UAD8A05L02

UAD8A05L02 ElectroStatic Discharged Protection Devices (ESD) Data Sheet Description The UAD8A05L02 is designed to protect sensitive electronic from damage or latch-up due to ESD. It is designed to replace multilayer viristors (MLVs) in portable applications such as cell phone, note-book computers and other portable electronics. It features large cross-sectional area junctions for conducting high transient currents. The device may be used to meet the immunity requirements of IEC61000-4-2, level 4. Features ● ● ● ● ● ● ● ● ● IEC61000-4-2 ESD 15KV Air, 8KV contact compliance DFN1006-3L surface mount package Working voltage: 5V Low leakage current Low operating and clamping voltages Lead Free/RoHS compliant Flammability rating UL 94V-0 Meets MSL level 1, per J-STD-020 Marking: 5U 1 3 2 Applications Pin Configuration ● ● ● ● ● ● ● ● USB 3.0/USB 2.0 MHL/MIPI/MDDI HDMI, Video Port, eSATA Set Top Boxes, Game Consoles Smart Phones External Storage Ultrabooks, Notebooks Tablets, eReaders Maximum Ratings Rating Peak pulse current (tp=8/20μs) Symbol Value Unit IPP 2.5 A ESD voltage (Contact discharge) ±8 VESD ESD voltage (Air discharge) Storage & operating temperature range Revision:ESD-UAD8A05L02-001(A1) kV ±15 TSTG ,TJ 1/4 -55~+150 ℃ http://brightking.pulseelectronics.com UAD8A05L02 Electrical Characteristics (TJ=25℃) Parameter Symbol Reverse stand-off voltage Condition Min. Typ. VRWM Reverse breakdown voltage Unit 5 V 8.5 V 0.5 μA VBR IBR=1mA Reverse leakage current IR VR=5V Clamping voltage (tp=8/20μs) VC IPP=1A 11 V Clamping voltage (tp=8/20μs) VC IPP=2A 14 V 0Vdc,f=1MHz Pin1/2 to Pin3 0.75 pF 0Vdc,f=1MHz Pin1 to Pin2 0.5 pF Off state junction capacitance CJ 6 Max. Typical Characteristics Curves Figure 1. Pulse Waveform tr 20 Peak value Ipp Waveform Parameters: tr=8µs td=20µs 90 80 18 Clamping Voltage (V) % of Peak Power Current 110 100 Figure 2. Clamping Voltage vs. Peak Pulse Current 70 60 50 40 td=t|PP/2 30 20 16 14 12 10 8 6 2 10 0 0 Waveform Parameters: tr=8µs tb=20µs 4 0 5 10 15 20 25 30 0 0.5 1 1.5 2 2.5 3 IPP-Peak Pulse Current (A) Time (μs) Figure 3. Capacitance vs. Reverse Voltage Figure 4. ESD Clamping (8kV Contact IEC61000-4-2) 2.5 Junction Capacitance (pF) F=1MHz 2 1.5 1 0.5 0 0 1 2 3 4 5 Reverse Voltage (V) Revision:ESD-UAD8A05L02-001(A1) 2/4 http://brightking.pulseelectronics.com UAD8A05L02 Recommended Soldering Conditions Reflow Soldering Critical Zone TL to TP tP TP Ramp-up TL tL Temperature TS max TS min Ramp-down tS Preheat 25 t 25℃ to Peak Time Recommended Conditions Profile Feature Pb-Free Assembly Average ramp-up rate (TL to TP) 3℃/second max. Preheat -Temperature Min (TS min) -Temperature Max (TS max) -Time (min to max) (ts) 150℃ 200℃ 60-180 seconds TS max to TL -Ramp-up Rate 3℃/second max. Time maintained above: -Temperature (TL) -Time (tL) 217℃ 60-150 seconds Peak Temperature (TP) 260℃ Time within 5℃ of actual Peak Temperature (tP) Ramp-down Rate 6℃/second max. Time 25℃ to Peak Temperature Revision:ESD-UAD8A05L02-001(A1) 20-40 seconds 8 minutes max. 3/4 http://brightking.pulseelectronics.com UAD8A05L02 Dimensions (DFN1006-3L) Dimension (mm) Symbol A Millimeters Min. Max. Min. Max. A 0.33 0.39 0.013 0.015 B1 0.10 0.20 0.004 0.008 B2 0.45 0.55 0.018 0.022 D 0.85 1.15 0.033 0.045 E 0.45 0.75 0.018 0.030 Side View D B1 E B2 F Top View F L2 L3 L1 Inches 0.35Typ. 0.014Typ. L1 0.20 0.30 0.20 0.30 L2 0.21 0.31 0.21 0.31 L3 0.39Typ. 0.015Typ. Packaging Tape P0 P1 P2 K B W F E øD0 øD1 t A Symbol Dimension (mm) W 8.00±0.30 P0 4.00±0.10 P1 2.00±0.10 P2 2.00±0.10 D0 Φ1.55±0.10 D1 Φ0.50±0.05 E 1.75±0.10 F 3.50±0.10 A 0.71±0.10 B 1.11±0.10 K 0.48±0.05 t 0.20±0.05 D Φ178.0±2.0 D2 Φ13.00. W1 9.50 Reel D2 D Revision:ESD-UAD8A05L02-001(A1) W1 4/4 Quantity: 10000PCS http://brightking.pulseelectronics.com