RB551V-30

RB551V-30-HAF Silicon Epitaxial Planar Schottky Barrier Diode PINNING DESCRIPTION PIN Features • Small surface mounting type • Ultra low forward voltage • High reliability • Halogen and Antimony Free(HAF), RoHS compliant 1 Cathode 2 Anode 2 1 Top View Simplified outline SOD-323 and symbol Applications • High frequency rectification switching regulation Absolute Maximum Ratings (Ta = 25℃) Parameter Symbol Value Unit Peak Reverse Voltage VRM 30 V DC Reverse Voltage VR 20 V Average Rectified Forward Current IF(AV) 0.5 A Peak Forward Surge Current (8.3 ms) IFSM 2 A Tj 125 ℃ Tstg - 40 to + 125 ℃ Symbol Value Unit RθJA 400 ℃/W Symbol Max. Unit Forward Voltage at IF = 100 mA at IF = 500 mA VF 0.36 0.47 V Reverse Current at VR = 20 V IR 100 µA Junction Temperature Storage Temperature Range Thermal Characteristics Parameter Typical Thermal Resistance from Junction to Ambient 1) 1) Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout. Characteristics at Ta = 25℃ Parameter 1/3 ® Dated : 24/04/2023 Rev: 03 RB551V-30-HAF Fig 1. Forward Current Derating Curve Fig 2. Forward Characteristic Curve 0.6 0.5 Forward Current (mA) Average Rectified Forward Current (A) Electrical Characteristic Curves 0.4 0.3 0.2 0.1 0 0 25 50 75 100 125 150 Forward Voltage (V) Ambient Temperature (℃) Fig 4. Junction Capacitance Reverse Current (mA) Junction Capacitance (pF) Fig 3. Reverse Characteristic Curve Reverse Voltage (V) Reverse Voltage (V) 2/3 ® Dated : 24/04/2023 Rev: 03 RB551V-30-HAF PACKAGE OUTLINE Plastic surface mounted package; 2 leads SOD-323 A c HE A D E bp UNIT A bp C D E HE mm 1.10 0.80 0.40 0.25 0.15 0.10 1.80 1.60 1.35 1.15 2.80 2.30 Recommended Soldering Footprint Packing information Package SOD-323 Tape Width (mm) 8 Pitch Reel Size Per Reel Packing Quantity mm inch mm inch 4 ± 0.1 0.157 ± 0.004 178 7 3,000 Marking information " SA " = Part No. " III " = Cathode line " • " = HAF (Halogen and Antimony Free) Font type: Arial . SA 3/3 ® Dated : 24/04/2023 Rev: 03