±2℃ 30±5min
Thermal
shock
Step2:25±2℃ ≦0.5min
Step3:85±2℃ 30±5min
Number of cycles: 500
Measured at room temperature after placing for 24±2 hrs
Oscillation Frequency: 10~2K~10Hz for 20 minutes
Equipment: Vibration checker
Total Amplitude:1.52mm±10%
Testing Time : 12 hours(20 minutes, 12 cycles each of 3
orientations)。
Vibration
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Item
P5
Performance
Bending
Shock
Solder ability
Appearance:No damage.
Impedance:within±15% of initial value
Inductance:within±10% of initial value
Q:Shall not exceed the specification value.
RDC:within ±15% of initial value and shall not
exceed the specification value
More than 95% of the terminal electrode should
be covered with solder。
Test Condition
Shall be mounted on a FR4 substrate of the
following dimensions: >=0805 inch(2012mm):40x100x1.2mm
=0805 inch(2012mm):1.2mm
0805:1kg ,
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