DM1AA-SF-PEJ(21)

DM1_E_6P_210108_02追加.qxd 21.1.8 16:24 ページ 1 SD Memory Card Connectors DM1 Series Withstands higher force of card insertion. Card Oct.1.2022 Copyright 2022 HIROSE ELECTRIC CO., LTD. All Rights Reserved. Standard type Metal cover extends over the back of the connector. ■Features 1. Withstands higher force of card insertion Card Metal cover extends over the back of the connector allowing it to withstand force of up to 400N (static load) when dropped or accidentally hit. (Fig.1) 2. No damage to the card when accidentally pulled-out The connectors will release the card when a moderate pull-out force of about 4N is applied. There will be no damage to the lock components and all connector functions will not be affected. (Fig.2) Reverse type Metal cover extends over the back of the connector. Fig.1 No damage to the card when accidentally pulled-out. 3. Accidental card fall-out prevention Built-in lock feature holds the card securely in place. (Fig.3) 4. Reliable Card Insertion and Withdrawal Built-in Push-in / Push-out ejection mechanism assures simple and reliable card insertion and withdrawal. 5. Designed to accept Secure Digital I/O card (Built-in Ground Contact) The connector allows use of various expansion modules, including the Bluetooth communication modules. Fig.2 Accidental card fall-out prevention Fig.3 2021.2② 1 DM1_E_6P_210108_02追加.qxd 21.1.8 16:24 ページ 2 DM1 Series●SD Memory Card Connectors ■Product Specifications Rating Current rating 0.5A DC Voltage rating 125V AC Oct.1.2022 Copyright 2022 HIROSE ELECTRIC CO., LTD. All Rights Reserved. Item Operating temperature range : -25ç to +85ç (Note 1) Operating humidity range : Relative humidity 95% max. (No condensation) Storage temperature range : -40ç to +85ç (Note 2) Specification Conditions 1. Insulation resistance 2. Withstanding voltage 3. Contact resistance 4. Vibration 1000Mø min. (Initial value) No flashover or insulation breakdown 100mø max. (Initial value) No electrical discontinuity of 100ns or more 500V DC 500V AC / one minute 100mA DC Frequency : 10 to 55Hz, single amplitude of 0.75mm, 2 hours / 3 axis 5. Humidity Contact resistance : 40mø max. from initial value Insulation resistance : 100Mø min. 96 hours at temperature of 40ç ± 2ç and humidity of 90% to 95% 6. Temperature cycle Contact resistance : 40mø max. from initial value Insulation resistance : 100Mø min. Temperature : -55ç/ +5ç to +35ç/ +85ç/ +5ç to +35ç Duration : 30 / 5 / 30 / 5 (Minutes) 5 cycles 7. Durability (mating/un-mating) Contact resistance : 40mø max. from initial value 10000 cycles at 400 to 600 cycles per hour 8. Resistance to soldering heat No deformation of components affecting performance. Reflow : At the recommended temperature profile Manual soldering : 350ç for 3 seconds Note1 : Includes temperature rise caused by current flow. Note2 : The term "storage" refers to products stored for long period of time prior to mounting and use. Operating Temperature Range and Humidity range covers non- conducting condition of installed connectors in storage, shipment or during transportation. ■Materials / Finish Component Insulator Material Heat resistant thermoplastic compound Finish Color : Black Contact area : Gold plating Termination area : Tinned copper plating Remarks UL94V-0 Contacts Phosphor bronze Cover Stainless steel Termination area : Tinned copper plating -------------------- Others Stainless steel Piano wire -------------------Nickel plating -------------------- ■Product Number Structure Refer to the chart below when determining the product specifications from the product number. Please select from the product numbers listed in this catalog when placing orders. DM1 AA - SF - PEJ 1 1 Series name 2 Connector type 2 2 : DM1 : AA : Standard receptacle : B : Reverse receptacle 3 4 3 Terminal type SF : Right angle surface mount DSF : Reverse right angle surface mount 4 Eject mechanism codes PEJ : Card Push insert/Push withdraw -------------------- DM1_E_6P_210108_02追加.qxd 21.1.8 16:24 ページ 3 DM1 Series●SD Memory Card Connectors ■Standard type BPCB mounting pattern 1.7±0.05 P=2.5±0.05 1.35±0.05 2±0.05 4.125±0.05 9-1.1±0.05 2 +0.1 0 DM1AA-SF-PEJ(82) 609-0004-8 82 23.2±0.05 4.55±0.05 4-2 +0.1 0 3 2-Ø 1. 3-1 +0.1 0 2 Card detection switch +0 0 .1 1.6±0.05 20.75±0.05 18.15±0.05 9.2±0.05 HRS No. 2 Write protection switch 2 +0.1 0 1.2±0.05 C L 1 1 1 28 13.2 9.75 8.05 t=0.2,W=0.6 P2.5 No.6 No.7 No.1 2.5 5.625 No.4 No.2 No.3 No.5 2.9 15 No.8 3-0.5 23.2 4.55 18.15 20.75 9.2 No.9 4-1.5 30.5 1 1 C L C L C Lindicates the center line of card slot. 1 24.15 (Card slot dimension) 0.55 1 1 C L Card detection switch Write protection switch When card is inserted When card is When card When card is No yet inserted is inserted No yet inserted WRITE PROTECT WRITE ENABLE 2-Ø1.2 OPEN 22.4 CLOSE OPEN OPEN CLOSE Weight:2.2g 5 11 6 1 BCard insertion/withdrawal dimensions 5 Oct.1.2022 Copyright 2022 HIROSE ELECTRIC CO., LTD. All Rights Reserved. Part No. 1.2±0.05 2 +0.1 0 25.4±0.05 22.4±0.05 15±0.05 SD Card Card pushed-in for insertion SD Card Card fully inserted SD Card Card ejected (Card ejected dimension) 3 DM1_E_6P_210108_02追加.qxd 21.1.8 16:24 ページ 4 DM1 Series●SD Memory Card Connectors ■Reverse type BPCB mounting pattern 9.47±0.05 12.8±0.05 11.2±0.05 9.75±0.05 28.5±0.05 23.48±0.05 26.98±0.05 1.4±0.05 B Center of Card dimension +0.1 (Through 0 1.5 (Land) +0.1 -0.1 1.9 1.2 +0.1 (Land) 0 0.8 +0.1 (Through 0 hole) 1.2 +0.1 (Land) 0 0.8 +0.1 (Through 0 hole) +0.1 (Through 0 hole) hole) C(5:1) (R0 .6) 1.2 +0.1 (Land) 0 0.8 +0.1 (Through 0 (R0 .6) .6) .4) .4) (R0 2 WP 11.93±0.05 B(5:1) hole) +0.1 (Through 0 1.3 0.8±0.05 1.05±0.05 14.13±0.05 .4) 2 2 2.03±0.05 11.23±0.05 C (R0 8.63 5.62 3 (R0 18.68 16.85 2 6.95 7.65 2 5.62 C L 1 6-0.65 2 A 14.25±0.05 A(5:1) +0.1 (Land) 0 A 8-1.1±0.05 12.57±0.05 3 1.7 COMMON FOR CD & WP 2 609-0003-5 92 1.4±0.05 CARD DETECT 1.25±0.05 +0.1 -0.1 (Land) DM1B-DSF-PEJ(92) 0.8±0.05 5.625±0.05 2.4 HRS No. 28.25±0.05 Part No. 12.5±0.05 P=2.5±0.05 (R0 Oct.1.2022 Copyright 2022 HIROSE ELECTRIC CO., LTD. All Rights Reserved. 11-2.5±0.05 8.05±0.05 28 No.7 (14.35) No.5 No.4 No.3 No.2 No.1 1.05 No.9 0.35 2 27.2 27.45 (1.77) 2 29 2 (5):Card pushed for insertion (6):Card fully inserted 29.9 10:Card ejected(Card ejected dimension) 2 1.5 2.9 2 1.85 No.8 C L 1 No.6 1 C L (0.25) SD Card 1 2 C Lindicates the center line of the card slot. indicates the dimension of DIP terminals. Card detection switch When card is When card not yet inserted is inserted 1 C L OPEN Weight:2.1g 4 CLOSE Write protection switch When card is inserted When card is not yet inserted WRITE PROTECT WRITE ENABLE OPEN OPEN CLOSE hole) DM1_E_6P_210108_02追加.qxd 21.1.8 16:24 ページ 5 DM1 Series●SD Memory Card Connectors BPackaging specifications .5 Ø1 4.35±0.3 3.4±0.3 36±0.1 4±0.1 2±0.15 44±0.3 Unreeling direction 4±0.1 36±0.1 4.6±0.3 3.4±0.3 2±0.15 44±0.3 40.4±0.1 20.2±0.1 .1 +0 0 1.75±0.1 ●Embossed Carrier Tape Dimensions(Reverse type) 450 pcs/reel .5 Ø1 Unreeling direction ●Reel dimensions 44.4 +2 0 Unreeling direction End section Blank section(160mm min.) Mounting section(450) (Ø380) D (Ø150) Oct.1.2022 Copyright 2022 HIROSE ELECTRIC CO., LTD. All Rights Reserved. 40.4±0.1 20.2±0.1 .1 +0 0 1.75±0.1 ●Embossed Carrier Tape Dimensions (Standard type) 450 pcs/reel Lead section (400mm min.) Embossed carrier tape Blank section (100mm min.) Top cover tape 5 DM1_E_6P_210108_02追加.qxd 21.1.8 16:24 ページ 6 DM1 Series●SD Memory Card Connectors BRecommended Temperature Profile (ç) Peak : 250ç MAX 250 230ç min. 50 seconds Temperature 200 200ç 150 100 Soldering 150ç 90 to 120 seconds Preheating Oct.1.2022 Copyright 2022 HIROSE ELECTRIC CO., LTD. All Rights Reserved. 50 Time (Seconds) ® 6 HRS test condition Solder method : Reflow, IR/hot air Environment : Room air Solder composition : Paste, 96.5%Sn/3.0%Ag/0.5%Cu (Senju Metal Industry, Co., Ltd.'s Part Number:M705-GRN360-K2-V) Test board : Glass epoxy 60mm∞100mm∞1.0mm thick Metal mask : 0.15mm thick Number of reflow cycles : 2cycles max. The temperature profiles shown are based on the above conditions. In individual applications the actual temperature may vary, depending on solder paste type, volume / thickness and board size / thickness. Consult your solder paste and equipment manufacturer for specific recommendations. 2-6-3,Nakagawa Chuoh,Tsuzuki-Ku,Yokohama-Shi 224-8540,JAPAN TEL: +81-45-620-3526 Fax: +81-45-591-3726 http://www.hirose.com http://www.hirose-connectors.com The characteristics and the specifications contained herein are for reference purpose. Please refer to the latest customer drawings prior to use. The contents of this catalog are current as of date of 02/2021. Contents are subject to change without notice for the purpose of improvements.