BRCS3400MC

BRCS3400MC Rev. F Dec.-2019 DATA SHEET 描述 / Descriptions SOT23-3 塑封封装 N 道 MOS 场效应管。N- CHANNEL MOSFET in a SOT23-3 Plastic Package. 特征 / Features VDS (V) = 30V ID = 5.8 A (VGS = 10V) RDS(ON) < 32mΩ (VGS = 10V) RDS(ON) < 36mΩ (VGS = 4.5V) RDS(ON) < 56mΩ (VGS = 2.5V) 无卤产品。HF Product. 用途 / Applications 适用于作负载开关或脉宽调制应用。 This device is suitable for use as a load switch or in PWM applications. 内部等效电路 / Equivalent Circuit 引脚排列 / Pinning 3 1 2 PIN1：G PIN 2： S PIN 3：D 印章代码 / Marking Marking http://www.fsbrec.com A0H 1/7 BRCS3400MC Rev. F Dec.-2019 极限参数 / DATA SHEET Absolute Maximum Ratings(Ta=25℃) 参数 Parameter Drain-Source Voltage 符号 Symbol VDS 数值 Rating 30 单位 Unit V Drain Current – Continuous ID 5.8 A Drain Current- Continuous ID(Ta=70℃) 4.9 A Pulsed Drain Current IDM 30 A Gate-Source Voltage VGS ±12 V Total Power Dissipation PD 1.4 W PD(Ta=70℃) 1.0 W TJ, TSTG -55 to 150 ℃ Total Power Dissipation Operating and Storage Junction Temperature Range 电性能参数 / Electrical Characteristics(Ta=25℃) 参数 Parameter Drain–Source Breakdown Voltage 符号 Symbol BVDSS 测试条件 Test Conditions VGS=0V ID=250μA 最小值 典型值 Min Typ 30 最大值 Max 单位 Unit V VGS=0V VGS=0V μA IDSS VDS=24V VDS=24V TJ=55℃ 1 Zero Gate Voltage Drain Current 5 μA Gate–Body Leakage. IGSS VGS=±12V VDS=0V ±0.1 μA On–State Drain Current ID(on) VGS=4.5V VDS=5V Gate Threshold Voltage VGS(th) VDS=VGS ID=250μA RDS(on)(1) RDS(on)(3) VGS=10V VGS=10V TJ=125℃ VGS=4.5V RDS(on)(4) Static Drain–Source On–Resistance Forward Transconductance Drain–Source Diode Forward Voltage Input Capacitance 30 1.1 1.45 ID=5.8A ID=5.8A 29 32 ID=5A 32 36 VGS=2.5V ID=4A 40 56 gFS VDS=5V ID=5A VSD VGS=0V IS=1A VDS=15V f=1MHz VGS=0V RDS(on)(2) Ciss 0.65 A 39 10 15 0.77 1 823 1030 Coss Reverse Transfer Capacitance Crss 77 Turn–On Delay Time td(on) 3.3 5 Turn–On Rise Time tr 4.8 7 Turn–Off Delay Time td(off) 26.3 40 4.1 6 Turn–Off Fall Time http://www.fsbrec.com tf RL=2.7Ω RGEN=3Ω mΩ S Output Capacitance VGS=10V VDS=15V V 99 V pF 2/7 ns BRCS3400MC Rev. F Dec.-2019 DATA SHEET 电性能参数 / Electrical Characteristics(Ta=25℃) 参数 Parameter Input Capacitance 符号 Symbol Ciss Output Capacitance Coss Reverse Transfer Capacitance Crss Gate resistance Rg Total Gate Charge Qg 测试条件 Test Conditions VDS=15V f=1MHz VGS=0V 最小值 典型值 Min Typ 823 最大值 Max 1030 99 pF 77 VGS=0V f=1MHz VDS=0V, VGS=4.5V, ID=5.8A VDS=15V, 1.2 3.6 9.7 12 Gate Source Charge Qgs Gate Drain Charge Qgd 3.1 Turn–On Delay Time td(on) 3.3 5 Turn–On Rise Time tr 4.8 7 Turn–Off Delay Time td(off) 26.3 40 4.1 6 Turn–Off Fall Time Body Diode Reverse Recovery Time Body Diode Reverse Recovery Charge http://www.fsbrec.com 单位 Unit VGS=10V VDS=15V RL=2.7Ω RGEN=3Ω tf 1.6 Ω nC ns trr IF=5A dI/dt=100A/μs 16 20 ns Qrr IF=5A dI/dt=100A/μs 8.9 12 nC 3/7 BRCS3400MC Rev. F Dec.-2019 DATA SHEET 电参数曲线图 / Electrical Characteristic Curve http://www.fsbrec.com 4/7 BRCS3400MC Rev. F Dec.-2019 DATA SHEET 外形尺寸图 / Package Dimensions http://www.fsbrec.com 5/7 BRCS3400MC Rev. F Dec.-2019 DATA SHEET 印章说明 / Marking Instructions A0H 说明： A0： 为型号代码 H： 为公司代码 Note: A0: Product Type Code. H: Company Code. http://www.fsbrec.com 6/7 BRCS3400MC Rev. F Dec.-2019 DATA SHEET 回流焊温度曲线图(无铅) / Temperature Profile for IR Reflow Soldering(Pb-Free) 说明： Note: 1、预热温度 150～180℃，时间 60～90sec; 1.Preheating:150~180℃, Time:60~90sec. 2、峰值温度 245±5℃，时间持续为 5±0.5sec; 2.Peak Temp.:245±5℃, Duration:5±0.5sec. 3、焊接制程冷却速度为 2～10℃/sec. 3. Cooling Speed: 2~10℃/sec. 耐焊接热试验条件 / Resistance to Soldering Heat Test Conditions 温度：260±5℃ 时间：10±1 sec. Temp.:260±5℃ Time:10±1 sec 包装规格 / Packaging SPEC. 卷盘包装 / REEL Package Type 封装形式 SOT-23-3 Dimension 包装尺寸 (unit：mm3) Units 包装数量 Units/Reel 只/卷盘 Reels/Inner Box 卷盘/盒 Units/Inner Box 只/盒 Inner Boxes/Outer Box 盒/箱 Units/Outer Box 只/箱 Reel Inner Box 盒 Outer Box 箱 3,000 10 30,000 4 120,000 7〞×8 210×205×205 445×230×435 使用说明 / Notices http://www.fsbrec.com 7/7